The category is 'Embedded - Microprocessors'
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- ECCN Code
- Terminal Pitch
- Terminal Position
- HTS Code
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- Address Bus Width
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- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Clock Frequency-Max | Data Bus Width (bit) | ECCN (US) | Family Name | HTS | I2C | I2S | Ihs Manufacturer | Instruction Set Architecture | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Power Dissipation (mW) | Maximum Speed (MHz) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Mounting | Multiply Accumulate | Operating Temperature (Max.) | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PCB changed | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Standard Package Name | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage (V) | UART | USART | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Voltage | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Supply Current-Max | Bit Size | Access Time | Data Bus Width | Seated Height-Max | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Number of External Interrupts | Barrel Shifter | SPI | CAN | Total Dose | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No TS68882MRB/C20 | Thomson Electron Tubes & Devices Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | 20 MHz | THOMSON ELECTRON TUBES & DEVICES CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Transferred | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-CPGA-P68 | Not Qualified | MILITARY | MATH PROCESSOR, COPROCESSOR | 4.184 mm | 5 | NO | MIL-STD-883 Class B | 32 | YES | 26.92 mm | 26.92 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TS68882MRB/C20 | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | 20 MHz | TELEDYNE E2V (UK) LTD | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Obsolete | PGA | No | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 68 | S-CPGA-P68 | Not Qualified | MILITARY | MATH PROCESSOR, COPROCESSOR | 136 mA | 4.82 mm | 5 | NO | MIL-STD-883 Class B; MIL-PRF-38535 | 32 | YES | 26.92 mm | 26.92 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TS68882MR25 | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | 25 MHz | E2V TECHNOLOGIES PLC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Obsolete | PGA | No | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 68 | S-CPGA-P68 | Not Qualified | MILITARY | MATH PROCESSOR, COPROCESSOR | 136 mA | 4.184 mm | 5 | NO | MIL-STD-883 Class B | 32 | 26.92 mm | 26.92 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 68882-20/BYCJC | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 20 MHz | MOTOROLA INC | 125 °C | -55 °C | CERAMIC | QFP | QFP, QFP68,1.1SQ,50 | QFP68,1.1SQ,50 | SQUARE | FLATPACK | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 1.27 mm | unknown | S-XQFP-G68 | Not Qualified | MILITARY | MATH PROCESSOR, FLOATING POINT ACCELERATOR | 150 mA | 5 | NO | 38535Q/M;38534H;883B | 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LUPXA255A0E300 | MARVELL | Datasheet | 167 | - | Min: 1 Mult: 1 | YES | 256 | 3.6864 MHz | INTEL CORP | Intel Corporation | LUPXA255A0E300 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, BGA-256 | SQUARE | GRID ARRAY | Obsolete | BGA | 40 | 5.82 | Yes | 1.43 V | 1.045 V | 1.1 V | e1 | 3A001.A.2.C | TIN SILVER COPPER | 8542.31.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 256 | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 300 MHz | MICROPROCESSOR | 32 | 2 mm | 26 | YES | YES | 32 | FIXED POINT | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HS1-80C86RH/PROTO | Intersil (Renesas Electronics America) | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 5 MHz | RENESAS ELECTRONICS CORP | HS1-80C86RH/PROTO | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5.58 | 5.5 V | 4.5 V | 5 V | * | Last Time Buy | 3A001.A.2.C | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | Not Qualified | MILITARY | 5 MHz | MICROPROCESSOR | 16 | 5.72 mm | 20 | NO | YES | 16 | FIXED POINT | NO | 100k Rad(Si) V | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LUPXA255A0C300 | MARVELL | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 3.6864 MHz | INTEL CORP | Intel Corporation | LUPXA255A0C300 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 40 | 5.82 | Yes | 1.21 V | 1.045 V | 1.1 V | e1 | 3A001.A.2.C | TIN SILVER COPPER | 8542.31.