The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (2590)
- All Manufacturers
- Package / Case
- Packaging
- Part Status
- RoHS Status
- Graphics Acceleration
- Moisture Sensitivity Level (MSL)
- Operating Temperature
- Series
- Number of Cores/Bus Width
- Voltage - I/O
- Base Part Number
- Published
- RoHS Status:
Non-RoHS Compliant
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Memory Size | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | On Chip Program ROM Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Barrel Shifter | Internal Bus Architecture | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | Height Seated (Max) | Length | RoHS Status | Lead Free |
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 | Mfr Part No SPC5200CBV400B | NXP USA Inc. | Datasheet | 798 | - | Min: 1 Mult: 1 | 12 Weeks | 272-BBGA | YES | Automotive grade | -40°C~85°C TA | Tray | 2003 | MPC52xx | e0 | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1.27mm | 30 | PC5200 | S-PBGA-B272 | 1.58V | 1.53.3V | 1.42V | 400MHz | MICROPROCESSOR | PowerPC G2_LE | 66MHz | 32 | 32 | YES | YES | AEC-Q100 | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 2.65mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No OMAP5910JGDY2 | Texas Instruments | Datasheet | 19 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 289-BGA | 289 | FLASH | -40°C~85°C TC | Tray | OMAP-59xx | e0 | Active | 3 (168 Hours) | 289 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.6V | 1mm | 150MHz | OMAP5910 | 289 | 1.6V | 1.675V | I2C, MMC, SDIO, UART, USB | 32kB | 170mA | 160kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM9TDMI | 16 | 32b | 6 | 25 | ARM | 16 | YES | YES | FIXED POINT | YES | 1.8V 2.75V 3.3V | 1 Core 32-Bit | No | SDRAM | USB 2.0 (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | Signal Processing; C55x, System Control; CP15 | MROM | NO | MULTIPLE | Keypad, LCD | 6 | 2.32mm | 19mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D27C-D1G-CUR | Microchip Technology | Datasheet | 1600 | - | Min: 1 Mult: 1 | 10 Weeks | 289-TFBGA | YES | -40°C~85°C TA | Tray | SAMA5D2 | Active | 3 (168 Hours) | 289 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.8mm | ATSAMA5D27 | S-PBGA-B289 | 1.9V | 1.7V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 16 | YES | YES | FLOATING POINT | YES | 65536 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | Multimedia; NEON™ MPE | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | 1.2mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8270CZUUPEA | NXP USA Inc. | Datasheet | 1876 | - | Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 450MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | Mfr Part No MC7448THX1267ND | NXP USA Inc. | Datasheet | 758 | - | Min: 1 Mult: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | -40°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | 1.1V | 1.31.8/2.5V | 1V | 1.267GHz | MICROPROCESSOR, RISC | PowerPC G4 | 200MHz | 32 | 36 | YES | YES | 64 | FLOATING POINT | YES | 1.5V 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | 2.8mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC852TVR100A | NXP USA Inc. | Datasheet | 16 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | 2.54mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8270CZQMIBA | NXP USA Inc. | Datasheet | 2279 | - | Min: 1 Mult: 1 | 12 Weeks | 516-BBGA | YES | -40°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8270 | S-PBGA-B516 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 266MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 2.55mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | Mfr Part No MPC755CPX400LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991 | TIN LEAD | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.9V | 400MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8270ZUUPEA | NXP USA Inc. | Datasheet | 1768 | - | Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 100MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No MC7448THX1400ND | NXP USA Inc. | Datasheet | 625 | - | Min: 1 Mult: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | -40°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.15V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | 1.2V | 1.31.8/2.5V | 1.1V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC G4 | 200MHz | 32 | 36 | YES | YES | 64 | FLOATING POINT | YES | 1.5V 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | 2.8mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8555ECPXALF | NXP USA Inc. | Datasheet | 624 | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | MPC8555 | S-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860PZQ80D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No MPC860SRZQ50D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8245TZU266D | NXP USA Inc. | Datasheet | 2251 |
| Min: 1 Mult: 1 | 12 Weeks | 352-LBGA | YES | -40°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 1.9V | 23.3V | 1.7V | 266MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8280ZUUPEA | NXP USA Inc. | Datasheet | 801 | - | Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | Mfr Part No MC7447AHX1167NB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Not For New Designs | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | 1.25V | 1.167GHZ | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | 3.24mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8241LZQ200D | NXP USA Inc. | Datasheet | 32 | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC8241 | S-PBGA-B357 | 1.9V | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | 2.56mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC860TCZQ66D4 | NXP USA Inc. | Datasheet | 2376 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8247ZQTIEA | NXP USA Inc. | Datasheet | 22 | - | Min: 1 Mult: 1 | 12 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8247 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8245LZU300D | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 352-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 2.1V | 23.3V | 1.7V | 300MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | Non-RoHS Compliant |
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SPC5200CBV400B
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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OMAP5910JGDY2
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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ATSAMA5D27C-D1G-CUR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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MPC8270CZUUPEA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC7448THX1267ND
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC852TVR100A
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8270CZQMIBA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC755CPX400LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8270ZUUPEA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC7448THX1400ND
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8555ECPXALF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860PZQ80D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860SRZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8245TZU266D
NXP USA Inc.
Package:Embedded - Microprocessors
121.153712
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MPC8280ZUUPEA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC7447AHX1167NB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8241LZQ200D
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860TCZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8247ZQTIEA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8245LZU300D
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire