The category is 'Embedded - Microprocessors'
- All Manufacturers
- HTS Code
- Number of Terminations
- Package / Case
- Power Supplies
- RoHS Status
- Supply Voltage-Max (Vsup)
- Supply Voltage-Min (Vsup)
- Surface Mount
- Terminal Form
- Terminal Pitch
- Terminal Position
- Base Part Number
- Power Supplies:
3.3V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Security Features | Display & Interface Controllers | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MVF61NS151CMK50 | NXP USA Inc. | Datasheet | 1160 | - | Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e2 | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF61NS151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 16 | YES | YES | NO | YES | 16 | 16 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | ||||||||
| Mfr Part No MVF50NN151CMK40 | NXP USA Inc. | Datasheet | 6 | - | Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF50NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 400MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | 16 | YES | YES | NO | YES | 16 | CORTEX-A5 | 16 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | ||||||||
| Mfr Part No MVF51NN151CMK50 | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF51NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | 16 | YES | YES | NO | YES | 16 | CORTEX-A5 | 16 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | ||||||||
| Mfr Part No MVF51NS151CMK50 | NXP USA Inc. | Datasheet | 9 |
| Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF51NS151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | 16 | YES | YES | NO | YES | 16 | CORTEX-A5 | 16 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | |||||||
 | Mfr Part No MVF30NN151CKU26 | NXP USA Inc. | Datasheet | 8000 |
| Min: 1 Mult: 1 | 15 Weeks | 176-LQFP Exposed Pad | YES | 111 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF3xx | e3 | Active | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.23V | 0.5mm | 40 | MVF30NN151 | S-PQFP-G176 | Not Qualified | 1.26V | 3.3V | 1.16V | 266MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | 16 | YES | YES | NO | YES | CORTEX-A5 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | |||||||||||
| Mfr Part No MVF60NS151CMK50 | NXP USA Inc. | Datasheet | 345 |
| Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF60NS151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 16 | YES | YES | NO | YES | 16 | 16 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | ||||||||
 | Mfr Part No MPC855TVR50D4 | NXP USA Inc. | Datasheet | 2123 | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MPC860PZQ80D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No MPC860SRZQ50D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No MPC860TCZQ66D4 | NXP USA Inc. | Datasheet | 2376 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No MPC860ENCZQ50D4 | NXP USA Inc. | Datasheet | 119 | - | Min: 1 Mult: 1 | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No MVF60NN151CMK40 | NXP USA Inc. | Datasheet | 6 | - | Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF60NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 400MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 16 | YES | YES | NO | YES | 16 | 16 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | |||||||||
| Mfr Part No MPC860SRCZQ66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No MPC860SRVR50D4 | NXP USA Inc. | Datasheet | 144 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MPC860DEZQ50D4R2 | NXP USA Inc. | Datasheet | 152 | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No MPC860TVR50D4 | NXP USA Inc. | Datasheet | 237 | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 2004 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MPC860TZQ66D4 | NXP USA Inc. | Datasheet | 3896 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No MPC860TCVR66D4 | NXP USA Inc. | Datasheet | 436 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MVF61NN151CMK50 | NXP USA Inc. | Datasheet | 51 | - | Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF61NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 16 | YES | YES | NO | YES | 16 | 16 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | |||||||||
| Mfr Part No MVF50NN151CMK50 | NXP USA Inc. | Datasheet | 360 |
| Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF50NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | 16 | YES | YES | NO | YES | 16 | CORTEX-A5 | 16 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant |
-
MVF61NS151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MVF50NN151CMK40
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MVF51NN151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MVF51NS151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
34.235391
-
MVF30NN151CKU26
NXP USA Inc.
Package:Embedded - Microprocessors
28.690824
-
MVF60NS151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
25.848215
-
MPC855TVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860PZQ80D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860SRZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860TCZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860ENCZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MVF60NN151CMK40
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860SRCZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860SRVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860DEZQ50D4R2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860TVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860TZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MPC860TCVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MVF61NN151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MVF50NN151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
28.695643