The category is 'Embedded - Microprocessors'
- All Manufacturers
- Additional Interfaces
- Base Part Number
- Ethernet
- Graphics Acceleration
- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Published
- RAM Controllers
- Operating Temperature:
-40°C~95°C TA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Display & Interface Controllers | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MPC860TCZQ50D4 | NXP USA Inc. | Datasheet | 1708 |
| Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||
| Mfr Part No MPC860ENCZQ66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||
 | Mfr Part No MPC823CZQ66B2T | NXP USA Inc. | Datasheet | 1528 | - | Min: 1 Mult: 1 | 256-BBGA | -40°C~95°C TA | Tray | 1997 | MPC8xx | Obsolete | 3 (168 Hours) | MPC823 | 66MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No MPC860PCVR50D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||
| Mfr Part No MPC860SRCZQ50D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||
| Mfr Part No MPC855TCZQ66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||
| Mfr Part No XPC823ECVR66B2 | NXP USA Inc. | Datasheet | 4038 | - | Min: 1 Mult: 1 | 26 Weeks | 256-BBGA | 256-PBGA (23x23) | -40°C~95°C TA | Tray | 1999 | MPC8xx | Obsolete | 3 (168 Hours) | PC823 | 66MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No MC860ENCZQ50D4R2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | -40°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | Not For New Designs | 3 (168 Hours) | MC860 | 50MHz | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No MPC850SRCVR66BU | NXP USA Inc. | Datasheet | 766 | - | Min: 1 Mult: 1 | 256-BBGA | -40°C~95°C TA | Tray | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | MPC850 | 66MHz | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No MPC850DSLCVR50BU | NXP USA Inc. | Datasheet | 80000 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||||
| Mfr Part No MPC823CVR66B2T | NXP USA Inc. | Datasheet | 61 | - | Min: 1 Mult: 1 | 256-BBGA | 256-PBGA (23x23) | -40°C~95°C TA | Tray | 1997 | MPC8xx | Obsolete | 1 (Unlimited) | MPC823 | 66MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ROHS3 Compliant | |||||||||||||||||||||||||||||
| Mfr Part No MPC860ENCVR66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||
| Mfr Part No MPC850CVR50BU | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 256-BBGA | YES | -40°C~95°C TA | Tray | 2004 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | ||||||
| Mfr Part No MC860ENCVR50D4R2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 26 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tape & Reel (TR) | 2001 | MPC8xx | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 3.3V | 1.27mm | MC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||||||
| Mfr Part No MPC850DECVR50BU | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||||
| Mfr Part No MPC850CZQ50BUR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tape & Reel (TR) | 1997 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.35mm | 23mm | Non-RoHS Compliant | ||||
| Mfr Part No MPC850CVR66BU | NXP USA Inc. | Datasheet | 3 | - | Min: 1 Mult: 1 | 26 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1998 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 5A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 66MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||||
| Mfr Part No MPC850SRCVR50BU | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||||
| Mfr Part No MPC860DTCZQ50D4 | NXP USA Inc. | Datasheet | 1844 |
| Min: 1 Mult: 1 | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||
| Mfr Part No MPC855TCVR66D4 | NXP USA Inc. | Datasheet | 1698 |
| Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant |
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MPC860TCZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
230.190352
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MPC860ENCZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC823CZQ66B2T
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860PCVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860SRCZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC855TCZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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XPC823ECVR66B2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC860ENCZQ50D4R2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850SRCVR66BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850DSLCVR50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC823CVR66B2T
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860ENCVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850CVR50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC860ENCVR50D4R2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850DECVR50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850CZQ50BUR2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850CVR66BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850SRCVR50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DTCZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
257.281752
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MPC855TCVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
223.125277