The category is 'Embedded - Microprocessors'
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- Operating Temperature
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- Package / Case:
432-TFBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Insert Material | Backshell Material, Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Factory Pack QuantityFactory Pack Quantity | Manufacturer | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | Number of I/Os | Package | Part # Aliases | Primary Material | Product Status | RoHS | Shipping Restrictions | Unit Weight | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Published | Series | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Color | Applications | HTS Code | Fastening Type | Subcategory | Power Rating | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Shell Finish | Shell Size - Insert | Termination Style | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Lead Diameter | Speed | Shell Size, MIL | uPs/uCs/Peripheral ICs Type | Core Processor | Bit Size | Cable Opening | Address Bus Width | Product Type | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Product | Features | Product Category | Diameter | Height Seated (Max) | Length | Contact Finish Thickness - Mating | Material Flammability Rating | RoHS Status |
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![]() | Mfr Part No MCIMX6L7DVN10AC | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 12 Weeks | 432-TFBGA | YES | 0°C~95°C TJ | Tray | i.MX6SL | Active | 3 (168 Hours) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | S-PBGA-B | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3DVN10AA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | Xicon | 200 | Xicon | + 155 C | Freescale Semiconductor | - 55 C | PCB Mount | Tray | Obsolete | Details | 0.007055 oz | 200 V | 0°C ~ 95°C (TJ) | Bulk | MF-RC | 1 % | 50 PPM / C | Fixed Resistor | 825 Ohms | Resistors | 125 mW (1/8 W) | Metal Film | Axial | 0.45 mm | 1.0GHz | ARM® Cortex®-A9 | Metal Film Resistors | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | Metal Film Resistors General Purpose | - | Metal Film Resistors - Through Hole | 1.85 mm | 3.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L7DVN10AA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | Glenair | 1 | Glenair | Freescale Semiconductor | Tray | Obsolete | 0°C ~ 95°C (TJ) | i.MX6SL | Circular Connectors | 1.0GHz | ARM® Cortex®-A9 | Circular MIL Spec Backshells | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | Circular MIL Spec Backshells | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10ABR | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | 432-TFBGA | Flange | Aluminum | 432-MAPBGA (13x13) | - | - | TVP00DT | Gold | Copper Alloy | Amphenol Aerospace Operations | Bulk | Metal | Active | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ HD | Solder | Receptacle, Male Pins | 32 | - | Military | Threaded | - | B | Shielded | Environment Resistant | Durmalon™ | 13-32 | 1.0GHz | - | ARM® Cortex®-A9 | - | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | Alignment Disc | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2EVN10AA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 432-TFBGA | 432-MAPBGA (13x13) | Freescale Semiconductor | Tray | Obsolete | -40°C ~ 105°C (TA) | i.MX6SL | 1.0GHz | ARM® Cortex®-A9 | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10SA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 432-TFBGA | 432-MAPBGA (13x13) | Freescale Semiconductor | Tray | Obsolete | 0°C ~ 95°C (TJ) | i.MX6 | 1GHz | ARM® Cortex®-A9 | 1.2V, 1.8V, 3V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3DVN10AB | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 432-TFBGA | 432-MAPBGA (13x13) | Freescale Semiconductor | Bulk | Active | 0°C ~ 95°C (TJ) | i.MX6 | 1GHz | ARM® Cortex®-A9 | 1.2V, 1.8V, 3V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | DDR3, LPDDR2 | USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | LCD | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L7DVN10AB | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 432-TFBGA | 432-MAPBGA (13x13) | Freescale Semiconductor | Bulk | Active | 0°C ~ 95°C (TJ) | i.MX6SL | 1.0GHz | ARM® Cortex®-A9 | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3EVN10AA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | ITT Cannon | 1 | ITT Cannon | Freescale Semiconductor | Tray | 110672-0001 | Obsolete | This product may require additional documentation to export from the United States. | -40°C ~ 105°C (TA) | KPT | D-Sub Connectors | 1.0GHz | ARM® Cortex®-A9 | D-Sub Connectors - Standard Density | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | D-Sub Standard Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2DVN10AA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 432-TFBGA | 432-MAPBGA (13x13) | Freescale Semiconductor | Tray | Obsolete | 0°C ~ 95°C (TJ) | i.MX6SL | 1.0GHz | ARM® Cortex®-A9 | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10AA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 432-TFBGA | 432-MAPBGA (13x13) | MCIMX6 | Freescale Semiconductor | Bulk | Active | 0°C ~ 95°C (TJ) | i.MX6SL | 1.0GHz | ARM® Cortex®-A9 | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10AB | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 432-TFBGA | 432-MAPBGA (13x13) | Freescale Semiconductor | Bulk | Active | 0°C ~ 95°C (TJ) | i.MX6SL | 1.0GHz | ARM® Cortex®-A9 | 1.2V, 1.8V, 3.0V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L7DVN10AA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 0°C~95°C TJ | Tray | 2011 | i.MX6SL | Obsolete | 3 (168 Hours) | MCIMX6 | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3EVN10AB | NXP USA Inc. | Datasheet | 581 | - | Min: 1 Mult: 1 | 15 Weeks | 432-TFBGA | YES | 162 | Industrial grade | -40°C~105°C TA | Tray | 2002 | i.MX6SL | e1 | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | Not Qualified | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3DVN10AA | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | 0°C~95°C TJ | Tray | i.MX6SL | Obsolete | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L3EVN10AA | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | -40°C~105°C TA | Tray | i.MX6SL | Obsolete | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2EVN10AA | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | -40°C~105°C TA | Tray | i.MX6SL | Obsolete | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L7DVN10AA | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | 0°C~95°C TJ | Tray | i.MX6SL | Obsolete | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L2DVN10AA | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | 0°C~95°C TJ | Tray | i.MX6SL | Obsolete | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6L8DVN10SA | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | 432-TFBGA | 432-MAPBGA (13x13) | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant |
MCIMX6L7DVN10AC
NXP USA Inc.
Package:Embedded - Microprocessors
22.015852
MCIMX6L3DVN10AA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L7DVN10AA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10ABR
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L2EVN10AA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10SA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3DVN10AB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L7DVN10AB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3EVN10AA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L2DVN10AA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10AA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10AB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L7DVN10AA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3EVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3DVN10AA
Rochester Electronics, LLC
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L3EVN10AA
Rochester Electronics, LLC
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L2EVN10AA
Rochester Electronics, LLC
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L7DVN10AA
Rochester Electronics, LLC
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L2DVN10AA
Rochester Electronics, LLC
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6L8DVN10SA
Rochester Electronics, LLC
Package:Embedded - Microprocessors
Price: please inquire
