The category is 'Embedded - Microprocessors'
- All Manufacturers
- ECCN Code
- Package / Case
- Packaging
- RoHS Status
- Terminal Form
- Terminal Position
- uPs/uCs/Peripheral ICs Type
- Additional Interfaces
- Graphics Acceleration
- HTS Code
- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No MPC860DTVR50D4 | NXP USA Inc. | Datasheet | 2242 |
| Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||
![]() | Mfr Part No MPC8270ZUQLDA | NXP USA Inc. | Datasheet | 86 | - | Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 83.33MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||
![]() | Mfr Part No MPC8306SCVMABDCA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 369-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 133MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | 1.61mm | 19mm | ROHS3 Compliant | |||||
![]() | Mfr Part No MPC8280VVQLDA | NXP USA Inc. | Datasheet | 1679 |
| Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | ||||
![]() | Mfr Part No MPC8347VVAJFB | NXP USA Inc. | Datasheet | 2369 |
| Min: 1 Mult: 1 | 12 Weeks | 672-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | ||||
![]() | Mfr Part No MPC8306SCVMADDCA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 369-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | 1.61mm | 19mm | ROHS3 Compliant | |||||
![]() | Mfr Part No MC9328MXLVP20 | NXP USA Inc. | Datasheet | 80 | - | Min: 1 Mult: 1 | 26 Weeks | 225-LFBGA | YES | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.9V | 0.8mm | 40 | MC9328MXL | S-PBGA-B225 | 2V | 1.8V | 200MHz | MICROPROCESSOR, RISC | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | 1.6mm | 13mm | ROHS3 Compliant | |||||
![]() | Mfr Part No MPC8560CVT667JC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8560 | S-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FIXED POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | 3.85mm | 29mm | ROHS3 Compliant | ||||||
![]() | Mfr Part No MPC860ENCVR50D4 | NXP USA Inc. | Datasheet | 1580 | - | Min: 1 Mult: 1 | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||
![]() | Mfr Part No MC9328MXLVP15 | NXP USA Inc. | Datasheet | 778 | - | Min: 1 Mult: 1 | 225-LFBGA | YES | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 40 | MC9328MXL | S-PBGA-B225 | 1.9V | 1.7V | 150MHz | MICROPROCESSOR, RISC | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | 1.6mm | 13mm | ROHS3 Compliant | ||||||
![]() | Mfr Part No P2010NXN2KFC | NXP USA Inc. | Datasheet | 1600 | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | 1.1V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 16 | YES | YES | 64 | FLOATING POINT | YES | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | |||||||
![]() | Mfr Part No MPC8260ACZUMIBB | NXP USA Inc. | Datasheet | 2240 | - | Min: 1 Mult: 1 | 12 Weeks | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 2.2V | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||
![]() | Mfr Part No MPC8280CZUQLDA | NXP USA Inc. | Datasheet | 2191 | - | Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | ||||
![]() | Mfr Part No MPC8315VRAFDA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8315 | S-PBGA-B620 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | SATA 3Gbps (2) | 2.46mm | 29mm | ROHS3 Compliant | |||
![]() | Mfr Part No MPC8245LZU333D | NXP USA Inc. | Datasheet | 1759 |
| Min: 1 Mult: 1 | 12 Weeks | 352-LBGA | YES | 0°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 2.2V | 23.3V | 1.9V | 333MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | Non-RoHS Compliant | ||||||
![]() | Mfr Part No MC9328MXSVP10R2 | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 26 Weeks | 225-LFBGA | YES | 0°C~70°C TA | Tape & Reel (TR) | 1994 | i.MXS | e1 | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 40 | MC9328MXS | S-PBGA-B225 | 1.9V | 1.7V | 100MHz | MICROPROCESSOR | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | FIXED POINT | NO | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, UART | LCD | 1.6mm | 13mm | ROHS3 Compliant | |||||
![]() | Mfr Part No MC68LC302AF25CT | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 8 Weeks | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 25MHz | MICROCONTROLLER, RISC | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | Mfr Part No MPC8360VVAJDGA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 740-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.35V | 1.8/2.53.3V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 1.69mm | 37.5mm | ROHS3 Compliant | |||
![]() | Mfr Part No MPC8560VT833LC | NXP USA Inc. | Datasheet | 430 | - | Min: 1 Mult: 1 | 12 Weeks | 784-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 1mm | MPC8560 | S-PBGA-B783 | 1.26V | 1.14V | 833MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FIXED POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | 3.85mm | 29mm | ROHS3 Compliant | |||||||
![]() | Mfr Part No MPC855TZQ66D4 | NXP USA Inc. | Datasheet | 3 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant |
MPC860DTVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
232.103337
MPC8270ZUQLDA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8306SCVMABDCA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8280VVQLDA
NXP USA Inc.
Package:Embedded - Microprocessors
384.006297
MPC8347VVAJFB
NXP USA Inc.
Package:Embedded - Microprocessors
196.026719
MPC8306SCVMADDCA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC9328MXLVP20
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8560CVT667JC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC860ENCVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC9328MXLVP15
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
P2010NXN2KFC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8260ACZUMIBB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8280CZUQLDA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8315VRAFDA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8245LZU333D
NXP USA Inc.
Package:Embedded - Microprocessors
116.979246
MC9328MXSVP10R2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC68LC302AF25CT
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8360VVAJDGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8560VT833LC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC855TZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