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 256 | S-PBGA-B256 | Not Qualified | OTHER | 300 MHz | MICROPROCESSOR | 32 | 2 mm | 26 | YES | YES | 32 | FIXED POINT | YES | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NTE3880 | NTE ELECT | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 4 MHz | NTE ELECTRONICS INC | NTE Electronics | NTE3880 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.84 | No | 5.25 V | 4.75 V | 5 V | e0 | No | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | Microprocessors | NMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | 5 V | COMMERCIAL | 4 MHz | MICROPROCESSOR | 200 mA | 8 | 16 | NO | NO | 8 | FIXED POINT | NO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MD80C86/883 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 5 MHz | INTERSIL CORP | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | 40 | R-GDIP-T40 | Not Qualified | MILITARY | 5 MHz | MICROPROCESSOR | 50 mA | 16 | 5.715 mm | 20 | NO | YES | 38535Q/M;38534H;883B | 16 | FIXED POINT | NO | 52.464 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NSC800D-35/883 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 7.0422 MHz | NATIONAL SEMICONDUCTOR CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | Not Qualified | MILITARY | 3.5 MHz | MICROPROCESSOR | 8 | 5.08 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TSC695F-25SASV | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | ATMEL CORP | 125 °C | -55 °C | PLASTIC/EPOXY | QFF | QFF, | SQUARE | FLATPACK | Transferred | 5.5 V | 4.5 V | 5 V | e4 | 3A001.A.2.C | GOLD | 8542.31.00.01 | QUAD | FLAT | 0.508 mm | unknown | S-PQFP-F256 | MILITARY | 25 MHz | MICROPROCESSOR, RISC | 32 | 3.18 mm | 32 | YES | YES | 32 | FLOATING POINT | NO | 37.085 mm | 37.085 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NSC800D-4M/A | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 2 MHz | NATIONAL SEMICONDUCTOR CORP | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | MILITARY | 4 MHz | MICROPROCESSOR | 21 mA | 8 | 5.08 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 5 | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HM1-6100-2 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | INTERSIL CORP | 125 °C | -55 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T40 | Not Qualified | MILITARY | 2.5 MHz | MICROPROCESSOR, RISC | 12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TS68882MR25 | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | ATMEL CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Transferred | PGA | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 68 | S-CPGA-P68 | Not Qualified | MILITARY | MATH PROCESSOR, COPROCESSOR | 136 mA | 4.184 mm | 26.92 mm | 26.92 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TS68882MR25 | Thomson Electron Tubes & Devices Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | THOMSON ELECTRON TUBES & DEVICES CORP | 125 °C | -55 °C | CERAMIC | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Transferred | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-XPGA-P68 | Not Qualified | MILITARY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No Z84C0008PEC | Zilog | Datasheet | 55 | - | Min: 1 Mult: 1 | Through Hole | 40-DIP (0.620, 15.75mm) | 40 | -40°C~100°C TA | Tube | 2002 | Z80 | e0 | no | Obsolete | 1 (Unlimited) | 40 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | DRAM REFRESH COUNTER | 8542.31.00.01 | DUAL | 5V | 2.54mm | 8MHz | Z84C00 | 40 | 5V | 5V | 5V | 64kB | MICROPROCESSOR | 8 | 8 μs | 8b | Z8 | NO | YES | FIXED POINT | NO | 0 | 5.0V | 1 Core 8-Bit | No | 2 | 4.19mm | 62.74mm | 14.22mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No Z8038018FSG | Zilog | Datasheet | 8 |
| Min: 1 Mult: 1 | 24 Weeks | Surface Mount | 100-QFP | 100 | 0°C~70°C TA | Tray | 1995 | SCC | e3 | yes | Active | 3 (168 Hours) | 100 | 3A001.A.2.C | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 18MHz | 40 | Z80380 | 100 | 5V | 5V | 64kB | 64kB | MICROPROCESSOR | Z380 | 32 | 16b | 32 | NO | YES | FIXED POINT | NO | 0 | 5.0V | 1 Core 32-Bit | No | DRAM | 5 | 3.1mm | 20mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GDPXA255A0C200 | Intel | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | BGA | 85°C | Bulk | 1 (Unlimited) | 256 | 3A001.A.2.C | 8542.31.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | 200MHz | NOT SPECIFIED | 256 | Not Qualified | OTHER | 3.3V | MICROPROCESSOR | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 2mm | 17mm | 17mm | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FC80960HT75SL2GT | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-QFP | 208 | 0°C~85°C TC | Tray | 2002 | i960 | e0 | Obsolete | 5 (48 Hours) | 208 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 3.3V | 0.5mm | 75MHz | 208 | 3.3V | 3.33.3/5V | 3.3V | 3.45V | 3.15V | 2kB | MICROPROCESSOR, RISC | 32 | 75 μs | 32 | YES | YES | 32 | FIXED POINT | YES | 1 Core 32-Bit | No | DRAM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 59629094601MYA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 164 | 16 MHz | 32 | 3A001.a.2.c | MQ80960MC | 8542.31.00.01 | 0 | 0 | DEFENSE SUPPLY CENTER COLUMBUS | RISC | Defense Supply Center Columbus | 5962-9094601MYA | 5.25 | 125 | 2600 | 16 | 4.75 | -55 | Surface Mount | No | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | 2.92 | 28.96 | FLATPACK, GUARD RING | 28.96 | Obsolete | 164 | NOT SPECIFIED | 5.84 | Compliant | 8542310000, 8542310000/8542310000/8542310000/8542310000/8542310000 | LCC | LCC | 5.25 V | 4.75 V | 5 V | 5 | 0 | 0 | e0 | Obsolete | 3A001.A.2.C | TIN LEAD | 125 °C | 8542.31.00.01 | CMOS | QUAD | FLAT | NOT SPECIFIED | 0.635 mm | unknown | 16 MHz | 164 | Not Qualified | 5 V | MILITARY | 5.25 V | 4.75 V | 16 MHz | MICROPROCESSOR | 32 | 2.92 mm | 32 | 32 | FLOATING POINT | 0 | 0 | 0 | 0 | 28.705 mm | 28.705 mm | No | Supplier Unconfirmed |
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TS68882MRB/C20
Thomson Electron Tubes & Devices Corp
Package:Embedded - Microprocessors
Price: please inquire
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TS68882MRB/C20
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
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TS68882MR25
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
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68882-20/BYCJC
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
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LUPXA255A0E300
MARVELL
Package:Embedded - Microprocessors
Price: please inquire
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HS1-80C86RH/PROTO
Intersil (Renesas Electronics America)
Package:Embedded - Microprocessors
Price: please inquire
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LUPXA255A0C300
MARVELL
Package:Embedded - Microprocessors
Price: please inquire
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NTE3880
NTE ELECT
Package:Embedded - Microprocessors
Price: please inquire
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MD80C86/883
Intersil Corporation
Package:Embedded - Microprocessors
Price: please inquire
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NSC800D-35/883
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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TSC695F-25SASV
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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NSC800D-4M/A
National Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
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HM1-6100-2
Intersil Corporation
Package:Embedded - Microprocessors
Price: please inquire
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TS68882MR25
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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TS68882MR25
Thomson Electron Tubes & Devices Corp
Package:Embedded - Microprocessors
Price: please inquire
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Z84C0008PEC
Zilog
Package:Embedded - Microprocessors
Price: please inquire
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Z8038018FSG
Zilog
Package:Embedded - Microprocessors
29.108446
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GDPXA255A0C200
Intel
Package:Embedded - Microprocessors
Price: please inquire
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FC80960HT75SL2GT
Intel
Package:Embedded - Microprocessors
Price: please inquire
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59629094601MYA
Intel
Package:Embedded - Microprocessors
Price: please inquire