The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Manufacturer Package Identifier | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Data Bus Width | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No P2041NSN7NNC | NXP USA Inc. | Datasheet | 1686 |
| Min: 1 Mult: 1 | 12 Weeks | 780-BBGA, FCBGA | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | Active | 3 (168 Hours) | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 245 | 30 | P2041 | 1.3GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC852TZT50A | NXP USA Inc. | Datasheet | 462 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 50MHz | MICROPROCESSOR, RISC | 66MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | 2.54mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8378CVRAGDA | NXP USA Inc. | Datasheet | 18 |
| Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 15 | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6Q4AVT10AD | NXP USA Inc. | Datasheet | 64 | - | Min: 1 Mult: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | 7 | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | ARM® Cortex®-A9 | 16 | YES | 64 | 272K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8358ECZQAGDGA | NXP USA Inc. | Datasheet | 253 | - | Min: 1 Mult: 1 | 668-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2006 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 668 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 2.46mm | 29mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68LC302AF16CT | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 16MHz | MICROCONTROLLER, RISC | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P1024NSE5DFB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 561-FBGA | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | 5A002.A.1 | 8542.31.00.01 | 260 | P1024 | 667MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC860DTVR50D4 | NXP USA Inc. | Datasheet | 2113 |
| Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6DP5EYM1AB | NXP USA Inc. | Datasheet | 2048 |
| Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA, FCBGA | -20°C~105°C TJ | Tray | 2002 | i.MX6DP | Active | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TG80960JS25 | Intel | Datasheet | 240 |
| Min: 1 Mult: 1 | Surface Mount | 132-QFP | 0°C~100°C TC | Tray | 2002 | i960 | e1 | Obsolete | 4 (72 Hours) | 132 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.635mm | 25MHz | 132 | S-PQFP-G132 | 3.33.3/5V | 3V | 1kB | MICROPROCESSOR, RISC | 185mA | 32 | 25 μs | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 1 Core 32-Bit | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ATSAMA5D27C-D5M-CUR | Microchip Technology | Datasheet | 21 |
| Min: 1 Mult: 1 | 10 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | SAMA5D2 | Active | 3 (168 Hours) | 289 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.8mm | ATSAMA5D27 | S-PBGA-B289 | 1.9V | 1.7V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 16 | YES | YES | FLOATING POINT | YES | 65536 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | Multimedia; NEON™ MPE | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | 1.2mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8541EVTALF | NXP USA Inc. | Datasheet | 21 | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8270ZUQLDA | NXP USA Inc. | Datasheet | 86 | - | Min: 1 Mult: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 83.33MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8541EVTAJD | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | 1.14V | 533MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6S6AVM08ACR | NXP USA Inc. | Datasheet | 20700 | - | Min: 1 Mult: 1 | 15 Weeks | 624-LFBGA | YES | 14 | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | yes | Active | 3 (168 Hours) | 624 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | NOT SPECIFIED | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | ARM® Cortex®-A9 | 16 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P2020NSE2KFC | NXP USA Inc. | Datasheet | 24 | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | 32 | YES | YES | 16 | FLOATING POINT | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No OMAP3503ECBB | Texas Instruments | Datasheet | 400 |
| Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3503 | 515 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | NO | SINGLE | LCD | 900μm | 12mm | 12mm | 610μm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||
![]() | Mfr Part No AM1808EZCED4 | Texas Instruments | Datasheet | 24 |
| Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | Surface Mount | 361-LFBGA | 361 | AM1808EZCED4 | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | AM1808 | I2C, SPI, UART, USB | 64kB | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | SATA 3Gbps (1) | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6QP5EVT2AA | NXP USA Inc. | Datasheet | 34 | - | Min: 1 Mult: 1 | 15 Weeks | 624-FBGA, FCBGA | -20°C~105°C TJ | Tray | i.MX6QP | Active | 3 (168 Hours) | 8542.39.00.01 | 1.2GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8306SCVMABDCA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 369-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 133MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | 1.61mm | 19mm | ROHS3 Compliant |
P2041NSN7NNC
NXP USA Inc.
Package:Embedded - Microprocessors
360.970386
MPC852TZT50A
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8378CVRAGDA
NXP USA Inc.
Package:Embedded - Microprocessors
68.111665
MCIMX6Q4AVT10AD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8358ECZQAGDGA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MC68LC302AF16CT
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
P1024NSE5DFB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC860DTVR50D4
NXP USA Inc.
Package:Embedded - Microprocessors
204.931559
MCIMX6DP5EYM1AB
NXP USA Inc.
Package:Embedded - Microprocessors
131.667777
TG80960JS25
Intel
Package:Embedded - Microprocessors
20.872184
ATSAMA5D27C-D5M-CUR
Microchip Technology
Package:Embedded - Microprocessors
15.287022
MPC8541EVTALF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8270ZUQLDA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8541EVTAJD
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MCIMX6S6AVM08ACR
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
P2020NSE2KFC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
OMAP3503ECBB
Texas Instruments
Package:Embedded - Microprocessors
42.363974
AM1808EZCED4
Texas Instruments
Package:Embedded - Microprocessors
45.972455
MCIMX6QP5EVT2AA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
MPC8306SCVMABDCA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
