The category is 'Embedded - Microprocessors'
- All Manufacturers
- Additional Interfaces
- Boundary Scan
- Co-Processors/DSP
- Core Processor
- Display & Interface Controllers
- ECCN Code
- Format
- Graphics Acceleration
- Integrated Cache
- Length
- Low Power Mode
- Moisture Sensitivity Level (MSL)
- ECCN Code:
5A992.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Memory Types | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Data Bus Width | Seated Height-Max | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of External Interrupts | Barrel Shifter | Internal Bus Architecture | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | Saturation Current | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
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![]() | Mfr Part No MCIMX27MJP4AR2 | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 15 Weeks | 473-LFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX27 | e1 | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX27 | S-PBGA-B473 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | 1.54mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM3703CBPA | Texas Instruments | Datasheet | 23 | - | Min: 1 Mult: 1 | NRND (Last Updated: 2 days ago) | 515-WFBGA, FCBGA | YES | 515 | ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 800MHz | AM3703 | 515 | 1.1V | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | FLOATING POINT | YES | 65536 | 4 | 1 Core 32-Bit | No | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 700μm | 12mm | 12mm | 500μm | Non-RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No OMAP3503ECBBA | Texas Instruments | Datasheet | 416 | - | Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3503 | 515 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 900μm | 12mm | 12mm | 610μm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No OMAP3503ECBCA | Texas Instruments | Datasheet | 264 |
| Min: 1 Mult: 1 | 16 Weeks | ACTIVE (Last Updated: 1 week ago) | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | Active | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 600MHz | OMAP3503 | 515 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM3703CBC100 | Texas Instruments | Datasheet | 37 |
| Min: 1 Mult: 1 | NRND (Last Updated: 1 week ago) | Surface Mount | 515-VFBGA, FCBGA | 515 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 1GHz | AM3703 | 515 | 1.1V | 1.8V | 1.5V | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | 16 | ARM | YES | YES | FLOATING POINT | YES | 65536 | 4 | 1 Core 32-Bit | No | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No OMAP3503ECUSA | Texas Instruments | Datasheet | 23 |
| Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Surface Mount | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | Industrial grade | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | Active | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | OMAP3503 | 423 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX27LMOP4AR2 | NXP USA Inc. | Datasheet | 600 |
| Min: 1 Mult: 1 | 15 Weeks | 473-LFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX27 | e1 | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX27 | S-PBGA-B473 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 26MHz | 32 | 26 | YES | YES | 16 | FIXED POINT | YES | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | 1.54mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX27LVOP4AR2 | NXP USA Inc. | Datasheet | 680 |
| Min: 1 Mult: 1 | 15 Weeks | 404-LFBGA | YES | -20°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX27 | e1 | Not For New Designs | 3 (168 Hours) | 404 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.65mm | 40 | MCIMX27 | S-PBGA-B404 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | 1.4mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM3703CBC | Texas Instruments | Datasheet | 23 |
| Min: 1 Mult: 1 | NRND (Last Updated: 1 week ago) | 515-VFBGA, FCBGA | YES | 515 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 800MHz | AM3703 | 515 | 1.1V | 1.8V | 1.5V | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | 16 | ARM | YES | YES | FLOATING POINT | YES | 65536 | 4 | 1 Core 32-Bit | No | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX27MOP4AR2 | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 15 Weeks | 473-LFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX27 | e1 | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX27 | S-PBGA-B473 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | 1.54mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ATSAMA5D28B-CU | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 289-LFBGA | YES | -40°C~105°C TA | Tray | SAMA5D2 | Obsolete | 3 (168 Hours) | 289 | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 0.8mm | ATSAMA5D28 | S-PBGA-B289 | 1.32V | 1.1V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 50MHz | 26 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.4mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ATSAMA5D23B-CU | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 196-TFBGA, CSBGA | -40°C~105°C TA | Tray | SAMA5D2 | Obsolete | 3 (168 Hours) | 5A992.C | 8542.31.00.01 | ATSAMA5D23 | 500MHz | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No OMAP3503ECBC | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | Active | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 600MHz | OMAP3503 | 515 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ATSAMA5D23B-CN | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 196-TFBGA, CSBGA | YES | -40°C~105°C TA | Tray | SAMA5D2 | Obsolete | 3 (168 Hours) | 196 | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 0.75mm | ATSAMA5D23 | S-PBGA-B196 | 1.32V | 1.1V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 50MHz | 26 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.2mm | 11mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ATSAMA5D28B-CN | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 289-LFBGA | -40°C~105°C TA | Tray | SAMA5D2 | Obsolete | 3 (168 Hours) | 5A992.C | 8542.31.00.01 | ATSAMA5D28 | 500MHz | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MIMXRT1011DAE5A | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | 2019-09-25 | NXP SEMICONDUCTORS | 3 | Active | Yes | e3 | 5A992.C | Tin (Sn) | 8542.31.00.01 | 260 | compliant | 40 | MICROPROCESSOR, RISC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6U6AVM08AC | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 16 Weeks | YES | 624 | 24 MHz | NXP SEMICONDUCTORS | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | LFBGA | MABGA-624 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Not Recommended | Yes | 1.5 V | 1.275 V | 1.35 V | e1 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8 mm | compliant | 40 | S-PBGA-B624 | AUTOMOTIVE | 800 MHz | MICROPROCESSOR, RISC | 64 | 1.6 mm | 16 | YES | YES | 64 | FIXED POINT | YES | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TDA2HFBTQABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 760 | 2019-08-14 | TEXAS INSTRUMENTS INC | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 1.2 V | 1.11 V | 1.15 V | e1 | Yes | 5A992.C | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B760 | AUTOMOTIVE | SoC | 2.96 mm | AEC-Q100 | 3 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TDA2SGBRQABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 760 | TEXAS INSTRUMENTS INC | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-760 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | Yes | 1.2 V | 1.11 V | 1.15 V | e1 | Yes | 5A992.C | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B760 | AUTOMOTIVE | SoC | 2.96 mm | AEC-Q100 | 3 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FS32R274KSK2MMM | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | YES | 257 | 40 MHz | 2018-06-21 | NXP SEMICONDUCTORS | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | LFBGA | MABGA-257 | BGA257,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Yes | 1.31 V | 1.19 V | 1.25 V | e2 | 5A992.C | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8 mm | compliant | 40 | S-PBGA-B257 | 240 MHz | MICROPROCESSOR, RISC | 1642 mA | 32 | 1.51 mm | YES | YES | ISO 26262 | FLOATING-POINT | YES | 1572864 | 1 | 8 | 32 | 14 mm | 14 mm |
MCIMX27MJP4AR2
NXP USA Inc.
Package:Embedded - Microprocessors
33.566639
AM3703CBPA
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
OMAP3503ECBBA
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
OMAP3503ECBCA
Texas Instruments
Package:Embedded - Microprocessors
42.267251
AM3703CBC100
Texas Instruments
Package:Embedded - Microprocessors
38.672785
OMAP3503ECUSA
Texas Instruments
Package:Embedded - Microprocessors
36.357314
MCIMX27LMOP4AR2
NXP USA Inc.
Package:Embedded - Microprocessors
23.506875
MCIMX27LVOP4AR2
NXP USA Inc.
Package:Embedded - Microprocessors
26.215415
AM3703CBC
Texas Instruments
Package:Embedded - Microprocessors
33.129326
MCIMX27MOP4AR2
NXP USA Inc.
Package:Embedded - Microprocessors
33.566639
ATSAMA5D28B-CU
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
ATSAMA5D23B-CU
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
OMAP3503ECBC
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
ATSAMA5D23B-CN
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
ATSAMA5D28B-CN
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
MIMXRT1011DAE5A
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6U6AVM08AC
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
TDA2HFBTQABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
TDA2SGBRQABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
FS32R274KSK2MMM
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
