The category is 'Embedded - Microprocessors'
- All Manufacturers
- Additional Interfaces
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- RAM Controllers
- Series
- Speed
- Voltage - I/O
- Co-Processors/DSP
- Base Part Number
- Series:
M683xx
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MC68302EH16C | NXP USA Inc. | Datasheet | 6 | - | Min: 1 Mult: 1 | 8 Weeks | 132-BQFP Bumpered | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 132 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 40 | MC68302 | S-PQFP-G132 | 16MHz | MICROCONTROLLER, RISC | M68000 | NO | YES | NO | NO | 20 | 16 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | FLASH | ROHS3 Compliant | |||||||||||||||||||
 | Mfr Part No MC68360AI25L | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 8 Weeks | 240-BFQFP | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 40 | MC68360 | S-PQFP-G240 | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 68000 | 1.25 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MC68302EH25C | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 132-BQFP Bumpered | 0°C~70°C TA | Tray | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | UNSPECIFIED | UNSPECIFIED | 5V | MC68302 | 5.5V | 4.5V | 25MHz | MICROPROCESSOR CIRCUIT | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No MC68EN360AI25VL | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 240-BFQFP | YES | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68EN360 | S-PQFP-G240 | 5.25V | 4.75V | 25MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | NO | 32 | 32 | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 4.15mm | 31.305mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MC68EN360CAI25L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 240-BFQFP | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 40 | MC68EN360 | S-PQFP-G240 | 25MHz | RISC MICROCONTROLLER | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | |||||||||||||||||||||||||
| Mfr Part No MC68EN360AI25L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 240-BFQFP | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 40 | MC68EN360 | S-PQFP-G240 | 25MHz | RISC MICROCONTROLLER | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | |||||||||||||||||||||||||
| Mfr Part No MC68302EH20C | NXP USA Inc. | Datasheet | 454 | - | Min: 1 Mult: 1 | 8 Weeks | 132-BQFP Bumpered | 0°C~70°C TA | Tray | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | UNSPECIFIED | UNSPECIFIED | 5V | MC68302 | 5.5V | 4.5V | 20MHz | MICROPROCESSOR CIRCUIT | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No MC68302AG33C | NXP USA Inc. | Datasheet | 68 |
| Min: 1 Mult: 1 | 8 Weeks | 144-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | MC68302 | 33MHz | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68360CAI25L | NXP USA Inc. | Datasheet | 1040 | - | Min: 1 Mult: 1 | 240-BFQFP | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 40 | MC68360 | S-PQFP-G240 | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 68000 | 1.25 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No MC68LC302AF16CT | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 16MHz | MICROCONTROLLER, RISC | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No MC68LC302AF25CT | NXP USA Inc. | Datasheet | 93 | - | Min: 1 Mult: 1 | 8 Weeks | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 25MHz | MICROCONTROLLER, RISC | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No MC68EN360AI33L | NXP USA Inc. | Datasheet | 194 | - | Min: 1 Mult: 1 | 240-BFQFP | YES | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68EN360 | S-PQFP-G240 | 5.25V | 4.75V | 33MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | 32 | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 4.15mm | 31.305mm | ROHS3 Compliant | ||||||||||||
| Mfr Part No M68LC302CAF16VCT | NXP USA Inc. | Datasheet | 60 | - | Min: 1 Mult: 1 | 8 Weeks | 100-LQFP | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 0.5mm | 40 | M68LC302 | S-PQFP-G100 | 166MHz | SERIAL IO/COMMUNICATION CONTROLLER, LAN | M68000 | 16MHz | 24 | YES | NO | 16 | 3.3V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | 4 | Communications; RISC CPM | 1.25 MBps | 1.7mm | 14mm | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No MC68360AI33L | NXP USA Inc. | Datasheet | 16 | - | Min: 1 Mult: 1 | 8 Weeks | 240-BFQFP | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 40 | MC68360 | S-PQFP-G240 | 33MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 68000 | 1.25 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MC68302AG16C | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 144-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | MC68302 | 16MHz | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68LC302AF16VCT | NXP USA Inc. | Datasheet | 61 |
| Min: 1 Mult: 1 | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 16MHz | MICROCONTROLLER, RISC | M68000 | 3.3V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No MC68EN360VR33L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | 5.25V | 4.75V | 33MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | 32 | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 1.86mm | 25mm | ROHS3 Compliant | |||||||||||
| Mfr Part No MC68340AG25E | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 144-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | MC68340 | 25MHz | CPU32 | 5.0V | 1 Core 32-Bit | No | DRAM | USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68EN360VR25L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | 5.25V | 4.75V | 25MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | 32 | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 1.86mm | 25mm | ROHS3 Compliant | |||||||||||
| Mfr Part No MC68EN360VR25VL | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | 5.25V | 4.75V | 25MHz | MICROPROCESSOR, RISC | CPU32+ | 33.34MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | 1.86mm | 25mm | ROHS3 Compliant |
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MC68302EH16C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68360AI25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68302EH25C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68EN360AI25VL
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68EN360CAI25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68EN360AI25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68302EH20C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68302AG33C
NXP USA Inc.
Package:Embedded - Microprocessors
77.540132
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MC68360CAI25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68LC302AF16CT
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68LC302AF25CT
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68EN360AI33L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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M68LC302CAF16VCT
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68360AI33L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68302AG16C
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68LC302AF16VCT
NXP USA Inc.
Package:Embedded - Microprocessors
65.137535
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MC68EN360VR33L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68340AG25E
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MC68EN360VR25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68EN360VR25VL
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire