The category is 'Embedded - Microprocessors'
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- ECCN Code
- Terminal Position
- HTS Code
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- ECCN Code:
3A001.A.3
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Number of Terminals | Automotive | Body Orientation | Clock Frequency-Max | Contact Classification | Contact Finish Mating | Contact Materials | Data Bus Width (bit) | Data Cache Size | ECCN (US) | Ethernet Speed | EU RoHS | Family Name | Frequency(Max) | HTS | I/O Voltage (V) | I2C | I2S | Ihs Manufacturer | Instruction Cache Size | Instruction Set Architecture | Interface Type | Lead Shape | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Power Dissipation (mW) | Maximum Speed (MHz) | Mfr | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Moisture Sensitivity Levels | Mounting | Mounting Styles | Multiply Accumulate | Number of CPU Cores | Number of I/O Lines | On-Chip Memory | Operating Temp Range | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PCB changed | PPAP | Primary Material | Product Depth (mm) | Product Diameter (mm) | Product Status | Rad Hardened | RAM(byte) | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | ROM(word) | Shell Size / Insert Arrangement | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | SVHC | SVHC Exceeds Threshold | Termination Method | Typical Operating Supply Voltage (V) | UART | Usage Level | USART | Voltage, Rating | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Number of Terminations | Termination | ECCN Code | Connector Type | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Gender | Additional Feature | HTS Code | Fastening Type | Subcategory | Technology | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Shell Finish | Pin Count | JESD-30 Code | Qualification Status | Number of Contacts | Contact Gender | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Number of Ports | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Has ADC | DMA Channels | Family | Data Bus Width | PWM Channels | DAC Channels | Seated Height-Max | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Ethernet | USB | Number of Serial I/Os | Shell Plating | ROM Programmability | Number of External Interrupts | Barrel Shifter | Internal Bus Architecture | Number of DMA Channels | SPI | CAN | Strain Relief | Device Core | Product Length (mm) | Height Seated (Max) | Length | Width | Product Height (mm) | Radiation Hardening | RoHS Status |
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 | Mfr Part No IDT79RV4640-150DU | Intersil (Renesas Electronics America) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | 75 MHz | INTEGRATED DEVICE TECHNOLOGY INC | IDT79RV4640-150DU | 3 | 85 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-128 | QFP128,1.2SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | 20 | 5.79 | No | 3.465 V | 3.135 V | 3.3 V | e0 | 3A001.A.3 | Tin/Lead (Sn85Pb15) | 8542.31.00.01 | QUAD | GULL WING | 240 | 0.8 mm | not_compliant | 128 | S-PQFP-G128 | Not Qualified | 3.3 V | OTHER | 150 MHz | MICROPROCESSOR, RISC | 625 mA | 64 | 3.86 mm | 32 | NO | YES | 32 | FLOATING POINT | YES | 27.69 mm | 27.69 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IBM25PPC750CXEJQ7013T | IBM MICROELECTRONICS | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 133 MHz | IBM MICROELECTRONICS | IBM25PPC750CXEJQ7013T | PLASTIC/EPOXY | LBGA | LBGA, BGA256,20X20,50 | BGA256,20X20,50 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | NOT SPECIFIED | 5.83 | Yes | 1.9 V | 1.7 V | 1.8 V | 3A001.A.3 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | unknown | 256 | S-PBGA-B256 | Not Qualified | 1.8,1.8/2.5 V | 600 MHz | MICROPROCESSOR, RISC | 32 | 1.666 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IDT79R3041-25PFG | Intersil (Renesas Electronics America) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 50 MHz | INTEGRATED DEVICE TECHNOLOGY INC | IDT79R3041-25PFG | 3 | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 30 | 5.82 | Yes | 5.25 V | 4.75 V | 5 V | e3 | 3A001.A.3 | MATTE TIN | BURST BUS; 5 PIPELINE STAGES | 8542.31.00.01 | QUAD | GULL WING | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | Not Qualified | COMMERCIAL | 25 MHz | MICROPROCESSOR, RISC | 32 | 1.6 mm | 32 | NO | NO | 32 | FIXED POINT | NO | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 79RC32H435-266BC | Intersil (Renesas Electronics America) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 125 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 79RC32H435-266BC | 3 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 5.88 | No | 1.3 V | 1.1 V | 1.2 V | e0 | 3A001.A.3 | Tin/Lead (Sn63Pb37) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B256 | Not Qualified | 1.2,2.5,3.3 V | COMMERCIAL | 266 MHz | MICROPROCESSOR | 32 | 1.7 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No C8051F585-AQ | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 50 MHz | SILICON LABORATORIES INC | Silicon Laboratories Inc | C8051F585-AQ | 40 | 125 °C | -40 °C | PLASTIC/EPOXY | TFQFP | QFP-48 | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | QFP | 8448 | NOT SPECIFIED | 5.75 | Yes | Yes | 98304 | 2.75 V | 2 V | 2.1 V | Automotive grade | 3A001.A.3 | 8542.31.00.01 | Microcontrollers | CMOS | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | 48 | S-PQFP-G48 | Not Qualified | 2/5 V | AUTOMOTIVE | 50 MHz | MICROCONTROLLER | 33 mA | 8 | YES | NO | YES | NO | 1.2 mm | 8051 | AEC-Q100 | FLASH | 7 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No C8051F586-AQ | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 50 MHz | SILICON LABORATORIES INC | Silicon Laboratories Inc | C8051F586-AQ | 25 | 125 °C | -40 °C | PLASTIC/EPOXY | LQFP | QFP-32 | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Active | QFP | 8448 | NOT SPECIFIED | 5.76 | Yes | Yes | 98304 | 2.75 V | 2 V | 2.1 V | Automotive grade | 3A001.A.3 | 8542.31.00.01 | Microcontrollers | CMOS | QUAD | GULL WING | NOT SPECIFIED | 0.8 mm | compliant | 32 | S-PQFP-G32 | Not Qualified | 2/5 V | AUTOMOTIVE | 50 MHz | MICROCONTROLLER | 33 mA | 8 | YES | NO | YES | NO | 1.6 mm | 8051 | AEC-Q100 | FLASH | 7 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No C8051F585-AM | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 50 MHz | SILICON LABORATORIES INC | Silicon Laboratories Inc | C8051F585-AM | 40 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | QFN-48 | LCC48,.28SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | 8448 | NOT SPECIFIED | 5.75 | No | Yes | 98304 | 2.75 V | 2 V | 2.1 V | Automotive grade | 3A001.A.3 | 8542.31.00.01 | Microcontrollers | CMOS | QUAD | NO LEAD | NOT SPECIFIED | 0.5 mm | compliant | 48 | S-PQCC-N48 | Not Qualified | 2/5 V | AUTOMOTIVE | 50 MHz | MICROCONTROLLER | 33 mA | 8 | YES | NO | YES | NO | 1 mm | 8051 | AEC-Q100 | FLASH | 7 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A80C186XL25 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Gold | NO | 3 | Straight | 50 MHz | 3Signal | Copper Alloy | INTEL CORP | Intel Corporation | A80C186XL25 | Cable | -65C to 175C | 70 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA68,11X11 | PGA68,11X11 | SQUARE | GRID ARRAY | Obsolete | PGA | Not Required(mm) | 