Embedded - Microprocessors (6000)

-

-

Min: 1

Mult: 1

YES

956

INTEL CORP

PLASTIC/EPOXY

FBGA

FBGA, BGA956,44X44,20

BGA956,44X44,20

SQUARE

GRID ARRAY, FINE PITCH

Obsolete

Yes

1.2 V

Yes

3A991.A.1

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

0.5 mm

compliant

NOT SPECIFIED

S-PBGA-B956

Not Qualified

2400 MHz

MICROPROCESSOR, RISC

37000 mA

64

-

-

Min: 1

Mult: 1

YES

483

133 MHz

MOTOROLA INC

CERAMIC, METAL-SEALED COFIRED

BGA

BGA,

SQUARE

GRID ARRAY

Transferred

BGA

1.35 V

1.25 V

1.3 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

483

S-CBGA-B483

Not Qualified

933 MHz

MICROPROCESSOR, RISC

32

3.2 mm

36

YES

YES

64

FLOATING POINT

YES

29 mm

29 mm

-

-

Min: 1

Mult: 1

NO

40

2 MHz

NATIONAL SEMICONDUCTOR CORP

85 °C

-40 °C

CERAMIC

DIP

DIP, DIP40,.6

DIP40,.6

RECTANGULAR

IN-LINE

Obsolete

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-CDIP-T40

Not Qualified

INDUSTRIAL

2.5 MHz

MICROPROCESSOR

21 mA

8

5.08 mm

16

NO

YES

8

FIXED POINT

NO

5

15.24 mm

-

-

Min: 1

Mult: 1

NO

40

2 MHz

NATIONAL SEMICONDUCTOR CORP

85 °C

-40 °C

CERAMIC

DIP

DIP, DIP40,.6

DIP40,.6

RECTANGULAR

IN-LINE

Obsolete

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-CDIP-T40

Not Qualified

INDUSTRIAL

2.5 MHz

MICROPROCESSOR

21 mA

8

5.08 mm

16

NO

YES

8

FIXED POINT

NO

5

15.24 mm

-

-

Min: 1

Mult: 1

YES

360

300 MHz

MOTOROLA INC

CERAMIC, METAL-SEALED COFIRED

BGA

BGA,

SQUARE

GRID ARRAY

Obsolete

2.1 V

1.9 V

2 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

S-CBGA-B360

Not Qualified

300 MHz

MICROPROCESSOR, RISC

32

3.2 mm

32

YES

YES

64

FLOATING POINT

YES

25 mm

25 mm

-

-

Min: 1

Mult: 1

YES

294

3.6864 MHz

INTEL CORP

PLASTIC/EPOXY

BGA

BGA,

SQUARE

GRID ARRAY

Obsolete

BGA

1.1 V

0.95 V

1 V

8542.31.00.01

BOTTOM

BALL

unknown

294

S-PBGA-B294

Not Qualified

200 MHz

MICROPROCESSOR, RISC

32

26

YES

YES

32

FIXED POINT

YES

-

-

Min: 1

Mult: 1

BROADCOM CORP

,

Obsolete

No

8542.31.00.01

compliant

-

-

Min: 1

Mult: 1

NO

321

333 MHz

ADVANCED MICRO DEVICES INC

70 °C

CERAMIC, METAL-SEALED COFIRED

IPGA

IPGA, SPGA321,37X37

SPGA321,37X37

SQUARE

GRID ARRAY, INTERSTITIAL PITCH

Obsolete

PGA

No

2.3 V

2.1 V

2.2 V

e0

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

321

S-CPGA-P321

Not Qualified

COMMERCIAL

333 MHz

MICROPROCESSOR, RISC

32

3.63 mm

32

YES

YES

64

FLOATING POINT

NO

49.53 mm

49.53 mm

-

-

Min: 1

Mult: 1

YES

352

66 MHz

MOTOROLA INC

PLASTIC/EPOXY

LBGA

LBGA, BGA352,26X26,50

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

BGA

1.9 V

1.7 V

1.8 V

3A991.A.2

ALSO OPERATES AT 2V SUPPLY

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

352

S-PBGA-B352

Not Qualified

266 MHz

MICROPROCESSOR, RISC

32

1.65 mm

32

YES

YES

32

FLOATING POINT

YES

35 mm

35 mm

-

-

Min: 1

Mult: 1

NO

64

15 MHz

PYRAMID SEMICONDUCTOR CORP

125 °C

-55 °C

UNSPECIFIED

DIP

DIP, SDIP64,.6,50

SDIP64,.6,50

RECTANGULAR

IN-LINE

Active

DIP

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

TIN LEAD

8542.31.00.01

DUAL

THROUGH-HOLE

1.27 mm

compliant

64

R-XDIP-T64

Not Qualified

MILITARY

15 MHz

MICROPROCESSOR

40 mA

16

16

NO

YES

38535Q/M;38534H;883B

16

FLOATING POINT

NO

-

-

Min: 1

Mult: 1

YES

