The category is 'Embedded - Microprocessors'
- All Manufacturers
- Additional Interfaces
- Co-Processors/DSP
- Core Processor
- Display & Interface Controllers
- Ethernet
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- RAM Controllers
- Security Features
- Series
- Series:
i.MX6SX
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MCIMX6X3EVK10AB | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | 1.3mm | 14mm | ROHS3 Compliant | ||||||||
 | Mfr Part No MCIMX6X1CVO08AB | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | ||||||||
 | Mfr Part No MCIMX6X4AVM08AB | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | 14 | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B529 | 1.5V | 1.275V | 200MHz, 800MHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9, ARM® Cortex®-M4 | 16 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 2 | Multimedia; NEON™ MPE | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | 1.52mm | 19mm | ROHS3 Compliant | |||||||||
| Mfr Part No MCIMX6X1AVO08AB | NXP USA Inc. | Datasheet | 72 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | 14 | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | Active | 3 (168 Hours) | 400 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | ||||||||||||
| Mfr Part No MCIMX6X2EVN10AB | NXP USA Inc. | Datasheet | 62 | - | Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | 179 | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B400 | 1.5V | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | 15 | YES | 32 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | |||||||||
| Mfr Part No MCIMX6X3EVN10AB | NXP USA Inc. | Datasheet | 7 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | 179 | -20°C~105°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B400 | 1.5V | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | 15 | YES | 32 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | |||||||||
| Mfr Part No MCIMX6X2AVN08AB | NXP USA Inc. | Datasheet | 1 | - | Min: 1 Mult: 1 | 26 Weeks | 400-LFBGA | YES | 14 | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 2 | Multimedia; NEON™ MPE | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | |||||||||
| Mfr Part No MCIMX6X4CVM08AB | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6SX | Active | 3 (168 Hours) | 529 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | S-PBGA-B529 | 1.5V | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | 1.5mm | 19mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MCIMX6X4AVM08AC | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 14 Weeks | 529-LFBGA | -40°C~125°C TJ | Tray | 2017 | i.MX6SX | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 200MHz, 800MHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No MCIMX6X3CVO08AB | NXP USA Inc. | Datasheet | 168 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | -40°C~105°C TA | Tray | 2013 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | ||||||||
| Mfr Part No MCIMX6X3EVO10AB | NXP USA Inc. | Datasheet | 104 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | 179 | -20°C~105°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B400 | 1.5V | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | 15 | YES | 32 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | |||||||||
| Mfr Part No MCIMX6X3CVN08AB | NXP USA Inc. | Datasheet | 108 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | ||||||||
| Mfr Part No MCIMX6X1EVO10AB | NXP USA Inc. | Datasheet | 4 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | 179 | Commercial grade | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | Active | 3 (168 Hours) | 400 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B400 | 1.5V | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | 15 | YES | 32 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MCIMX6X1CVK08AB | NXP USA Inc. | Datasheet | 24 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.3mm | 14mm | ROHS3 Compliant | ||||||||
| Mfr Part No MCIMX6X4EVM10AB | NXP USA Inc. | Datasheet | 7710 | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6SX | Active | 3 (168 Hours) | 529 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B529 | 1.5V | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | 1.5mm | 19mm | ROHS3 Compliant | ||||||||||||
| Mfr Part No MCIMX6X2EVN10ABR | NXP USA Inc. | Datasheet | 437 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 32 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.27mm | 17mm | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No MCIMX6X4EVM10AC | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | Active | 3 (168 Hours) | 260 | 40 | 227MHz, 1GHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6X1EVK10AC | NXP USA Inc. | Datasheet | 7 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 227MHz, 1GHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No MCIMX6X1AVK08AB | NXP USA Inc. | Datasheet | 800 |
| Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | 14 | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.65mm | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.3mm | 14mm | ROHS3 Compliant | ||||||||||
| Mfr Part No MCIMX6X3CVN08AC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | -40°C~105°C TA | Tray | 2017 | i.MX6SX | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 200MHz, 800MHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | ROHS3 Compliant |
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MCIMX6X3EVK10AB
NXP USA Inc.
Package:Embedded - Microprocessors
28.320983
-
MCIMX6X1CVO08AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6X4AVM08AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6X1AVO08AB
NXP USA Inc.
Package:Embedded - Microprocessors
41.830105
-
MCIMX6X2EVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6X3EVN10AB
NXP USA Inc.
Package:Embedded - Microprocessors
77.227741
-
MCIMX6X2AVN08AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6X4CVM08AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6X4AVM08AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6X3CVO08AB
NXP USA Inc.
Package:Embedded - Microprocessors
21.850802
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MCIMX6X3EVO10AB
NXP USA Inc.
Package:Embedded - Microprocessors
21.827923
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MCIMX6X3CVN08AB
NXP USA Inc.
Package:Embedded - Microprocessors
29.043961
-
MCIMX6X1EVO10AB
NXP USA Inc.
Package:Embedded - Microprocessors
41.783729
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MCIMX6X1CVK08AB
NXP USA Inc.
Package:Embedded - Microprocessors
27.970041
-
MCIMX6X4EVM10AB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6X2EVN10ABR
NXP USA Inc.
Package:Embedded - Microprocessors
51.706954
-
MCIMX6X4EVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX6X1EVK10AC
NXP USA Inc.
Package:Embedded - Microprocessors
43.423026
-
MCIMX6X1AVK08AB
NXP USA Inc.
Package:Embedded - Microprocessors
28.338637
-
MCIMX6X3CVN08AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire