The category is 'Embedded - Microprocessors'
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- Series:
MPC8xx
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MPC875CVR133 | NXP USA Inc. | Datasheet | 160 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.54mm | 23mm | ROHS3 Compliant | ||
| Mfr Part No MPC852TCVR100A | NXP USA Inc. | Datasheet | 160 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~100°C TA | Tray | 2004 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||
 | Mfr Part No MPC860DEZQ50D4R2 | NXP USA Inc. | Datasheet | 152 | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||
| Mfr Part No MPC860TVR50D4 | NXP USA Inc. | Datasheet | 237 | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 2004 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||
| Mfr Part No MPC880VR66 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC880 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||
| Mfr Part No MPC860TZQ66D4 | NXP USA Inc. | Datasheet | 3896 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||
| Mfr Part No MPC860TCVR66D4 | NXP USA Inc. | Datasheet | 436 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||
| Mfr Part No MPC875CZT66 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.54mm | 23mm | Non-RoHS Compliant | ||
| Mfr Part No MPC852TVR66A | NXP USA Inc. | Datasheet | - |
| Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||
| Mfr Part No MPC860TZQ50D4 | NXP USA Inc. | Datasheet | 3400 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||
| Mfr Part No MPC852TZT50A | NXP USA Inc. | Datasheet | 462 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 50MHz | MICROPROCESSOR, RISC | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | 2.54mm | 23mm | Non-RoHS Compliant | |||
| Mfr Part No MPC860DTVR50D4 | NXP USA Inc. | Datasheet | 2113 |
| Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||
| Mfr Part No MPC875VR66 | NXP USA Inc. | Datasheet | 2838 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.54mm | 23mm | ROHS3 Compliant | ||
| Mfr Part No MPC860ENCVR50D4 | NXP USA Inc. | Datasheet | 1580 | - | Min: 1 Mult: 1 | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||
| Mfr Part No MPC855TZQ66D4 | NXP USA Inc. | Datasheet | 3 | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||
| Mfr Part No MPC860DECZQ50D4 | NXP USA Inc. | Datasheet | 156 | - | Min: 1 Mult: 1 | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||
| Mfr Part No MPC885VR66 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.52mm | 25mm | ROHS3 Compliant | ||
| Mfr Part No MPC860DTZQ80D4 | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||
| Mfr Part No MPC855TZQ80D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||
| Mfr Part No MPC850DSLVR50BU | NXP USA Inc. | Datasheet | 12 | - | Min: 1 Mult: 1 | 256-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant |
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MPC875CVR133
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC852TCVR100A
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DEZQ50D4R2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860TVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC880VR66
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860TZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860TCVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC875CZT66
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC852TVR66A
NXP USA Inc.
Package:Embedded - Microprocessors
51.467096
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MPC860TZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC852TZT50A
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DTVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
204.931559
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MPC875VR66
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860ENCVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC855TZQ66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DECZQ50D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC885VR66
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC860DTZQ80D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC855TZQ80D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850DSLVR50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire