The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of Cores/Bus Width | RAM Controllers | Number of External Interrupts | Number of DMA Channels | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No TMPR3912AU-92 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 11.52 MHz | TOSHIBA CORP | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | No | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | unknown | NOT SPECIFIED | 208 | S-PQFP-G208 | Not Qualified | COMMERCIAL | 92.16 MHz | MICROPROCESSOR, RISC | 32 | 1.7 mm | 13 | NO | YES | 32 | FIXED POINT | YES | 28 mm | 28 mm | ||||||||||||||||||||||
![]() | Mfr Part No SAA6752HS/101 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G208 | Not Qualified | COMMERCIAL | CONSUMER CIRCUIT | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No STP1031LGA | Sun Microsystems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 78 | 50 MHz | SUN MICROSYSTEMS INC | CERAMIC, METAL-SEALED COFIRED | LGA | CERAMIC, LGA-787 | LGA787,32X32,40 | SQUARE | GRID ARRAY | Obsolete | LGA | No | 2.73 V | 2.52 V | 2.6 V | e0 | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | BOTTOM | NO LEAD | 1 mm | unknown | 787 | S-CBGA-N78 | Not Qualified | 250 MHz | MICROPROCESSOR, RISC | 9400 mA | 32 | 4.38 mm | 36 | YES | YES | 128 | FLOATING POINT | YES | 0 | 35 mm | 35 mm | |||||||||||||||||||||
![]() | Mfr Part No P80C88AL | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | INTEL CORP | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T40 | Not Qualified | COMMERCIAL | 5 MHz | MICROPROCESSOR, RISC | 50 mA | 16 | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SAB80188-N | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 16 MHz | SIEMENS A G | 70 °C | PLASTIC/EPOXY | , | SQUARE | CHIP CARRIER | Transferred | 5.5 V | 4.5 V | 5 V | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | J BEND | unknown | S-PQCC-J68 | Not Qualified | COMMERCIAL | 8 MHz | MICROPROCESSOR | 550 mA | 16 | 20 | NO | NO | 8 | FIXED POINT | NO | 0 | 5 | 2 | ||||||||||||||||||||||||||||
![]() | Mfr Part No SAB80188-N | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 16 MHz | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 68 | S-PQCC-J68 | Not Qualified | COMMERCIAL | 8 MHz | MICROPROCESSOR | 550 mA | 16 | 5.1 mm | 20 | NO | NO | 8 | FIXED POINT | NO | 24.3 mm | 24.3 mm | ||||||||||||||||||||
![]() | Mfr Part No PPC405CR-3KC266C | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 316 | 66.66 MHz | APPLIED MICRO CIRCUITS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA316,20X20,50 | BGA316,20X20,50 | SQUARE | GRID ARRAY | Obsolete | BGA | Yes | 2.7 V | 2.3 V | 2.5 V | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | compliant | NOT SPECIFIED | 316 | S-PBGA-B316 | Not Qualified | INDUSTRIAL | 266.66 MHz | MICROPROCESSOR, RISC | 32 | 2.65 mm | 13 | YES | YES | 32 | FIXED POINT | YES | 27 mm | 27 mm | |||||||||||||||||||
![]() | Mfr Part No FH8065301567411 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1170 | INTEL CORP | PLASTIC/EPOXY | BGA | 25 X 27 MM, FCBGA-1170 | RECTANGULAR | GRID ARRAY | Obsolete | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | compliant | R-PBGA-B1170 | 1460 MHz | MICROPROCESSOR | 64 | YES | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN6335-1100BG900-AAP-Y-G | Cavium Networks | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMPR3912AU | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 75 MHz | TOSHIBA CORP | 70 °C | PLASTIC/EPOXY | LFQFP | 28 X 28 MM, 0.50 MM PITCH, PLASTIC, LQFP-208 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | e0 | TIN LEAD | QUAD | GULL WING | 240 | 0.5 mm | unknown | NOT SPECIFIED | 208 | S-PQFP-G208 | Not Qualified | COMMERCIAL | 75 MHz | MICROPROCESSOR, RISC | 32 | 1.7 mm | 13 | NO | YES | 32 | FIXED POINT | NO | 28 mm | 28 mm | ||||||||||||||||||||||
![]() | Mfr Part No MC7447RX1267LB | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 167 MHz | FREESCALE SEMICONDUCTOR INC | 1 | CERAMIC, METAL-SEALED COFIRED | BGA | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.35 V | 1.25 V | 1.3 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.27 mm | not_compliant | 30 | 360 | S-CBGA-B360 | Not Qualified | 1267 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||
