The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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- Package / Case
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- Moisture Sensitivity Level (MSL)
- RoHS Status
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- Graphics Acceleration
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- Operating Temperature
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- RAM Controllers
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- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Dielectric Material | Approvals | Base Product Number | Brand | Cache Memory | Code Name | CPU Configuration - Max | Device Core Size | Embedded Options | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | Instruction Set Architecture | Insulator Material | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Moisture Sensitive | Mounting | Mounting Styles | Number of Displays Supported | Number of I/Os | Number of Memory Channels | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part # Aliases | Part Life Cycle Code | PCIe Configurations | PCIe Revision | Processor Series | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | TDP - Max | Tradename | Unit Weight | Voltage Rating (AC) | Voltage Rating (DC) | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Composition | Color | Gender | Power (Watts) | HTS Code | Capacitance | Subcategory | Power Rating | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Military Standard | Pin Count | Contact Finish | JESD-30 Code | Number of Contacts | Dielectric | ESR (Equivalent Series Resistance) | Failure Rate | Contact Style | Insulation Resistance | Voltage | Interface | Memory Size | Load Capacitance | Speed | RAM Size | Operating Mode | uPs/uCs/Peripheral ICs Type | Accessory Type | Core Processor | Frequency Tolerance | Peripherals | Connectivity | Bit Size | Usage | Family | Architecture | Data Bus Width | Product Type | 1st Connector | 2nd Connector | Integrated Cache | Voltage - I/O | Primary Attributes | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Security Features | Display & Interface Controllers | Flash Size | SATA | Product | Connection Type | Features | Product Category | Diameter | Height Seated (Max) | Length | Width | Contact Finish Thickness | Lead Free | Ratings |
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![]() | Mfr Part No CM8070804496809S RKNY | Intel | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750GXECB5H42V | Rochester Electronics | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Polyester | Rochester Electronics, LLC | Bulk | Active | Compliant | 40 V | 63 V | * | 20 % | PC Pins | 100 °C | -55 °C | 6.8 µF | PET | JTAG | 32 Bit | 31.496 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No X29R64G083AMF1 S LJJS | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Intel | 1 | Intel | 918717 | Details | Embedded Processors & Controllers | CPU - Central Processing Units | CPU - Central Processing Units | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BX80684E2174G S R3WN | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Intel | 1 | Intel | 977244 | Non-Compliant | Bulk | Embedded Processors & Controllers | CPU - Central Processing Units | CPU - Central Processing Units | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No X29R32G083CNE1 S LJ3J | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Gold | Intel | 1 | Intel | 914102 | Compliant | 2.803 MΩ | Female | Embedded Processors & Controllers | 20 | Socket | 5 GΩ | CPU - Central Processing Units | CPU - Central Processing Units | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BX80684E2134 S R3WP | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Lead, Tin | Through Hole | Intel | 1 | Intel | 977235 | Non-Compliant | Bulk | 0.1 % | 2 | 50 ppm/°C | 101 Ω | 175 °C | -65 °C | Metal Film | Embedded Processors & Controllers | 125 mW | 125 mW | MIL-PRF-55182 | 0.001 % | CPU - Central Processing Units | Military, Moisture Resistant, Weldable | CPU - Central Processing Units | 2.39 mm | 6.35 mm | 2.39 mm | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BX80662I36320 SR2H9 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 Metric) | 0402 | RN73R1E | KOA Speer Electronics, Inc. | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -55°C ~ 155°C | RN73R | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.25% | 2 | ±10ppm/°C | 178 Ohms | Thin Film | 0.063W, 1/16W | - | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BX80662I76700 SR2BT | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Retail Package | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BX80662G4520 SR2HM | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Multiple Series | Schneider Electric | Bulk | Active | Non-Compliant | - | Keylock | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No N80C286-12TR | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) | Advanced Micro Devices | Bulk | Active | -40°C ~ 85°C (TA) | - | 12MHz | 80C286 | 5V | - | 1 Core, 16-Bit | No | - | - | - | Math Engine; 80C287 | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P2041NXN1MMB | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | - | 780-FCPBGA (23x23) | MDM03 | ITT Cannon, LLC | Bulk | Active | -40°C ~ 105°C (TA) | 83513-Style Micro D Metal Shell (MDM) | D-Type, Micro-D | 21 | Multiple, Individual | - | Gold | 1.2GHz | PowerPC e500mc | - | Plug, Male Pins | Individual Wire Leads | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core, 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, RapidIO, SPI | - | - | - | SATA 3Gbps (2) | 3.00 (914.40mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8343CZQADDB | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | - | - | MPC83 | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 1.8V, 2.5V, 3.3V | FPGA - 1.9M Logic Elements | 10/100/1000Mbps (3) | 1 Core, 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I²C, PCI, SPI | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P3041NXN1PNB | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) | PEI-Genesis | Bulk | Active | -40°C ~ 105°C (TA) | * | 1.5GHz | PowerPC e500mc | 1.5V, 1.8V, 2.5V, 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core, 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, RapidIO, SPI | - | - | - | SATA 3Gbps (2) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AV8063801116300S R10E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1023 | YES | Intel | 2 MB | Ivy Bridge | 1 Configuration | 64(b) | Embedded | 1 | INTEL CORP | RISC | Intel | AV8063801116300SR10E | 1.4 GHz | + 105 C | DDR3-1333/1600, DDR3L-1333/1600 | Yes | Surface Mount | SMD/SMT | 2 Display | 2 Channel | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | FCBGA | 924835 | Active | 1x16/2x8/1x8 + 2x4 | Revision 2.0 | 1047UE | No | NOT SPECIFIED | 5.78 | Details | Yes | 17 W | 3rd Gen i7 Core | 7.770766 oz | Tray | 1047UE | 8542.31.00.01 | Embedded Processors & Controllers | CMOS | BOTTOM | BALL | NOT SPECIFIED | compliant | 1400(MHz) | 1023 | R-PBGA-B | PCIe | 16 GB | 1400 MHz | MICROPROCESSOR | 64 | Intel Celeron | 64 Bit | CPU - Central Processing Units | YES | 2 Core | Mobile Processors | CPU - Central Processing Units | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8535ECVJAKGA | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8250AZUPIBC | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 480-TBGA (37.5x37.5) | MPC82 | Suntsu Electronics, Inc. | Bulk | Active | -30°C ~ 85°C | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | MHz Crystal | 16.384 MHz | ±50ppm | 100 Ohms | 22pF | 300MHz | Fundamental | PowerPC G2 | ±50ppm | 3.3V | 10/100Mbps (3) | 1 Core, 32-Bit | No | DRAM, SDRAM | - | I²C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | 0.026 (0.65mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68302CRC20C | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 132-BPGA Exposed Pad | 132-PGA (34.5x34.5) | Knowles Syfer | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | * | 20MHz | M68000 | 5.0V | - | 1 Core, 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No T4240NSN7TTB | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1932-BBGA, FCBGA | 1932-FCPBGA (45x45) | UL E73864 | Thermoplastic Elastomer (TPE) | Joy Cooper Interconnect | E1049-25-COH | Freescale Semiconductor | Bulk | Active | 0°C ~ 105°C (TA) | QorIQ T4 | 1,135 A | 1,000 VAC | 1.8GHz | PowerPC e6500 | - | 1Gbps (16), 10Gbps (4) | 12 Core, 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I²C, MMC/SD, PCIe, RapidIO, SPI, UART | - | - | - | SATA 3Gbps (2) | Plug | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68030RC40C | MOTOROLA | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 128-BPGA | 128-PGA (34.55x34.55) | MC680 | Glenair | Retail Package | Active | 0°C ~ 70°C (TA) | * | 40MHz | 68030 | 5.0V | - | 1 Core, 32-Bit | No | - | - | SCI, SPI | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9328MXLVP15R2 | Freescale | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 225-LFBGA | 225-MAPBGA (13x13) | Glenair | Retail Package | Active | 0°C ~ 70°C (TA) | * | 150MHz | ARM920T | 1.8V, 3.0V | - | 1 Core, 32-Bit | No | SDRAM | USB 1.x (1) | I²C, I²S, SPI, SSI, MMC/SD, UART | - | - | LCD | - |
CM8070804496809S RKNY
Intel
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750GXECB5H42V
Rochester Electronics
Package:Embedded - Microprocessors
Price: please inquire
X29R64G083AMF1 S LJJS
Intel
Package:Embedded - Microprocessors
Price: please inquire
BX80684E2174G S R3WN
Intel
Package:Embedded - Microprocessors
Price: please inquire
X29R32G083CNE1 S LJ3J
Intel
Package:Embedded - Microprocessors
Price: please inquire
BX80684E2134 S R3WP
Intel
Package:Embedded - Microprocessors
Price: please inquire
BX80662I36320 SR2H9
Intel
Package:Embedded - Microprocessors
Price: please inquire
BX80662I76700 SR2BT
Intel
Package:Embedded - Microprocessors
Price: please inquire
BX80662G4520 SR2HM
Intel
Package:Embedded - Microprocessors
Price: please inquire
N80C286-12TR
AMD
Package:Embedded - Microprocessors
Price: please inquire
P2041NXN1MMB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MPC8343CZQADDB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
P3041NXN1PNB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
AV8063801116300S R10E
Intel
Package:Embedded - Microprocessors
Price: please inquire
MPC8535ECVJAKGA
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MPC8250AZUPIBC
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MC68302CRC20C
Freescale
Package:Embedded - Microprocessors
Price: please inquire
T4240NSN7TTB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
MC68030RC40C
MOTOROLA
Package:Embedded - Microprocessors
Price: please inquire
MC9328MXLVP15R2
Freescale
Package:Embedded - Microprocessors
Price: please inquire
