The category is 'Embedded - Microprocessors'
- All Manufacturers
- Additional Interfaces
- Co-Processors/DSP
- Core Processor
- Display & Interface Controllers
- Ethernet
- Graphics Acceleration
- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Part Status
- Series
- Series:
i.MX8MD
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | Core Processor | Clock Frequency | Boundary Scan | RAM (words) | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MIMX8MD6CVAHZAA | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 621-FBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MD | Not For New Designs | 3 (168 Hours) | 621 | BOTTOM | BALL | 260 | 1V | 0.65mm | compliant | NOT SPECIFIED | S-PBGA-B621 | 1.05V | 0.9V | 1.3GHz | ARM® Cortex®-A53 | 40MHz | YES | 160K | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | 2.18mm | 17mm | RoHS Compliant | ||||
| Mfr Part No MIMX8MD6DVAJZAA | NXP USA Inc. | Datasheet | 22 |
| Min: 1 Mult: 1 | 16 Weeks | 621-FBGA, FCBGA | Commercial grade | 0°C~95°C TJ | Tray | 2016 | i.MX8MD | Not For New Designs | 3 (168 Hours) | 260 | compliant | NOT SPECIFIED | 1.5GHz | ARM® Cortex®-A53 | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | RoHS Compliant | |||||||||||||||||
| Mfr Part No MIMX8MD6CVAHZAB | NXP USA Inc. | Datasheet | 79 | - | Min: 1 Mult: 1 | 15 Weeks | 621-FBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MD | Active | 3 (168 Hours) | 621 | BOTTOM | BALL | 1V | 0.65mm | S-PBGA-B621 | 1.05V | 0.9V | 1.3GHz | ARM® Cortex®-A53 | 40MHz | YES | 160K | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | 2.18mm | 17mm | ROHS3 Compliant | ||||||
| Mfr Part No MIMX8MD6DVAJZAB | NXP USA Inc. | Datasheet | 120 | - | Min: 1 Mult: 1 | 15 Weeks | 621-FBGA, FCBGA | 0°C~95°C TJ | Tray | i.MX8MD | Active | 3 (168 Hours) | 1.5GHz | ARM® Cortex®-A53 | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | ROHS3 Compliant |
-
MIMX8MD6CVAHZAA
NXP USA Inc.
Package:Embedded - Microprocessors
64.602384
-
MIMX8MD6DVAJZAA
NXP USA Inc.
Package:Embedded - Microprocessors
61.065311
-
MIMX8MD6CVAHZAB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
-
MIMX8MD6DVAJZAB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire