The category is 'Embedded - Microprocessors'
- All Manufacturers
- Additional Interfaces
- Co-Processors/DSP
- Core Processor
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- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- RAM Controllers
- Security Features
- Series
- Series:
i.MX6S
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Mfr | Number of I/Os | Package | Product Status | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MCIMX6S7CVM08AD | NXP USA Inc. | Datasheet | 192 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | 7 | -40°C~105°C TA | Tray | i.MX6S | Obsolete | 3 (168 Hours) | 624 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | ARM® Cortex®-A9 | 16 | YES | 64 | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCIMX6S1AVM08ABR | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | Not For New Designs | 3 (168 Hours) | 624 | 8542.31.00.01 | MCIMX6 | Not Qualified | 1.05/1.5V | 800MHz | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No MCIMX6S1AVM08ACR | NXP USA Inc. | Datasheet | 8000 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S4AVM08ABR | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | Not For New Designs | 3 (168 Hours) | 624 | 8542.31.00.01 | MCIMX6 | Not Qualified | 1.05/1.5V | 800MHz | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No MCIMX6S5DVM10ABR | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | 0°C~95°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | Not For New Designs | 3 (168 Hours) | 624 | 8542.31.00.01 | MCIMX6 | Not Qualified | 1.05/1.5V | 1.0GHz | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No MCIMX6S6AVM10AC | NXP USA Inc. | Datasheet | 80000 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No MCIMX6S7CVM08ACR | NXP USA Inc. | Datasheet | 5 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | -40°C~105°C TA | Tape & Reel (TR) | 2002 | i.MX6S | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S1AVM08AD | NXP USA Inc. | Datasheet | 144 | - | Min: 1 Mult: 1 | 14 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MCIMX6S5EVM10ADR | NXP USA Inc. | Datasheet | 400 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | -20°C~105°C TJ | Tape & Reel (TR) | i.MX6S | Active | 3 (168 Hours) | 1GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S7CVM08ADR | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | -40°C~105°C TA | Tape & Reel (TR) | i.MX6S | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S5EVM10ABR | NXP USA Inc. | Datasheet | 8000 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | Not For New Designs | 3 (168 Hours) | 624 | 8542.31.00.01 | MCIMX6 | Not Qualified | 1.05/1.5V | 1.0GHz | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No MCIMX6S1AVM08ADR | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 14 Weeks | 624-LFBGA | -40°C~125°C TJ | Tape & Reel (TR) | i.MX6S | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S6AVM08AD | NXP USA Inc. | Datasheet | 2880 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MCIMX6S5DVM10ADR | NXP USA Inc. | Datasheet | 7 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | 0°C~95°C TJ | Tape & Reel (TR) | i.MX6S | Active | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S1AVM10AC | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | -40°C~125°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 5A992 | 8542.31.00.01 | 1GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S4AVM10AC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No MCIMX6S4AVM08ADR | NXP USA Inc. | Datasheet | 10 |
| Min: 1 Mult: 1 | 12 Weeks | 624-LFBGA | -40°C~125°C TJ | Tape & Reel (TR) | i.MX6S | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6S8DVM10AD | NXP USA Inc. | Datasheet | 80 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | 14 | 0°C~95°C TJ | Tray | i.MX6S | Active | 3 (168 Hours) | 624 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | ARM® Cortex®-A9 | 26 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCIMX6S6AVM08ADR | NXP USA Inc. | Datasheet | 367 |
| Min: 1 Mult: 1 | 14 Weeks | 624-LFBGA | -40°C~125°C TJ | Tape & Reel (TR) | i.MX6S | Active | 3 (168 Hours) | 260 | 40 | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6S4AVM08ABR | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | 624-LFBGA | 624-MAPBGA (21x21) | Freescale Semiconductor | Bulk | Active | -40°C ~ 125°C (TJ) | i.MX6S | 800MHz | ARM® Cortex®-A9 | 1.8V, 2.5V, 2.8V, 3.3V | 10/100/1000Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - |
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MCIMX6S7CVM08AD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6S1AVM08ABR
NXP USA Inc.
Package:Embedded - Microprocessors
35.830060
-
MCIMX6S1AVM08ACR
NXP USA Inc.
Package:Embedded - Microprocessors
40.132344
-
MCIMX6S4AVM08ABR
NXP USA Inc.
Package:Embedded - Microprocessors
37.427363
-
MCIMX6S5DVM10ABR
NXP USA Inc.
Package:Embedded - Microprocessors
32.632082
-
MCIMX6S6AVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
67.898180
-
MCIMX6S7CVM08ACR
NXP USA Inc.
Package:Embedded - Microprocessors
50.899061
-
MCIMX6S1AVM08AD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6S5EVM10ADR
NXP USA Inc.
Package:Embedded - Microprocessors
48.884733
-
MCIMX6S7CVM08ADR
NXP USA Inc.
Package:Embedded - Microprocessors
67.153778
-
MCIMX6S5EVM10ABR
NXP USA Inc.
Package:Embedded - Microprocessors
40.198043
-
MCIMX6S1AVM08ADR
NXP USA Inc.
Package:Embedded - Microprocessors
35.830060
-
MCIMX6S6AVM08AD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6S5DVM10ADR
NXP USA Inc.
Package:Embedded - Microprocessors
36.550369
-
MCIMX6S1AVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
37.126395
-
MCIMX6S4AVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6S4AVM08ADR
NXP USA Inc.
Package:Embedded - Microprocessors
37.427363
-
MCIMX6S8DVM10AD
NXP USA Inc.
Package:Embedded - Microprocessors
36.031548
-
MCIMX6S6AVM08ADR
NXP USA Inc.
Package:Embedded - Microprocessors
59.705125
-
MCIMX6S4AVM08ABR
Freescale
Package:Embedded - Microprocessors
Price: please inquire