492

INTEL CORP

70 °C

PLASTIC/EPOXY

BGA

BGA492,26X26,50

SQUARE

GRID ARRAY

Obsolete

Yes

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

S-PBGA-B492

Not Qualified

COMMERCIAL

MICROPROCESSOR, RISC

-

-

Min: 1

Mult: 1

YES

292

200 MHz

IBM MICROELECTRONICS

CERAMIC, METAL-SEALED COFIRED

BGA

21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292

BGA292,20X20,40

SQUARE

GRID ARRAY

Obsolete

BGA

No

1.5 V

1.4 V

1.45 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1 mm

not_compliant

292

S-CBGA-B292

Not Qualified

800 MHz

MICROPROCESSOR, RISC

32

3.087 mm

32

YES

YES

64

FLOATING POINT

YES

21.02 mm

21.02 mm

-

-

Min: 1

Mult: 1

YES

256

50 MHz

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

UNSPECIFIED

QFF

MQFP-256

QFL256,1.5SQ,20

SQUARE

FLATPACK

Active

No

5.5 V

4.5 V

5 V

e0

3A991.A.2

TIN LEAD

8542.31.00.01

QUAD

FLAT

0.508 mm

compliant

S-XQFP-F256

Not Qualified

MILITARY

25 MHz

MICROPROCESSOR, RISC

230 mA

32

3.18 mm

32

YES

YES

32

FLOATING POINT

NO

300k Rad(Si) V

37.085 mm

37.085 mm

-

-

Min: 1

Mult: 1

YES

783

FREESCALE SEMICONDUCTOR INC

3

PLASTIC/EPOXY

BGA

BGA783,28X28,40

SQUARE

GRID ARRAY

Obsolete

Yes

e2

No

TIN SILVER

BOTTOM

BALL

260

1 mm

not_compliant

40

S-PBGA-B783

Not Qualified

1000 MHz

MICROPROCESSOR, RISC

32

-

-

Min: 1

Mult: 1

YES

44

6 MHz

TOSHIBA CORP

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ,

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY

8542.31.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

Not Qualified

INDUSTRIAL

6 MHz

MICROPROCESSOR

22 mA

8

4.52 mm

16

NO

YES

8

FIXED POINT

NO

0

2

16.6 mm

16.6 mm

-

-

Min: 1

Mult: 1

YES

552

66.66 MHz

APPLIED MICRO CIRCUITS CORP

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, BGA552,24X24,40

BGA552,24X24,40

SQUARE

GRID ARRAY

Obsolete

BGA

No

1.9 V

1.7 V

1.8 V

3A991.A.2

ALSO REQUIRES 3.3V SUPPLY

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

1 mm

compliant

NOT SPECIFIED

552

S-CBGA-B552

Not Qualified

INDUSTRIAL

466 MHz

MICROPROCESSOR, RISC

32

3.8 mm

64

YES

YES

64

FIXED POINT

YES

25 mm

25 mm

-

-

Min: 1

Mult: 1

YES

281

13.5 MHz

TOSHIBA CORP

85 °C

-20 °C

PLASTIC/EPOXY

BGA

BGA, BGA281,18X18,25

BGA281,18X18,25

SQUARE

GRID ARRAY

End Of Life

BGA

1.65 V

1.35 V

1.5 V

e1

TIN SILVER COPPER

LOW POWER TAKEN FROM STANDBY MODE

8542.31.00.01

BOTTOM

BALL

0.65 mm

unknown

281

S-PBGA-B281

Not Qualified

OTHER

40.5 MHz

MICROPROCESSOR, RISC

46 mA

32

1.4 mm

24

YES

YES

16

FIXED POINT

NO

13 mm

13 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

160

25 MHz

IBM MICROELECTRONICS

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, QFP160,1.2SQ

QFP160,1.2SQ

SQUARE

FLATPACK

Obsolete

QFP

No

3.47 V

3.14 V

3.3 V

e0

TIN LEAD

8542.31.00.01

QUAD

GULL WING

0.65 mm

unknown

160

S-PQFP-G160

Not Qualified

INDUSTRIAL

25 MHz

MICROPROCESSOR, RISC

200 mA

32

3.95 mm

24

YES

YES

32

FIXED POINT

YES

28 mm

28 mm

-

-

Min: 1

Mult: 1

YES

368

NATIONAL SEMICONDUCTOR CORP

3

PLASTIC/EPOXY

BGA

BGA, BGA368,26X26,50

BGA368,26X26,50

SQUARE

GRID ARRAY

Obsolete

No

e0

TIN LEAD

8542.31.00.01

BOTTOM

BALL

220

1.27 mm

compliant

30

S-PBGA-B368

Not Qualified

366 MHz

MICROPROCESSOR, RISC

32