The category is 'Embedded - Microprocessors'
- All Manufacturers
- ECCN Code
- Package / Case
- Packaging
- RoHS Status
- Terminal Form
- Terminal Position
- uPs/uCs/Peripheral ICs Type
- Additional Interfaces
- Graphics Acceleration
- HTS Code
- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Frequency(Max) | Memory Types | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of External Interrupts | Bus Compatibility | Data Transfer Rate-Max | Display & Interface Controllers | Number of DMA Channels | Communication Protocol | SATA | Data Encoding/Decoding Method | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No TMPM333FWFG | Toshiba | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | LQFP | 100 | 40MHz | FLASH | 78 | 8192 | 131072 | 2010 | 100 | 3A991.A.2 | 85°C | -20°C | 8542.31.00.01 | QUAD | GULL WING | 3.3V | 0.5mm | 40MHz | 100 | Not Qualified | 3.3V | OTHER | I2C, UART, USART | 3.6V | 2.7V | 128kB | External | MICROCONTROLLER, RISC | POR, WDT | 32mA | 32 | YES | NO | 32b | NO | NO | ARM | CORTEX-M3 | 1.7mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FC80960HD32SL2GL | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | QFP | 85°C | Bulk | 208 | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | 3.3V | 32MHz | 208 | Not Qualified | OTHER | 3.3V | 2kB | MICROPROCESSOR, RISC | 32 | 32 μs | 32 | YES | YES | 32 | FIXED POINT | YES | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A80960HD80SL2GK | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 168 | 80MHz | Bulk | 168 | 3A991.A.2 | 85°C | 0°C | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 3.3V | 2.54mm | 80MHz | 168 | 3.3V | 3.33.3/5V | OTHER | 3.3V | 3.45V | 3.15V | 2kB | MICROPROCESSOR, RISC | 32 | 80 μs | 32 | YES | YES | 32 | FIXED POINT | YES | 4.57mm | 44.7mm | 44.7mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SI1020 | Silicon Labs | Datasheet | - | - | Min: 1 Mult: 1 | YES | 53 | 85°C | -40°C | 85 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BUTT | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | 85 | R-PBGA-B85 | 3.8V | INDUSTRIAL | 1.8V | 25 MHz | MICROCONTROLLER | 30MHz | 8 | YES | YES | YES | NO | FLASH | 0.94mm | 8mm | 6mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A80960JD3V66 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, Through Hole | QFP | 132 | 66MHz | Bulk | 2002 | Discontinued | 132 | 3A991.A.2 | 100°C | 0°C | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 3.3V | 66MHz | 132 | 3.3V | 3V | 3.45V | 3.15V | MICROPROCESSOR, RISC | 32 | 66 μs | 32b | 32 | YES | YES | FIXED POINT | YES | No | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FC80960HD66SL2GN | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | QFP | 85°C | Bulk | e0 | 208 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | 66MHz | NOT SPECIFIED | 208 | Not Qualified | 3.33.3/5V | OTHER | 3.3V | 2kB | MICROPROCESSOR, RISC | 32 | 66 μs | 32 | YES | YES | 32 | FIXED POINT | YES | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XAM3894CYG | Texas Instruments | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 1031-BFBGA, FCBGA | 1031 | 64 | 0°C~95°C TJ | Tray | Sitara™ | Discontinued | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1V | 0.65mm | 1GHz | AM3894 | 1.05V | SPI | 3.3V | 1.5V | 64kB | 1500 MHz | 32kB | MICROPROCESSOR, RISC | 32 | ARM® Cortex®-A8 | 32 | 32b | 7 | 16 | ARM | YES | YES | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | DDR2, DDR3 | USB 2.0 + PHY (2) | I2C, McASP, McBSP, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | HDMI, HDVPSS | SATA 3Gbps (1) | 3.31mm | 25mm | No | No SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8260ACVVMIBB | NXP USA Inc. | Datasheet | 722 | - | Min: 1 Mult: 1 | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 40 | PC8260 | S-PBGA-B480 | 2.7V | 2.4V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8241LVR166D | NXP USA Inc. | Datasheet | 1600 | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~105°C TA | Tray | 1998 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC8241 | S-PBGA-B357 | 1.9V | 1.7V | 166MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | 2.56mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68MH360VR33L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68MH360 | S-PBGA-B357 | 5.25V | 4.75V | 33MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | 1.25 MBps | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 