The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | JESD-609 Code | Part Status | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Interface | Number of Ports | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Program Memory Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Number of DMA Channels | Communication Protocol | Data Encoding/Decoding Method | Controller Series | Display Configuration | Length | Width |
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![]() | Mfr Part No S82374SB | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 33 MHz | INTEL CORP | PLASTIC/EPOXY | FQFP | QFP-208 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 5 V | 3A991.A.2 | SMM POWER MANAGEMENT | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 208 | S-PQFP-G208 | Not Qualified | BUS CONTROLLER, EISA | 3.75 mm | PCI | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M35043-001SP | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | MITSUBISHI ELECTRIC CORP | 85 °C | -20 °C | PLASTIC/EPOXY | SDIP | SDIP, | RECTANGULAR | IN-LINE, SHRINK PITCH | Transferred | DIP | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 1.778 mm | unknown | 20 | R-PDIP-T20 | Not Qualified | OTHER | DISPLAY CONTROLLER, CRT CHARACTER DISPLAY | 50 mA | 4.5 mm | 1 | 24 X 12 CHARACTERS | 19 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ZPSD813F2-15J | Waferscale Integration Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 52 | 25 MHz | WAFERSCALE INTEGRATION INC | 27 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LDCC-52 | SQUARE | CHIP CARRIER | Obsolete | 5.5 V | 4.5 V | 5 V | QUAD | J BEND | unknown | S-PQCC-J52 | Not Qualified | COMMERCIAL | 4 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 16 | 19.1 mm | 19.1 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU4CG-1LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM5628A1KTB | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S1D13706F00A100 | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMS9902AJDL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | TEXAS INSTRUMENTS INC | 70 °C | CERAMIC | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T18 | Not Qualified | COMMERCIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MEC1723N-B0-I/LJ-TR | Microchip Technology | Datasheet | 799999 |
| Min: 1 Mult: 1 | Surface Mount | 176-WFBGA | 176-WFBGA (10x10) | 155 | -40°C ~ 85°C (TA) | Tape & Reel (TR) | Active | Keyboard and Embedded Controller | 1.17V ~ 1.89V, 3.135V ~ 3.465V | ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI, UART | 416K x 8 | ARM? Cortex?-M4F | OTP (512kB) | MEC172x | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN5010-300BG564-SCP | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 564 | MARVELL SEMICONDUCTOR INC | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 8542.31.00.01 | BOTTOM | BALL | compliant | S-PBGA-B564 | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN5010-300BG564-SCP | Cavium Networks | Datasheet | - | - | Min: 1 Mult: 1 | YES | 564 | CAVIUM NETWORKS | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B564 | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 21142-PA | Digital Equipment Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 33.33 MHz | DIGITAL EQUIPMENT CORP | 70 °C | PLASTIC/EPOXY | QFP | , | SQUARE | FLATPACK | Obsolete | 5.25 V | 3 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | unknown | S-PQFP-G144 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 200 mA | 32 | YES | YES | 32 | 0 | 3 | PCI | 12.5 MBps | 1 | ASYNC, BIT; ETHERNET | NRZ | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-L1SFVA625I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA625,25X25,32 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.742 V | 0.698 V | 0.72 V | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SED1330F | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 60 | SEIKO EPSON CORP | 70 °C | -20 °C | PLASTIC/EPOXY | QFP | QFP, QFP60,.77X1.0,40 | QFP60,.77X1.0,40 | RECTANGULAR | FLATPACK | Active | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 1 mm | unknown | R-PQFP-G60 | Not Qualified | COMMERCIAL | 12 mA | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MD82C85 | Thomson Consumer Electronics | Datasheet | - | - | Min: 1 Mult: 1 | THOMSON CONSUMER ELECTRONICS | , | Obsolete | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFD019R31C2I2V | Altera Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TIM9904ANL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5.5 V | 4.5 V | 5 V | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T20 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 85 mA | 12 MHz | 16 MHz | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CL-GD5462 | Cirrus Logic | Datasheet | - | - | Min: 1 Mult: 1 | CIRRUS LOGIC INC | Active | No | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSB12LV32 | Texas Instruments | Datasheet | 6 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-1SFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-1SFVC784E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm |
S82374SB
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
M35043-001SP
Mitsubishi Electric
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ZPSD813F2-15J
Waferscale Integration Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU4CG-1LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM5628A1KTB
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
S1D13706F00A100
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TMS9902AJDL
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MEC1723N-B0-I/LJ-TR
Microchip Technology
Package:Embedded - Microcontrollers - Application Specific
6.890980
CN5010-300BG564-SCP
Marvell Technology Group Ltd
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CN5010-300BG564-SCP
Cavium Networks
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
21142-PA
Digital Equipment Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-L1SFVA625I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SED1330F
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MD82C85
Thomson Consumer Electronics
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
AGFD019R31C2I2V
Altera Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TIM9904ANL
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
CL-GD5462
Cirrus Logic
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TSB12LV32
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-1SFVC784E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-1SFVC784E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
