The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of Serial I/Os | Number of External Interrupts | On Chip Data RAM Width | Number of DMA Channels | Saturation Current | Length | Width |
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![]() | Mfr Part No MC68010L12 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 64 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | CERAMIC | DIP | DIP, DIP64,.9 | DIP64,.9 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T64 | Not Qualified | COMMERCIAL | 12.5 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750GLECR5HB3V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MD80C86/883 | Harris Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 5 MHz | HARRIS SEMICONDUCTOR | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-GDIP-T40 | Not Qualified | MILITARY | 5 MHz | MICROPROCESSOR | 50 mA | 16 | 20 | NO | YES | 38535Q/M;38534H;883B | 16 | FIXED POINT | NO | 0 | 2 | ||||||||||||||||||||
![]() | Mfr Part No MD80C86/883 | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 5 MHz | ROCHESTER ELECTRONICS LLC | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | Active | DIP | 5.5 V | 4.5 V | 5 V | DUAL | THROUGH-HOLE | unknown | 40 | R-GDIP-T40 | MILITARY | MILITARY | 5 MHz | MICROPROCESSOR | 16 | 20 | NO | YES | 16 | FIXED POINT | NO | |||||||||||||||||||||||||||||||
![]() | Mfr Part No PPC405EX-NSA400T | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 388 | 666.66 MHz | APPLIED MICRO CIRCUITS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | Yes | 1.3 V | 1.1 V | 1.2 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | unknown | NOT SPECIFIED | 388 | S-PBGA-B388 | Not Qualified | INDUSTRIAL | 400 MHz | MICROPROCESSOR, RISC | 32 | 2.65 mm | YES | YES | FIXED POINT | YES | 27 mm | 27 mm | ||||||||||||||||||||||
![]() | Mfr Part No MPE603ERX100LN | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 255 | MOTOROLA SEMICONDUCTOR PRODUCTS | CERAMIC | BGA | BGA, BGA255,16X16,50 | BGA255,16X16,50 | SQUARE | GRID ARRAY | Obsolete | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 1.27 mm | unknown | S-XBGA-B255 | Not Qualified | 3.3 V | 100 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68030RC25B | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC860ENZP50D3 | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 357 | 50 MHz | MOTOROLA INC | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | No | 3.465 V | 3.135 V | 3.3 V | e0 | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B357 | Not Qualified | 50 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 25 mm | 25 mm | |||||||||||||||||||||||||
![]() | Mfr Part No S3C2410A-26 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No YM3500C4T4MFG | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Active | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TDA2HFBTQABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 760 | 2019-08-14 | TEXAS INSTRUMENTS INC | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 1.2 V | 1.11 V | 1.15 V | e1 | Yes | 5A992.C | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B760 | AUTOMOTIVE | SoC | 2.96 mm | AEC-Q100 | 3 | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No MIMX9352CVVXMAB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Tray | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FS32R264JCK0MMM | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NXP SEMICONDUCTORS | , | Obsolete | 8542.31.00.01 | unknown | MICROCONTROLLER, RISC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCF5282CVM66 | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | MOTOROLA INC | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | Transferred | Yes | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 66.67 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX537CVP8C2 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | YES | 529 | 27 MHz | NXP SEMICONDUCTORS | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | TEPBGA-529 | BGA529,23X23,32 | SQUARE | GRID ARRAY, FINE PITCH | Not Recommended | Yes | 1.15 V | 1.05 V | 1.1 V | BOTTOM | BALL | 260 | 0.8 mm | compliant | 40 | S-PBGA-B529 | AUTOMOTIVE | 800 MHz | MICROPROCESSOR, RISC | 800 mA | 32 | 1.85 mm | 26 | YES | YES | 32 | FLOATING POINT | YES | 147456 | 52 | 8 | 32 | 19 mm | 19 mm | |||||||||||||||||
![]() | Mfr Part No MC68000R8 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | CERAMIC | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-XPGA-P68 | Not Qualified | 5 V | COMMERCIAL | 8 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750CXEJR7012T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750GXECB6543T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBMPPC750FX-GR2523T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750FL-GR1033V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active |
MC68010L12
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750GLECR5HB3V
IBM
Package:Embedded - Microprocessors
Price: please inquire
MD80C86/883
Harris Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
MD80C86/883
Rochester Electronics LLC
Package:Embedded - Microprocessors
Price: please inquire
PPC405EX-NSA400T
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
MPE603ERX100LN
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
MC68030RC25B
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
XPC860ENZP50D3
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
S3C2410A-26
Samsung Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
YM3500C4T4MFG
AMD
Package:Embedded - Microprocessors
Price: please inquire
TDA2HFBTQABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
MIMX9352CVVXMAB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
FS32R264JCK0MMM
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
MCF5282CVM66
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
MCIMX537CVP8C2
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
MC68000R8
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750CXEJR7012T
IBM
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750GXECB6543T
IBM
Package:Embedded - Microprocessors
Price: please inquire
IBMPPC750FX-GR2523T
IBM
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750FL-GR1033V
IBM
Package:Embedded - Microprocessors
Price: please inquire