1.86mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC9328MXLVM20 | NXP USA Inc. | Datasheet | 7 | - | Min: 1 Mult: 1 | 256-LFBGA | YES | Commercial grade | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.9V | 0.8mm | 40 | MC9328MXL | S-PBGA-B256 | 2V | 1.8V | 200MHz | MICROPROCESSOR, RISC | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | 1.6mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8536BVJAKGA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | Active | 3 (168 Hours) | 783 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | MPC8536 | S-PBGA-B783 | 1.05V | 0.95V | 600MHz | MICROPROCESSOR | PowerPC e500 | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC860ENZQ50D4 | NXP USA Inc. | Datasheet | 1092 | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8360VVAGDGA | NXP USA Inc. | Datasheet | 148 | - | Min: 1 Mult: 1 | 12 Weeks | 740-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.26V | 1.8/2.53.3V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 1.69mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC860ENVR66D4 | NXP USA Inc. | Datasheet | 64 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TR80C186XL20 | Rochester Electronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | LCC | 85°C | -40°C | Bulk | 68 | 3A991.A.2 | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE | 8542.31.00.01 | QUAD | NO LEAD | 5V | 1.27mm | 20MHz | S-CQCC-N68 | INDUSTRIAL | 5V | MICROPROCESSOR | 16 | 20 | NO | YES | 16 | FIXED POINT | NO | 3.68mm | 24.13mm | 24.13mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GX1-233B-85-1.8 | AMD | Datasheet | 7950 | - | Min: 1 Mult: 1 | YES | 352 | 233MHz | 352 | 3A991.A.2 | 85°C | 0°C | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 1.27mm | 352 | 1.89V | 1.83.3V | OTHER | 1.71V | MICROPROCESSOR | 32 | 32b | 32 | YES | YES | FLOATING POINT | YES | 1.75mm | 35mm | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SB80C188XL20 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 80 | 70°C | Bulk | e0 | 80 | 3A991.A.2 | Tin/Lead (Sn/Pb) | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | GULL WING | 5V | 0.5mm | 20MHz | 80 | Not Qualified | 5V | COMMERCIAL | 5V | MICROPROCESSOR | 90mA | 16 | 20 μs | 20 | NO | YES | 8 | FIXED POINT | NO | 0 | 5 | 2 | 1.66mm | 12mm | 12mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68302CEH16C | NXP USA Inc. | Datasheet | 288 | - | Min: 1 Mult: 1 | 8 Weeks | 132-BQFP Bumpered | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 132 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 40 | MC68302 | S-PQFP-G132 | 16MHz | MICROCONTROLLER, RISC | M68000 | NO | YES | NO | NO | 20 | 16 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | FLASH | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68360CZQ25L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e0 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68360 | S-PBGA-B357 | 5.25V | 4.75V | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | 1.25 MBps | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 1.86mm | 25mm | Non-RoHS Compliant |
-
TMPM333FWFG
Toshiba
Package:Embedded - Microprocessors
Price: please inquire
-
FC80960HD32SL2GL
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
A80960HD80SL2GK
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
SI1020
Silicon Labs
Package:Embedded - Microprocessors
Price: please inquire
-
A80960JD3V66
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
FC80960HD66SL2GN
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
XAM3894CYG
Texas Instruments
Package:Embedded - Microprocessors
80.319073
-
MPC8260ACVVMIBB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8241LVR166D
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68MH360VR33L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC9328MXLVM20
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8536BVJAKGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860ENZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8360VVAGDGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860ENVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
TR80C186XL20
Rochester Electronics
Package:Embedded - Microprocessors
Price: please inquire
-
GX1-233B-85-1.8
AMD
Package:Embedded - Microprocessors
Price: please inquire
-
SB80C188XL20
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
MC68302CEH16C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68360CZQ25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire