The category is 'Embedded - Microprocessors'
- All Manufacturers
- Additional Interfaces
- Co-Processors/DSP
- Core Processor
- Display & Interface Controllers
- Ethernet
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- RAM Controllers
- Security Features
- Series
- Series:
i.MX7S
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Mfr | Package | Product Status | Usage Level | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MCIMX7S5EVM08SC | NXP USA Inc. | Datasheet | 157 |
| Min: 1 Mult: 1 | 25 Weeks | 541-LFBGA | YES | -20°C~105°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 541 | 8542.31.00.01 | BOTTOM | BALL | 1V | 0.75mm | S-PBGA-B541 | 1.155V | 0.95V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | 1.42mm | 19mm | ROHS3 Compliant | ||||||||||
 | Mfr Part No MCIMX7S3DVK08SD | NXP USA Inc. | Datasheet | 4 |
| Min: 1 Mult: 1 | 16 Weeks | 488-TFBGA | 0°C~95°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 8542.31.00.01 | 260 | 40 | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No MCIMX7S5EVM08SD | NXP USA Inc. | Datasheet | 39110 | - | Min: 1 Mult: 1 | 16 Weeks | 541-LFBGA | Commercial grade | -20°C~105°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 8542.31.00.01 | 260 | 40 | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ROHS3 Compliant | |||||||||||||||||||||||||
 | Mfr Part No MCIMX7S3EVK08SD | NXP USA Inc. | Datasheet | 138 | - | Min: 1 Mult: 1 | 16 Weeks | 488-TFBGA | -20°C~105°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 8542.31.00.01 | 260 | 40 | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ROHS3 Compliant | ||||||||||||||||||||||||||
 | Mfr Part No MCIMX7S5EVK08SD | NXP USA Inc. | Datasheet | 10 | - | Min: 1 Mult: 1 | 16 Weeks | 488-TFBGA | -20°C~105°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 8542.31.00.01 | 260 | 40 | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No MCIMX7S3DVK08SC | NXP USA Inc. | Datasheet | 81 |
| Min: 1 Mult: 1 | 18 Weeks | 488-TFBGA | YES | 0°C~95°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 488 | 8542.31.00.01 | BOTTOM | BALL | 1V | 0.4mm | S-PBGA-B488 | 1.155V | 0.95V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | 1.1mm | 12mm | ROHS3 Compliant | ||||||||||
 | Mfr Part No MCIMX7S3DVK08SC | Freescale | Datasheet | 85 |
| Min: 1 Mult: 1 | Surface Mount | 488-TFBGA | 488-TFBGA (12x12) | Freescale Semiconductor | Bulk | Active | 0°C ~ 95°C (TJ) | i.MX7S | 800MHz | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V, 3.3V | 10/100/1000Mbps (1) | 1 Core, 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC97, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | ||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7S3EVK08SC | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 17 Weeks | 488-TFBGA | YES | -20°C~105°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 488 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.4mm | 40 | S-PBGA-B488 | 1.155V | 0.95V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | 1.1mm | 12mm | ROHS3 Compliant | ||||||||
| Mfr Part No MCIMX7S5EVK08SC | NXP USA Inc. | Datasheet | 40 |
| Min: 1 Mult: 1 | 17 Weeks | 488-TFBGA | YES | Commercial grade | -20°C~105°C TJ | Tray | 2012 | i.MX7S | Active | 3 (168 Hours) | 488 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.4mm | 40 | S-PBGA-B488 | 1.155V | 0.95V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | 32 | 16 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | 1.1mm | 12mm | ROHS3 Compliant |
-
MCIMX7S5EVM08SC
NXP USA Inc.
Package:Embedded - Microprocessors
20.343214
-
MCIMX7S3DVK08SD
NXP USA Inc.
Package:Embedded - Microprocessors
27.823826
-
MCIMX7S5EVM08SD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX7S3EVK08SD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX7S5EVK08SD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX7S3DVK08SC
NXP USA Inc.
Package:Embedded - Microprocessors
23.091266
-
MCIMX7S3DVK08SC
Freescale
Package:Embedded - Microprocessors
20.432226
-
MCIMX7S3EVK08SC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MCIMX7S5EVK08SC
NXP USA Inc.
Package:Embedded - Microprocessors
24.937223