The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Brand | Cache Memory | Code Name | CPU Configuration - Max | Data Bus Width (bit) | ECCN (US) | Embedded Options | Factory Pack QuantityFactory Pack Quantity | Family Name | Frequency(Max) | HTS | I2C | I2S | Ihs Manufacturer | Instruction Set Architecture | Lead Shape | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Maximum Speed (MHz) | Memory Types | Moisture Sensitive | Mounting | Mounting Styles | Multiply Accumulate | Number of CPU Cores | Number of Displays Supported | Number of I/Os | Number of Memory Channels | Operating Temperature (Max.) | Operating Temperature (Min.) | Package Body Material | Package Code | Package Description | Package Length | Package Shape | Package Style | Package Width | Part # Aliases | Part Life Cycle Code | PCB changed | PCIe Configurations | PCIe Revision | Processor Series | Risk Rank | RoHS | Standard Package Name | Supplier Package | TDP - Max | Tradename | UART | Unit Weight | USART | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Family | Data Bus Width | PWM Channels | Address Bus Width | Product Type | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of Cores | Number of External Interrupts | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Product | SPI | CAN | Product Category | Device Core | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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![]() | Mfr Part No LS2044ASN7TTB | NXP USA Inc. | Datasheet | 2046 |
| Min: 1 Mult: 1 | 18 Weeks | 1292-BFBGA, FCBGA | 0°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A72 | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 4 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P1014NXN5HHB | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 12 Weeks | 425-FBGA | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 425 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1014 | S-PBGA-B425 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | FLOATING POINT | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8360CVVAJDG | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 740-LBGA | YES | -40°C~105°C TA | Tray | 2006 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.35V | 1.8/2.53.3V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 1.69mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM3352ZCZASUS | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | -40°C~105°C TJ | Tray | Sitara™ | Obsolete | 3 (168 Hours) | AM3352 | ARM® Cortex®-A8 | ARM | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ET80960JA3V252 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP | 132 | 25MHz | Bulk | 132 | 100°C | -40°C | 8542.31.00.01 | QUAD | GULL WING | 3.3V | 0.635mm | 25MHz | 3.3V | INDUSTRIAL | 3V | 3.45V | 3.15V | MICROPROCESSOR, RISC | 32 | No | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LS1012ASE7EKB | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 24 Weeks | 211-VFLGA | 0°C~105°C | 2016 | QorIQ® Layerscape | Active | 3 (168 Hours) | 600MHz | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | USB 2.0 (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R7S721001VLBG#AC0 | Renesas Electronics America | Datasheet | 13 |
| Min: 1 Mult: 1 | 20 Weeks | 324-BGA | YES | 324 | ROMless | 147 | -40°C~85°C TA | Tray | 2018 | RZ/A1H | yes | Active | 3 (168 Hours) | 256 | QUAD | GULL WING | 1.18V | 0.4mm | 400MHz | 324 | 1.26V | 1.1V | CAN, EBI/EMI, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB | External | MICROCONTROLLER, RISC | ARM® Cortex®-A9 | DMA, POR, PWM, WDT | 32 | YES | YES | YES | 26 | ARM | 32 | 1.2V 3.3V | 10/100Mbps (1), 100Mbps (1) | 1 Core 32-Bit | Yes | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | DVD, VDC | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P5020NSE1VNB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P5 | e1 | Obsolete | 3 (168 Hours) | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | P5020 | S-PBGA-B1295 | 1.15V | 1.05V | 2.0GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 166MHz | 16 | YES | YES | 64 | FIXED POINT | YES | 1Gbps (5), 10Gbps (1) | 2 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P1021NSN2DFB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | Not For New Designs | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1021 | S-PBGA-B689 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | FIXED POINT | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68EN360CRC25L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 241-BEPGA | -40°C~85°C TA | Tray | 1995 | M683xx | Obsolete | 3 (168 Hours) | MC68EN360 | 25MHz | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68340FT25E | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 144-BQFP | 0°C~70°C TA | Tray | 1995 | M683xx | Obsolete | 4 (72 Hours) | MC68340 | 25MHz | CPU32 | 5.0V | 1 Core 32-Bit | No | DRAM | USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FA80386EXTB25 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP | 144 | 118°C | -40°C | Bulk | e0 | 144 | 3A001.A.3 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | 25MHz | NOT SPECIFIED | 144 | Not Qualified | 3.3V | INDUSTRIAL | 3.3V | 3.6V | 3V | MICROPROCESSOR | 32 | 25 μs | 26 | YES | YES | 16 | FIXED POINT | NO | 0 | 3 | 12 | 2 | 1.7mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S80C188XL12 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | YES | 70°C | Bulk | e0 | 80 | Tin/Lead (Sn/Pb) | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | QUAD | GULL WING | 5V | 0.8mm | 12MHz | 80 | R-PQFP-G80 | Not Qualified | 5.5V | 5V | COMMERCIAL | 4.5V | MICROPROCESSOR | 62.5mA | 16 | 12 μs | 20 | NO | YES | 8 | FIXED POINT | NO | 0 | 5 | 2 | 3.15mm | 20mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CD8067303561400S R3GH | Intel | Datasheet | - | - | Min: 1 Mult: 1 | FCLGA-3647 | Intel | 11 MB | Skylake | 64 | Embedded | 1 | Xeon® Silver 4110 Processor | 8542.31.00.01 | 0 | 0 | RISC | No Lead | Intel | 2.1 GHz | + 77 C | 2100 | DDR4-2400 | Surface Mount | SMD/SMT | No | 8 | 6 Channel | 76 | 56.5 | 957416 | 3647 | Revision 3.0 | 4110 | Details | LGA | FCLGA | 85 W | Intel Xeon | 0 | 0 | Tray | Intel Xeon Silver | Active | Embedded Processors & Controllers | 3647 | PCIe | 768 GB | Intel Xeon | 64 Bit | CPU - Central Processing Units | 0 | 0 | 8 Core | Server Processors | 0 | 0 | CPU - Central Processing Units | Xeon | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FJ8067702739628S R33Z | Intel | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1356 | YES | 1356 | Intel | 4 MB | Kaby Lake | 1 Configuration | 64 | 5A992.c | Embedded | 1 | Core™ i7-7600U Processor | 8542.31.00.01 | 0 | 0 | INTEL CORP | RISC | Ball | Intel | FJ8067702739628SR33Z | 3.9 GHz | + 100 C | 2800 | DDR3L-1600, DDR4-2133, LPDDR3-1866 | Yes | Surface Mount | SMD/SMT | No | 2 | 3 Display | 2 Channel | PLASTIC/EPOXY | BGA | FCBGA-1356 | 42 | RECTANGULAR | GRID ARRAY | 24 | 953350 | Active | 1356 | 1x4, 2x2, 1x2 + 2x1, 4x1 | Revision 3.0 | i7-7600U | 5.78 | Details | BGA | FCBGA | 15 W | Core i7 | 0 | 1.362192 oz | 0 | Tray | i7-7600U | Active | Embedded Processors & Controllers | CMOS | BOTTOM | BALL | compliant | 1356 | R-PBGA-B1356 | PCIe | 32 GB | 3900 MHz | MICROPROCESSOR | 64 | Intel Core i7 | 64 Bit | CPU - Central Processing Units | i7 | NO | NO | FIXED POINT | YES | 0 | 0 | 2 Core | Mobile Processors | 0 | 0 | CPU - Central Processing Units | Core i7 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6Q6AVT08AER | NXP USA Inc. | Datasheet | 1824 |
| Min: 1 Mult: 1 | 14 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tape & Reel (TR) | i.MX6Q | Active | 3 (168 Hours) | 852MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P1012NSE2FFB | NXP USA Inc. | Datasheet | 1 | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | P1012 | 800MHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine, Security; SEC 3.3 | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6Q4AVT08AE | NXP USA Inc. | Datasheet | 2069 |
| Min: 1 Mult: 1 | 14 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | Active | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8547EPXAUJD | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2009 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8547 | 1.333GHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NG80960KB25 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP | 132 | Bulk | e0 | 132 | 3A001.A.3 | Tin/Lead (Sn/Pb) | 100°C | 0°C | REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 5V | 0.635mm | 25MHz | NOT SPECIFIED | 132 | Not Qualified | 5V | 5V | OTHER | 5.25V | 4.75V | MICROPROCESSOR, RISC | 32 | 25 μs | 32 | NO | NO | 32 | FLOATING POINT | NO | 0 | 4 | 4.57mm | 24.13mm | 24.13mm | RoHS Compliant |
LS2044ASN7TTB
NXP USA Inc.
Package:Embedded - Microprocessors
305.726542
P1014NXN5HHB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8360CVVAJDG
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
AM3352ZCZASUS
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
ET80960JA3V252
Intel
Package:Embedded - Microprocessors
Price: please inquire
LS1012ASE7EKB
NXP USA Inc.
Package:Embedded - Microprocessors
23.600486
R7S721001VLBG#AC0
Renesas Electronics America
Package:Embedded - Microprocessors
40.648802
P5020NSE1VNB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
P1021NSN2DFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC68EN360CRC25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC68340FT25E
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
FA80386EXTB25
Intel
Package:Embedded - Microprocessors
Price: please inquire
S80C188XL12
Intel
Package:Embedded - Microprocessors
Price: please inquire
CD8067303561400S R3GH
Intel
Package:Embedded - Microprocessors
Price: please inquire
FJ8067702739628S R33Z
Intel
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6Q6AVT08AER
NXP USA Inc.
Package:Embedded - Microprocessors
162.119091
P1012NSE2FFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6Q4AVT08AE
NXP USA Inc.
Package:Embedded - Microprocessors
131.721198
MPC8547EPXAUJD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
NG80960KB25
Intel
Package:Embedded - Microprocessors
Price: please inquire
