The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Frequency(Max) | Memory Types | Number of I/Os | Operating Temperature (Max.) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Data Bus Width | Halogen Free | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Number of External Interrupts | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No OMAP3530ECBC | Texas Instruments | Datasheet | 1332 |
| Min: 1 Mult: 1 | 16 Weeks | ACTIVE (Last Updated: 6 days ago) | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | Active | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.5mm | 600MHz | OMAP3530 | 515 | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.0V | 3 | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 950μm | 14mm | 14mm | 630μm | No | Non-RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860ENCVR66D4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8572LVTAULE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 1023-BFBGA, FCBGA | 0°C~105°C TA | Tray | 2008 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8572 | 1.333GHz | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No Z84C0010VEG | Zilog | Datasheet | 1240 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 44-LCC (J-Lead) | 44 | ROMless | -40°C~100°C TA | Tube | 2002 | Z80 | e3 | yes | Active | 3 (168 Hours) | 44 | 3A001.A.2.C | Matte Tin (Sn) | DRAM MEMORY REFRESH COUNTER | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | 10MHz | 40 | Z84C00 | 44 | 5V | 5V | 5V | 64kB | MICROPROCESSOR | 8 | 8b | 16 | NO | YES | FIXED POINT | NO | 0 | 5.0V | 1 Core 8-Bit | No | 2 | 4.57mm | 16.5862mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P1013NSE2LFB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1013 | S-PBGA-B689 | 1.05V | 0.95V | 1.055GHz | MICROPROCESSOR | PowerPC e500v2 | 133MHz | 32 | YES | YES | FLOATING POINT | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | Security; SEC | Cryptography, Random Number Generator | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6QP4AVT1AB | NXP USA Inc. | Datasheet | 1913 |
| Min: 1 Mult: 1 | 12 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | i.MX6QP | Active | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC2141FBD64,118 | NXP Semiconductors / Freescale | Datasheet | - | - | Min: 1 Mult: 1 | 64 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68360ZQ25LR2 | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | BGA | 357 | 2.1737g | 25MHz | 70°C | 0°C | 25MHz | Ethernet, UART | 2.5kB | 32b | Not Halogen Free | Coldfire | 1 | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX258CVM4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | -40°C~85°C TA | Tray | 2008 | i.MX25 | e1 | Obsolete | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX258 | S-PBGA-B400 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | 26 | YES | YES | 16 | FIXED POINT | YES | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | Keypad, LCD, Touchscreen | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6X1CVO08AC | NXP USA Inc. | Datasheet | 80000 | - | Min: 1 Mult: 1 | 15 Weeks | 400-LFBGA | YES | 14 | -40°C~105°C TA | Tray | 2017 | i.MX6SX | Active | 3 (168 Hours) | 400 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1012AXN7EKB | NXP USA Inc. | Datasheet | 4 |
| Min: 1 Mult: 1 | 24 Weeks | 211-VFLGA | -40°C~105°C | 2016 | QorIQ® Layerscape | Active | 3 (168 Hours) | 600MHz | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | USB 2.0 (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC7448VS1400ND | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 360-CLGA, FCCLGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | Active | 1 (Unlimited) | 360 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | 245 | 1.15V | 1.27mm | 30 | MC7448 | S-CBGA-N360 | 1.2V | 1.31.8/2.5V | 1.1V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1400MHz | 32 | NO | YES | FIXED POINT | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FWIXP420BD | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | BGA | 492 | 70°C | Bulk | 2004 | Discontinued | 1 (Unlimited) | 492 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 225 | 1.3V | 1.27mm | 533MHz | NOT SPECIFIED | 492 | Not Qualified | 1.33.3V | COMMERCIAL | 1.3V | MICROPROCESSOR, RISC | 32 | 32 | YES | NO | 32 | FIXED POINT | YES | 2.59mm | 35mm | 35mm | RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC755BRX300LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 1 (Unlimited) | 360 | 3A991 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC755 | S-CBGA-B360 | 2.1V | 1.8V | 300MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 3.2mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AM1806BZCE3 | Texas Instruments | Datasheet | 24987 | - | Min: 1 Mult: 1 | Copper, Silver, Tin | Surface Mount | 361-LFBGA | 361 | 0°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | AM1806 | 361 | 1.2V | 1.32V | I2C, SPI, UART, USB | 1.32V | 1.14V | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 23 | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 3 | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 1.4mm | 16mm | ROHS3 Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XOMAP3503BCBB | Texas Instruments | Datasheet | 1200 | - | Min: 1 Mult: 1 | Surface Mount | 515-VFBGA, FCBGA | 515 | FLASH | 188 | 0°C~90°C TJ | Tray | OMAP-35xx | Obsolete | 4 (72 Hours) | 515 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.5mm | 600MHz | OMAP3503 | 515 | 3V | 1.35V | I2C, MMC, SDIO, UART, USB | 256kB | 2mA | 64kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM® Cortex®-A8 | 32b | 12 | 26 | YES | YES | FLOATING POINT | 1.8V 3.0V | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | NO | MULTIPLE | LCD | 1mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6D5EZK08AD | NXP USA Inc. | Datasheet | 30844 | - | Min: 1 Mult: 1 | 15 Weeks | 569-LFBGA | YES | Commercial grade | -20°C~105°C TJ | Tray | 2002 | i.MX6D | e1 | Active | 3 (168 Hours) | 569 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.4mm | 40 | S-PBGA-B569 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.25mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8560VTAQFB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 784-BBGA, FCBGA | 0°C~105°C TA | Tray | 2002 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8560 | 1.0GHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HD63C09EP | Hitachi | Datasheet | 17 | - | Min: 1 Mult: 1 | NO | e0 | 40 | Tin/Lead (Sn/Pb) | 75°C | -20°C | DUAL | THROUGH-HOLE | 5V | 2.54mm | 40 | R-PDIP-T40 | Not Qualified | 5V | COMMERCIAL EXTENDED | 5.5V | 4.5V | 3 MHz | MICROPROCESSOR | 3MHz | 8 | 8b | 16b | NO | YES | FIXED POINT | NO | 0 | 3 | 5.06mm | 52.8mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1046ASE8P1A | NXP USA Inc. | Datasheet | 800 |
| Min: 1 Mult: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | Active | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant |
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OMAP3530ECBC
Texas Instruments
Package:Embedded - Microprocessors
38.457137
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MPC860ENCVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8572LVTAULE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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Z84C0010VEG
Zilog
Package:Embedded - Microprocessors
5.092816
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P1013NSE2LFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6QP4AVT1AB
NXP USA Inc.
Package:Embedded - Microprocessors
181.420280
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LPC2141FBD64,118
NXP Semiconductors / Freescale
Package:Embedded - Microprocessors
Price: please inquire
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MC68360ZQ25LR2
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX258CVM4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6X1CVO08AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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LS1012AXN7EKB
NXP USA Inc.
Package:Embedded - Microprocessors
22.047898
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MC7448VS1400ND
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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FWIXP420BD
Intel
Package:Embedded - Microprocessors
Price: please inquire
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MPC755BRX300LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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AM1806BZCE3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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XOMAP3503BCBB
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6D5EZK08AD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8560VTAQFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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HD63C09EP
Hitachi
Package:Embedded - Microprocessors
Price: please inquire
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LS1046ASE8P1A
NXP USA Inc.
Package:Embedded - Microprocessors
100.316701