The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Host Data Transfer Rate-Max | Host Interface Standard | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No XCZU9CG-2SFVC784E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||||||||||||||||||||
![]() | Mfr Part No TMPZ84C42AP-6 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 6.144 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 10 mA | 4.8 mm | 1 | NO | NO | 8 | 0 | 2 | Z80 | 0.09765625 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | NRZ | 50.7 mm | 15.24 mm | ||||||||||
![]() | Mfr Part No TXC-06840AIOG | Tri-Star Electronics International | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S82434NXSZ928 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | INTEL CORP | PLASTIC/EPOXY | QFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6EG-1LFFVB1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||||||||||||||||||||||||
![]() | Mfr Part No MC2674B4P | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | COMMERCIAL | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST58SD016-70-C-P1H | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | SILICON STORAGE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 5.8 mm | 16 | 1.4 MBps | ATA | 42.6 mm | 15.24 mm | |||||||||||||||||||
![]() | Mfr Part No FLI8120 | Genesis Microchip | Datasheet | - | - | Min: 1 Mult: 1 | GENESIS MICROCHIP | Transferred | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ASM3P2579A-06OR | Pulsecore Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | PULSECORE SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | VSSOP | TSOT-23, 6 PIN | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Transferred | No | 2.625 V | 2.375 V | 2.5 V | ALSO OPERATES AT 3.3V SUPPLY | DUAL | GULL WING | NOT SPECIFIED | 0.95 mm | unknown | NOT SPECIFIED | R-PDSO-G6 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1 mm | 30 MHz | 30 MHz | 2.9 mm | 1.6 mm | |||||||||||||||||||||||
![]() | Mfr Part No XCZU3CG-2LSFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | ADVANCED MICRO DEVICES INC | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No MB86950BPF-G | FUJITSU Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | FUJITSU LTD | 70 °C | PLASTIC/EPOXY | QFF | QFF, QFL80,.55X.8,32 | QFL80,.55X.8,32 | RECTANGULAR | FLATPACK | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | FLAT | 0.8 mm | unknown | R-PQFP-F80 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 40 mA | NO | ASYNC, BIT | ||||||||||||||||||||||||
![]() | Mfr Part No BCM58201A0KFBG05 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No STP2202ABGA | Sun Microsystems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 320 | SUN MICROSYSTEMS INC | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA320,20X20 | BGA320,20X20 | SQUARE | GRID ARRAY | Obsolete | BGA | 3.465 V | 3.135 V | 3.3 V | 8542.31.00.01 | BOTTOM | BALL | 1.5 mm | unknown | 320 | S-PBGA-B320 | Not Qualified | MICROPROCESSOR CIRCUIT | 758 mA | 2.68 mm | 35 mm | 35 mm | |||||||||||||||||||||||||
![]() | Mfr Part No XCZU3CG-2LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||||||||
![]() | Mfr Part No TDA8002G/5/C2 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | NXP SEMICONDUCTORS | 85 °C | -25 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 6.5 V | 4.5 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 32 | S-PQFP-G32 | Not Qualified | OTHER | MICROPROCESSOR CIRCUIT | 1.6 mm | 5 mm | 5 mm | |||||||||||||||||||||||||
![]() | Mfr Part No 5962-8501501XA | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 MHz | INTERSIL CORP | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | , | IN-LINE | Obsolete | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | unknown | Not Qualified | MILITARY | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 2 | NO | YES | 8 | 1 | 80C86; 80C88 | 0.125 MBps | ASYNC, BIT | NRZ | |||||||||||||||||||||||
![]() | Mfr Part No 5962-8501501XA | Harris Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 16 MHz | HARRIS SEMICONDUCTOR | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | , | RECTANGULAR | IN-LINE | Obsolete | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | unknown | R-GDIP-T28 | Not Qualified | MILITARY | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 3 mA | 2 | NO | YES | 8 | 0 | 1 | 80C86; 80C88 | 0.125 MBps | ASYNC, BIT | NRZ | |||||||||||||||||
![]() | Mfr Part No R6545EAP | Rockwell Automation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R6545EAP | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 2 MHz | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | DISPLAY CONTROLLER, CRT CHARACTER DISPLAY | 133 mA | 5.08 mm | 1 | 8 | 51.8 mm | 15.24 mm | ||||||||||||||||||
![]() | Mfr Part No SDIO101AIHR | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 60 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | 1.95 V | 1.65 V | 1.8 V | 8542.31.00.01 | QUAD | NO LEAD | 0.5 mm | unknown | S-PQCC-N60 | INDUSTRIAL | MICROPROCESSOR CIRCUIT | 0.5 mm | 5 mm | 5 mm |
XCZU9CG-2SFVC784E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TMPZ84C42AP-6
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TXC-06840AIOG
Tri-Star Electronics International
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
S82434NXSZ928
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6EG-1LFFVB1156I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MC2674B4P
Freescale Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SST58SD016-70-C-P1H
Silicon Storage Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
FLI8120
Genesis Microchip
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ASM3P2579A-06OR
Pulsecore Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU3CG-2LSFVA625I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MB86950BPF-G
FUJITSU Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM58201A0KFBG05
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
STP2202ABGA
Sun Microsystems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU3CG-2LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TDA8002G/5/C2
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
5962-8501501XA
Intersil Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
5962-8501501XA
Harris Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
R6545EAP
Rockwell Automation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
R6545EAP
Conexant Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SDIO101AIHR
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