![]() | Mfr Part No MC7447RX1267LB | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | 167 MHz | MOTOROLA INC | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 1.35 V | 1.25 V | 1.3 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-CBGA-B360 | Not Qualified | 1267 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | 25 mm | 25 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No PPC7447RX1000NB | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | MOTOROLA INC | CERAMIC | BGA | BGA360,19X19,50 | SQUARE | GRID ARRAY | Obsolete | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-XBGA-B360 | Not Qualified | 1000 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SBP9989DNJ | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 64 | TEXAS INSTRUMENTS INC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP64,.9 | DIP64,.9 | RECTANGULAR | IN-LINE | Obsolete | No | No | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-CDIP-T64 | Not Qualified | MILITARY | 4.4 MHz | MICROPROCESSOR | 16 | 5.72 mm | 15 | NO | NO | MIL-STD-883 Class B | 16 | FIXED POINT | NO | 80.285 mm | 22.86 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No UPD70216HGF-16 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | RENESAS ELECTRONICS CORP | 70 °C | -10 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Active | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | R-PQFP-G80 | Not Qualified | COMMERCIAL | 16 MHz | MICROPROCESSOR, RISC | 16 | 20 | YES | YES | 16 | FIXED POINT | NO | 4 | ||||||||||||||||||||||||||
![]() | Mfr Part No BCM1480 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM CORP | , | Obsolete | No | 8542.31.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN1010-350BG256-X | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | MARVELL SEMICONDUCTOR INC | , | Contact Manufacturer | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CN1010-350BG256-X | Cavium Networks | Datasheet | - | - | Min: 1 Mult: 1 | CAVIUM NETWORKS | , | Transferred | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No I5-4250USR16M | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | INTEL CORP | Active | 8542.31.00.01 | compliant | MICROPROCESSOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 25PPC750FX-FB1013T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 292-BGA | -45°C ~ 125°C | Bulk | IBM25PPC750FX | Obsolete | 733MHz | 1.8V, 2.5V, 3.3V | 1 Core, 64-Bit | SRAM |
TMPR3912AU-92
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
SAA6752HS/101
Philips Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
STP1031LGA
Sun Microsystems Inc
Package:Embedded - Microprocessors
Price: please inquire
P80C88AL
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
SAB80188-N
Siemens
Package:Embedded - Microprocessors
Price: please inquire
SAB80188-N
Infineon Technologies AG
Package:Embedded - Microprocessors
Price: please inquire
PPC405CR-3KC266C
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
FH8065301567411
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
CN6335-1100BG900-AAP-Y-G
Cavium Networks
Package:Embedded - Microprocessors
Price: please inquire
TMPR3912AU
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
MC7447RX1267LB
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
MC7447RX1267LB
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
PPC7447RX1000NB
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
SBP9989DNJ
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
UPD70216HGF-16
Renesas Electronics Corporation
Package:Embedded - Microprocessors
Price: please inquire
BCM1480
Broadcom Limited
Package:Embedded - Microprocessors
Price: please inquire
CN1010-350BG256-X
Marvell Technology Group Ltd
Package:Embedded - Microprocessors
Price: please inquire
CN1010-350BG256-X
Cavium Networks
Package:Embedded - Microprocessors
Price: please inquire
I5-4250USR16M
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
25PPC750FX-FB1013T
IBM
Package:Embedded - Microprocessors
Price: please inquire
