The category is 'Embedded - Microprocessors'
- All Manufacturers
- Power Supplies
- RoHS Status
- Speed
- Supply Voltage
- Terminal Pitch
- Terminal Position
- uPs/uCs/Peripheral ICs Type
- HTS Code
- Number of Terminations
- Terminal Form
- Bit Size
- Surface Mount
- Power Supplies:
1.2V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MPC8347VRAGDB | NXP USA Inc. | Datasheet | 4038 |
| Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | ||||||
 | Mfr Part No MCIMX515DJM8C | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -20°C~85°C TC | Tray | 1997 | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 40 | MCIMX515 | S-PBGA-B529 | Not Qualified | 1.15V | 1.2V | 1.05V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MPC8347CVRAGDB | NXP USA Inc. | Datasheet | 68 | - | Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | ||||||
| Mfr Part No MCIMX515CJM6C | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~95°C TC | Tray | 2008 | i.MX51 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper - with Nickel barrier | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MCIMX515 | S-PBGA-B529 | Not Qualified | 1.1V | 1.2V | 0.95V | 600MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | |||||||||||
 | Mfr Part No MPC8347VVAJFB | NXP USA Inc. | Datasheet | 1715 |
| Min: 1 Mult: 1 | 12 Weeks | 672-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | ||||||
| Mfr Part No MPC8347CVVAJFB | NXP USA Inc. | Datasheet | 2097 |
| Min: 1 Mult: 1 | 12 Weeks | 672-LBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | ||||||
 | Mfr Part No MCIMX515DVK8C | NXP USA Inc. | Datasheet | 648 | - | Min: 1 Mult: 1 | 15 Weeks | 527-LFBGA | YES | Commercial grade | -20°C~85°C TC | Tray | 2008 | i.MX51 | e1 | Active | 3 (168 Hours) | 625 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 40 | MCIMX515 | S-PBGA-B625 | Not Qualified | 1.15V | 1.2V | 1.05V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.3mm | 13mm | ROHS3 Compliant | |||||||||
| Mfr Part No MPC8347CZQAGDB | NXP USA Inc. | Datasheet | 144 | - | Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | Non-RoHS Compliant | ||||||
| Mfr Part No MCIMX512CJM6C | NXP USA Inc. | Datasheet | 412 | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~95°C TC | Tray | 2008 | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MCIMX512 | S-PBGA-B529 | 1.1V | 1.2V | 0.95V | 600MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | |||||||||||
| Mfr Part No MPC8347VVAGDB | NXP USA Inc. | Datasheet | 1623 |
| Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | ||||||
| Mfr Part No MPC8347VRADDB | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 266MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | ||||||
| Mfr Part No MCIMX514AJM6C | NXP USA Inc. | Datasheet | 14 |
| Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~125°C TJ | Tray | 2008 | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MCIMX514 | S-PBGA-B529 | Not Qualified | 1.1V | 1.2V | 0.95V | 600MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MCIMX515CJM6CR2 | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~95°C TC | Tape & Reel (TR) | 2008 | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MCIMX515 | S-PBGA-B529 | Not Qualified | 1.1V | 1.2V | 0.95V | 600MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MPC8347CVVAJDB | NXP USA Inc. | Datasheet | 2726 |
| Min: 1 Mult: 1 | 12 Weeks | 672-LBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | ||||||
| Mfr Part No MCIMX515DJM8CR2 | NXP USA Inc. | Datasheet | 600 |
| Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | Commercial grade | -20°C~85°C TC | Tape & Reel (TR) | 2008 | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 40 | MCIMX515 | S-PBGA-B529 | Not Qualified | 1.15V | 1.2V | 1.05V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | |||||||||
| Mfr Part No MCIMX516AJM6C | NXP USA Inc. | Datasheet | 6080 |
| Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~125°C TJ | Tray | 2008 | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MCIMX516 | S-PBGA-B529 | Not Qualified | 1.1V | 1.2V | 0.95V | 600MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MPC8347CVRADDB | NXP USA Inc. | Datasheet | 1810 |
| Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 266MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | ||||||
| Mfr Part No MPC8347ZQADDB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 266MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | Non-RoHS Compliant | ||||||
 | Mfr Part No MCIMX514AJM6CR2 | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~125°C TJ | Tape & Reel (TR) | i.MX51 | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | S-PBGA-B529 | Not Qualified | 1.1V | 1.2V | 0.95V | 600MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||||
| Mfr Part No MPC8347CZUAJDB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 672-LBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 672 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | Non-RoHS Compliant |
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MPC8347VRAGDB
NXP USA Inc.
Package:Embedded - Microprocessors
100.110089
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MCIMX515DJM8C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8347CVRAGDB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX515CJM6C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8347VVAJFB
NXP USA Inc.
Package:Embedded - Microprocessors
195.644304
-
MPC8347CVVAJFB
NXP USA Inc.
Package:Embedded - Microprocessors
214.873334
-
MCIMX515DVK8C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8347CZQAGDB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX512CJM6C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC8347VVAGDB
NXP USA Inc.
Package:Embedded - Microprocessors
111.584211
-
MPC8347VRADDB
NXP USA Inc.
Package:Embedded - Microprocessors
88.975726
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MCIMX514AJM6C
NXP USA Inc.
Package:Embedded - Microprocessors
51.683969
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MCIMX515CJM6CR2
NXP USA Inc.
Package:Embedded - Microprocessors
101.625248
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MPC8347CVVAJDB
NXP USA Inc.
Package:Embedded - Microprocessors
64.394494
-
MCIMX515DJM8CR2
NXP USA Inc.
Package:Embedded - Microprocessors
63.648622
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MCIMX516AJM6C
NXP USA Inc.
Package:Embedded - Microprocessors
51.043014
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MPC8347CVRADDB
NXP USA Inc.
Package:Embedded - Microprocessors
156.083746
-
MPC8347ZQADDB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX514AJM6CR2
NXP USA Inc.
Package:Embedded - Microprocessors
64.759011
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MPC8347CZUAJDB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire