The category is 'Embedded - Microprocessors'
- All Manufacturers
- Package / Case
- Co-Processors/DSP
- Core Processor
- Display & Interface Controllers
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- RAM Controllers
- Security Features
- Series
- Speed
- USB
- Package / Case:
432-TFBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No MCIMX6L2EVN10AB | NXP USA Inc. | Datasheet | 28 | - | Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | 162 | -40°C~105°C TA | Tray | 2002 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||
![]() | Mfr Part No MCIMX6L8DVN10AB | NXP USA Inc. | Datasheet | 240 | - | Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | YES | 162 | Commercial grade | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||
![]() | Mfr Part No MCIMX6L3DVN10AB | NXP USA Inc. | Datasheet | 512 |
| Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | 162 | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||
![]() | Mfr Part No MCIMX6L2EVN10AC | NXP USA Inc. | Datasheet | 640 | - | Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | -40°C~105°C TA | Tray | 2017 | i.MX6SL | Active | 3 (168 Hours) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | S-PBGA-B | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10AA | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 432-TFBGA | Commercial grade | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | Not For New Designs | 3 (168 Hours) | 5A992 | TIN SILVER COPPER | 8542.31.00.01 | 260 | 40 | MCIMX6 | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6V7DVN10AB | NXP USA Inc. | Datasheet | 80000 | - | Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | 0°C~95°C TJ | Tray | 2002 | i.MX6SLL | Active | 3 (168 Hours) | 260 | 40 | 1GHz | ARM® Cortex®-A9 | 1.2V 1.8V 2.5V 3.3V | 1 Core 32-Bit | Yes | LPDDR2, LPDDR3 | USB 2.0 OTG + PHY (2) | Multimedia; NEON™ SIMD | A-HAB, ARM TZ, CSU, SJC, SNVS | EPDC, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L7DVN10AB | NXP USA Inc. | Datasheet | 160 | - | Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | YES | 162 | Commercial grade | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||
![]() | Mfr Part No MCIMX6L2DVN10AB | NXP USA Inc. | Datasheet | 345 |
| Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | 162 | 0°C~95°C TJ | Tray | 2011 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||
![]() | Mfr Part No MCIMX6L2DVN10AC | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | 0°C~95°C TJ | Tray | 2017 | i.MX6SL | Active | 3 (168 Hours) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | S-PBGA-B | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10AC | NXP USA Inc. | Datasheet | 372 |
| Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | YES | 0°C~95°C TJ | Tray | i.MX6SL | Active | 3 (168 Hours) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | S-PBGA-B | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3DVN10AC | NXP USA Inc. | Datasheet | 560 | - | Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | 0°C~95°C TJ | Tray | 2017 | i.MX6SL | Active | 3 (168 Hours) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | S-PBGA-B | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||||||||||||||||||
![]() | Mfr Part No MCIMX6L3DVN10AA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | 0°C~95°C TJ | Tray | 2011 | i.MX6SL | Obsolete | 3 (168 Hours) | MCIMX6 | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2EVN10AA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | Industrial grade | -40°C~105°C TA | Tray | 2011 | i.MX6SL | Obsolete | 3 (168 Hours) | MCIMX6 | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2EVN10ACR | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | -40°C~105°C TA | Tape & Reel (TR) | i.MX6SL | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2EVN10ABR | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | -40°C~105°C TA | Tape & Reel (TR) | 2002 | i.MX6SL | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3EVN10AA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | Industrial grade | -40°C~105°C TA | Tray | 2011 | i.MX6SL | Obsolete | 3 (168 Hours) | MCIMX6 | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10ACR | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | 0°C~95°C TJ | Tape & Reel (TR) | i.MX6SL | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10ABR | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | 0°C~95°C TJ | Tape & Reel (TR) | 2002 | i.MX6SL | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2DVN10AA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 0°C~95°C TJ | Tray | 2011 | i.MX6SL | Obsolete | 3 (168 Hours) | MCIMX6 | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3EVN10AC | NXP USA Inc. | Datasheet | 606 |
| Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | -40°C~105°C TA | Tray | i.MX6SL | Active | 3 (168 Hours) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | S-PBGA-B | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant |
MCIMX6L2EVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3DVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
20.353952
MCIMX6L2EVN10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10AA
NXP USA Inc.
Package:Embedded - Microprocessors
27.092684
MCIMX6V7DVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L7DVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L2DVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
51.494301
MCIMX6L2DVN10AC
NXP USA Inc.
Package:Embedded - Microprocessors
23.890080
MCIMX6L8DVN10AC
NXP USA Inc.
Package:Embedded - Microprocessors
36.593858
MCIMX6L3DVN10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3DVN10AA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L2EVN10AA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L2EVN10ACR
NXP USA Inc.
Package:Embedded - Microprocessors
41.980490
MCIMX6L2EVN10ABR
NXP USA Inc.
Package:Embedded - Microprocessors
41.980490
MCIMX6L3EVN10AA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10ACR
NXP USA Inc.
Package:Embedded - Microprocessors
43.395107
MCIMX6L8DVN10ABR
NXP USA Inc.
Package:Embedded - Microprocessors
30.267474
MCIMX6L2DVN10AA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3EVN10AC
NXP USA Inc.
Package:Embedded - Microprocessors
29.342390