18.64(mm) | No | 5.63 | Yes | 8-98 | 5.5 V | 4.5 V | 5 V | Crimp | 850VDC/600VAC | 3A001.A.3 | Circular | PL | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE | 8542.31.00.01 | Microprocessors | CMOS | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 68 | S-CPGA-P68 | Not Qualified | 3(POS) | PIN | 5 V | COMMERCIAL | 1(Port) | 25 MHz | MICROPROCESSOR | 100 mA | 16 | JT | 5.21 mm | 20 | NO | YES | 16 | FIXED POINT | NO | 0 | Cadmium Over Nickel | 5 | 2 | No | 23.82(mm) | 29.464 mm | 29.464 mm | Not Required(mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC8245TZU300B | MOTOROLA | Datasheet | - | - | Min: 1 Mult: 1 | YES | 352 | 352 | 66 MHz | MOTOROLA INC | Motorola Semiconductor Products | XPC8245TZU300B | 3 | PLASTIC/EPOXY | LBGA | LBGA, BGA352,26X26,50 | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | Transferred | NOT SPECIFIED | 8.7 | Non-Compliant | No | 1.9 V | 1.7 V | 1.8 V | e0 | 3A001.A.3 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 2V SUPPLY | 8542.31.00.01 | Microprocessors | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | unknown | S-PBGA-B352 | Not Qualified | 2,3.3 V | 300 MHz | MICROPROCESSOR, RISC | 32 | 1.65 mm | 32 | YES | YES | 32 | FLOATING POINT | YES | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSP56F801FA60 | NXP | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 60 MHz | MOTOROLA INC | Motorola Semiconductor Products | DSP56F801FA60 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LQFP-48 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Transferred | 8.61 | No | 3.6 V | 3 V | 3.3 V | 3A001.A.3 | 8542.31.00.01 | CMOS | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G48 | Not Qualified | INDUSTRIAL | DIGITAL SIGNAL PROCESSOR, OTHER | 1.6 mm | YES | YES | FIXED POINT | YES | MULTIPLE | 7 mm | 7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC8260AZUPJDA | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 480 | No | 83.33 MHz | 32 | 16KB | 5A991 | 10Mbps/100Mbps | Not Compliant | PowerQUICC II MPC82xx Processor | 3.3 | 1 | 0 | MOTOROLA INC | 16KB | RISC | Ethernet/I2C/SPI/UART | Ball | Motorola Semiconductor Products | XPC8260AZUPJDA | 2.2 | 105 | 300 | 1.9 | 0 | Surface Mount | No | 1 | 32KB/RAM | 70 °C | PLASTIC/EPOXY | LBGA | 37.50 X 37.50 MM, TBGA-480 | BGA480,29X29,50 | 1.05(Max) | 37.5 | SQUARE | GRID ARRAY, LOW PROFILE | 37.5 | Transferred | 480 | No | 5.79 | No | BGA | TBGA | 2.7 V | 2.4 V | 2.5 V | 2 | 3 | 0 | e0 | Obsolete | 3A001.A.3 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | Microprocessors | CMOS | BOTTOM | BALL | 1.27 mm | unknown | 480 | S-PBGA-B480 | Not Qualified | 2.5,3.3 V | COMMERCIAL | 300 MHz | MICROPROCESSOR, RISC | 32 | 1.65 mm | 32 | YES | NO | 64 | FLOATING POINT | YES | 1 | 0 | 1 | 0 | PowerPC | 37.5 mm | 37.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC8245LZU266B | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 352 | No | 66 MHz | 32 | 16KB | Not Compliant | PowerPC MPC82xx Processor | 3.3 | 1 | 0 | MOTOROLA INC | 16KB | RISC | I2C/UART | Ball | Motorola Mobility LLC | XPC8245LZU266B | 2.1|3.465 | 105 | 266 | 1.7|3.135 | 0 | 3 | Surface Mount | No | 1 | PLASTIC/EPOXY | LBGA | LBGA, BGA352,26X26,50 | BGA352,26X26,50 | 1.05(Max) | 35 | SQUARE | GRID ARRAY, LOW PROFILE | 35 | Transferred | BGA | 352 | No | NOT SPECIFIED | 5.31 | No | BGA | TBGA | 1.9 V | 1.7 V | 1.8 V | 1.8|1.9|2|3.3 | 2 | 0 | Obsolete | 3A001.A.3 | ALSO OPERATES AT 2V SUPPLY | 8542.31.00.01 | Microprocessors | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | unknown | 352 | S-PBGA-B352 | Not Qualified | 2,3.3 V | 266 MHz | MICROPROCESSOR, RISC | 32 | 1.65 mm | 32 | 603e | YES | YES | 32 | FLOATING POINT | YES | 0 | 0 | 0 | 0 | MPC603e | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC855TCZP50D4 | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | No | 50 MHz | 32 | 4KB | 5A991 | Not Compliant | PowerQUICC MPC8xx Processor | 1 | 0 | MOTOROLA INC | 4KB | RISC | I2C/SPI/UART | Ball | Motorola Semiconductor Products | XPC855TCZP50D4 | 3.465|3.6 | 95 | 735 | 50 | 2|3.135 | -40 | Surface Mount | No | 1 | 8KB/RAM | -40 °C | PLASTIC/EPOXY | BGA | PLASTIC, BGA-357 | BGA357,19X19,50 | 1.35(Max) | 25 | SQUARE | GRID ARRAY | 25 | Transferred | 357 | No | 8.7 | No | BGA | BGA | Extended | 3.465 V | 3.135 V | 3.3 V | Yes | Yes | 2.5|3.3 | 1 | 0 | Obsolete | 3A001.A.3 | 8542.31.00.01 | Other Microprocessor ICs | CMOS | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 3.3 V | 50 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 0 | 0 | 1 | 0 | MPC8xx | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC860SRZP50D4 | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | No | 50 MHz | 32 | 4KB | 5A991 | Not Compliant | PowerQUICC MPC8xx Processor | 8542.31.00.01 | 1 | 0 | MOTOROLA INC | 4KB | RISC | I2C/SPI/UART | Ball | Motorola Semiconductor Products | XPC860SRZP50D4 | 3.465|3.6 | 95 | 735 | 50 | 2|3.135 | 0 | Surface Mount | No | 1 | 8KB/RAM | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | 1.35(Max) | 25 | SQUARE | GRID ARRAY | 25 | Transferred | 357 | No | 8.73 | No | BGA | BGA | 3.465 V | 3.135 V | 3.3 V | Yes | Yes | 2.5|3.3 | 1 | 0 | Obsolete | 3A001.A.3 | 8542.31.00.01 | Other Microprocessor ICs | CMOS | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 3.3 V | 50 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 0 | 0 | 1 | 0 | MPC8xx | 25 mm | 25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 79RC32H435-300BCI | Intersil (Renesas Electronics America) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 125 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 79RC32H435-300BCI | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 5.88 | No | 1.3 V | 1.1 V | 1.2 V | e0 | 3A001.A.3 | Tin/Lead (Sn63Pb37) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B256 | Not Qualified | 1.2,2.5,3.3 V | INDUSTRIAL | 300 MHz | MICROPROCESSOR | 32 | 1.7 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No C8051F588-AM | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 50 MHz | SILICON LABORATORIES INC | Silicon Laboratories Inc | C8051F588-AM | 33 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | QFN-40 | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | 8448 | NOT SPECIFIED | 5.77 | No | Yes | 131072 | 2.75 V | 2 V | 2.1 V | Automotive grade | 3A001.A.3 | 8542.31.00.01 | Microcontrollers | CMOS | QUAD | NO LEAD | NOT SPECIFIED | 0.5 mm | compliant | 40 | S-PQCC-N40 | Not Qualified | 2/5 V | AUTOMOTIVE | 50 MHz | MICROCONTROLLER | 33 mA | 8 | YES | NO | YES | NO | 0.9 mm | 8051 | AEC-Q100 | FLASH | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FA80386EXTC25 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | YES | Flange | Aluminum | 144 | 50 MHz | Gold | Copper Alloy | INTEL CORP | Intel Corporation | FA80386EXTC25 | Glenair | 118 °C | -40 °C | Retail Package | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | Metal | Active | NOT SPECIFIED | 5.52 | No | 5.5 V | 4.5 V | 5 V | -65°C ~ 175°C | 806 | e0 | Solder | 3A001.A.3 | Plug, Male Pins | Tin/Lead (Sn/Pb) | Silver | 8542.31.00.01 | Threaded | Microprocessors | CMOS | QUAD | A | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | Electroless Nickel | 144 | S-PQFP-G144 | Not Qualified | 5 V | INDUSTRIAL | 25 MHz | MICROPROCESSOR | 250 mA | 32 | 1.7 mm | 26 | YES | YES | 16 | FIXED POINT | NO | 0 | 3 | 12 | 2 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8548EVTAUJ | NXP | Datasheet | - | - | Min: 1 Mult: 1 | YES | 783 | 133 MHz | FREESCALE SEMICONDUCTOR INC | Freescale Semiconductor | MPC8548EVTAUJ | 3 | 105 °C | PLASTIC/EPOXY | BGA | 29 X 29 MM, 1 MM PITCH, FLIP CHIP, LEAD FREE, PLASTIC, BGA-783 | SQUARE | GRID ARRAY | Obsolete | BGA | 40 | 5.07 | Yes | 1.155 V | 1.045 V | 1.1 V | e2 | 3A001.A.3 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | CMOS | BOTTOM | BALL | 260 | 1 mm | not_compliant | 783 | S-PBGA-B783 | Not Qualified | OTHER | 1333 MHz | MICROPROCESSOR | 32 | 3.38 mm | 64 | YES | YES | 64 | FLOATING POINT | YES | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TMPR4938XBG-300 | Toshiba | Datasheet | - | - | Min: 1 Mult: 1 | 22 Weeks | Surface Mount | BGA | 484 | 300MHz | 2012 | yes | Discontinued | 484 | 3A001.A.3 | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.5V | 1.27mm | 300MHz | 484 | 1.5V | 1.53.3V | COMMERCIAL | 1.6V | 1.4V | 64 | 64b | 20 | RISC | YES | YES | FLOATING POINT | YES | 2.46mm | 35mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TMPR4955BFG-300 | Toshiba | Datasheet | 124 | - | Min: 1 Mult: 1 | PQFP | YES | 160 | 300MHz | Bulk | 2012 | yes | 160 | 3A001.A.3 | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 1.5V | 0.65mm | 160 | 1.5V | 1.6V | 1.53.3V | COMMERCIAL | 64 | NO | NO | 64b | NO | NO | 32 | RISC | 4.45mm | 28mm | No | RoHS Compliant |
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IDT79RV4640-150DU
Intersil (Renesas Electronics America)
Package:Embedded - Microprocessors
Price: please inquire
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IBM25PPC750CXEJQ7013T
IBM MICROELECTRONICS
Package:Embedded - Microprocessors
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Intersil (Renesas Electronics America)
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Intersil (Renesas Electronics America)
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C8051F585-AQ
Silicon Laboratories Inc
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C8051F586-AQ
Silicon Laboratories Inc
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C8051F585-AM
Silicon Laboratories Inc
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A80C186XL25
Intel
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XPC8245TZU300B
MOTOROLA
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DSP56F801FA60
NXP
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XPC8260AZUPJDA
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
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XPC8245LZU266B
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
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XPC855TCZP50D4
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
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XPC860SRZP50D4
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
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79RC32H435-300BCI
Intersil (Renesas Electronics America)
Package:Embedded - Microprocessors
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C8051F588-AM
Silicon Laboratories Inc
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FA80386EXTC25
Intel
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MPC8548EVTAUJ
NXP
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TMPR4938XBG-300
Toshiba
Package:Embedded - Microprocessors
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TMPR4955BFG-300
Toshiba
Package:Embedded - Microprocessors
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