The category is 'Embedded - Microprocessors'
- All Manufacturers
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Series
- Speed
- Voltage - I/O
- Base Part Number
- Moisture Sensitivity Level (MSL)
- Packaging
- Part Status
- Package / Case:
360-BBGA, FCBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Mfr | Package | Product Status | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No MPC755CPX400LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991 | TIN LEAD | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.9V | 400MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | ||||||||||||||
![]() | Mfr Part No MPC755BPX300LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 300MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | ||||||||||||||
![]() | Mfr Part No MPC755CPX350LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | |||||||||||||||
![]() | Mfr Part No MPC755CVT400LE | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e2 | Obsolete | 3 (168 Hours) | 360 | 3A991 | TIN COPPER/TIN SILVER | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 2V | 1.27mm | 40 | MPC755 | S-PBGA-B360 | 2.1V | 1.9V | 400MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | ROHS3 Compliant | ||||||||||||||
![]() | Mfr Part No MPC755BVT300LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e2 | Obsolete | 3 (168 Hours) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 2V | 1.27mm | 40 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 300MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | ROHS3 Compliant | ||||||||||||||
![]() | Mfr Part No MPC755CVT350LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e2 | Obsolete | 3 (168 Hours) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 2V | 1.27mm | 40 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | ROHS3 Compliant | |||||||||||||||
![]() | Mfr Part No MPC755BPX350LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | ||||||||||||||
![]() | Mfr Part No MPC755BVT300LE | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 360-BBGA, FCBGA | 360-FCPBGA (25x25) | Freescale Semiconductor | Bulk | Obsolete | 0°C ~ 105°C (TA) | MPC7xx | 300MHz | PowerPC | 2.5V, 3.3V | - | 1 Core, 32-Bit | No | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC755CPX400LER2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tape & Reel (TR) | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991 | TIN LEAD | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.9V | 400MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | ||||||||||||||
![]() | Mfr Part No MPC755BVT350LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | 0°C~105°C TA | Tray | 2001 | MPC7xx | Obsolete | 3 (168 Hours) | MPC755 | 350MHz | PowerPC | 2.5V 3.3V | 1 Core 32-Bit | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No KMC755CVT400LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | 0°C~105°C TA | Tray | 2004 | MPC7xx | Obsolete | 3 (168 Hours) | MC755 | 400MHz | PowerPC | 2.5V 3.3V | 1 Core 32-Bit | No | Non-RoHS Compliant |
MPC755CPX400LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755BPX300LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755CPX350LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755CVT400LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755BVT300LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755CVT350LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755BPX350LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755BVT300LE
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MPC755CPX400LER2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC755BVT350LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
KMC755CVT400LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
