The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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- RoHS Status
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Package / Case | Surface Mount | Number of pins | Number of Terminals | Clock Frequency-Max | Connector | Connector pinout layout | Contacts pitch | Core | Date Of Intro | Electrical mounting | Factory Pack Quantity | Gross weight | Ihs Manufacturer | Interface Type | Kind of connector | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Memory Types | Moisture Sensitivity Levels | Mounting Styles | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Row pitch | Spatial orientation | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Type of connector | Watchdog Timers | Operating temperature | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current rating | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Data Bus Width | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Rated voltage | Number of External Interrupts | Profile | Length | Width | Plating thickness | Flammability rating |
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![]() | Mfr Part No CM8071504650608S RL5Y | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN8063801307903 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC64GX1000-V/FCS | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FCSG-325 | RISC-V | 1 | CAN, I2C, SPI, UART | 32 kB | 32 kB | 400 kHz | DDR4 | SMD/SMT | RoHS Compliant | Watchdog Timer | Tray | 970 mV to 1.08 V | 16 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7455ARX1250PF | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | MOTOROLA INC | , | Transferred | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7455ARX1250PF | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NXP SEMICONDUCTORS | 1 | , | Obsolete | No | e0 | TIN LEAD | 8542.31.00.01 | 220 | not_compliant | 30 | MICROPROCESSOR, RISC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FH8065301729501 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | 2 | socket | 2x1 | 2.54mm | 2018-07-27 | THT | 0.11 g | INTEL CORP | female | Active | 2.54mm | straight | pin strips | -40...163°C | 8542.31.00.01 | compliant | 1.5A | MICROPROCESSOR | 60V | beryllium copper | 0.254µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FS32R264JCK0MMM | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | 6 | socket | 1x6 | 2.54mm | THT | 0.57 g | NXP SEMICONDUCTORS | female | , | Obsolete | straight | pin strips | -40...163°C | 8542.31.00.01 | unknown | 1.5A | MICROCONTROLLER, RISC | 60V | beryllium copper | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM58522BB1KF10G | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Obsolete | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750FX-GR0533V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PPC8541EPX533J | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 783 | FREESCALE SEMICONDUCTOR INC | 3 | PLASTIC/EPOXY | BGA | BGA, BGA783,28X28,40 | BGA783,28X28,40 | SQUARE | GRID ARRAY | Obsolete | No | e0 | TIN LEAD SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 30 | S-PBGA-B783 | Not Qualified | 333 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN6880LP-1200BG1936-AAP-Y22-G | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC6800CL | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PC7410VG500LE | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 133 MHz | TELEDYNE E2V (UK) LTD | CERAMIC, METAL-SEALED COFIRED | BGA | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 1.9 V | 1.7 V | 1.8 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 360 | S-CBGA-B360 | Not Qualified | 500 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PC7410VG500LE | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 133 MHz | ATMEL CORP | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA360,19X19,50 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Transferred | BGA | 1.9 V | 1.7 V | 1.8 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | Not Qualified | 500 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8548VTATGA | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 783 | FREESCALE SEMICONDUCTOR INC | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | BGA | 29 X 29 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-783 | BGA783,28X28,40 | SQUARE | GRID ARRAY | Obsolete | BGA | Yes | 1.155 V | 1.045 V | 1.1 V | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | not_compliant | 40 | 783 | S-PBGA-B783 | Not Qualified | SoC | 3.38 mm | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMPZ84C00AP-10 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 10 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 5.5 V | 4.5 V | 5 V | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | INDUSTRIAL | 10 MHz | MICROPROCESSOR | 50 mA | 8 | 4.8 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 0 | 2 | 50.7 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC860DPZP66D3 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | 66 MHz | FREESCALE SEMICONDUCTOR INC | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 3.465 V | 3.135 V | 3.3 V | 5A991 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PR3000A-33MQ160C | Pyramid Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | 66 MHz | PERFORMANCE SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | 3A991.A.2 | TIN LEAD | 28 VAX MIPS; 5 PIPELINE STAGES | 8542.31.00.01 | QUAD | GULL WING | 0.64 mm | unknown | 160 | S-PQFP-G160 | Not Qualified | COMMERCIAL | 33 MHz | MICROPROCESSOR, RISC | 700 mA | 32 | 3.85 mm | 32 | NO | NO | 32 | FIXED POINT | NO | 0 | 6 | 27.65 mm | 27.65 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC860ENZP66C1 | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | 66 MHz | MOTOROLA INC | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 3.465 V | 3.135 V | 3.3 V | e0 | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | 32 | 25 mm | 25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68LC060FE50 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 50 MHz | FREESCALE SEMICONDUCTOR INC | CERAMIC, METAL-SEALED COFIRED | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 3.465 V | 3.135 V | 3.3 V | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | 2.54 mm | unknown | 208 | S-CQFP-G208 | Not Qualified | 50 MHz | MICROPROCESSOR | 32 | 4.15 mm | 32 | YES | NO | 32 | FLOATING POINT | YES | 27.305 mm | 27.305 mm |
CM8071504650608S RL5Y
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
CN8063801307903
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
PIC64GX1000-V/FCS
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
XC7455ARX1250PF
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
XC7455ARX1250PF
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
FH8065301729501
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
FS32R264JCK0MMM
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
BCM58522BB1KF10G
Broadcom Limited
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750FX-GR0533V
IBM
Package:Embedded - Microprocessors
Price: please inquire
PPC8541EPX533J
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
CN6880LP-1200BG1936-AAP-Y22-G
Marvell Technology Group Ltd
Package:Embedded - Microprocessors
Price: please inquire
MC6800CL
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
PC7410VG500LE
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
PC7410VG500LE
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
MPC8548VTATGA
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
TMPZ84C00AP-10
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
XPC860DPZP66D3
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
PR3000A-33MQ160C
Pyramid Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
XPC860ENZP66C1
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
MC68LC060FE50
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
