The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Brand | Cache Memory | Code Name | CPU Configuration - Max | Data Bus Width (bit) | Device Core Size | ECCN (US) | Embedded Options | Factory Pack QuantityFactory Pack Quantity | Family Name | Frequency(Max) | HTS | I2C | I2S | Instruction Set Architecture | Lead Shape | Manufacturer | Maximum Clock Frequency | Maximum Operating Temperature | Maximum Speed (MHz) | Memory Types | Moisture Sensitive | Mounting | Mounting Styles | Multiply Accumulate | Number of CPU Cores | Number of Displays Supported | Number of Memory Channels | Operating Temperature (Max.) | Operating Temperature (Min.) | Package Length | Package Type | Package Width | Part # Aliases | PCB changed | PCIe Configurations | PCIe Revision | Processor Series | Rad Hardened | RoHS | Standard Package Name | Supplier Package | TDP - Max | Tradename | UART | Unit Weight | USART | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Family | Data Bus Width | Halogen Free | Address Bus Width | Product Type | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Number of External Interrupts | Security Features | Number of DMA Channels | SATA | Product | SPI | CAN | Product Category | Device Core | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No TS80C188XL20 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP | 80 | Bulk | e0 | 80 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 70°C | 0°C | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | GULL WING | 5V | 0.8mm | 20MHz | 80 | Not Qualified | 5V | 5V | INDUSTRIAL | 5V | 5.5V | 4.5V | MICROPROCESSOR | 90mA | 16 | 20 μs | 20 | NO | YES | 8 | FIXED POINT | NO | 0 | 5 | 2 | 3.15mm | 20mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CL8067702998909S R34U | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Intel | 6 MB | 64 | 1 | Core™ i5-7442EQ Processor | 8542.31.00.01 | 0 | 0 | RISC | Intel | 2.9 GHz | 2100 | Yes | Surface Mount | No | 4 | 42 | 28 | 953942 | 1440 | Intel Core i5-73442EQ | Details | FCBGA | 0 | 0 | Tray | Active | Embedded Processors & Controllers | 1440 | Intel Core i5 | CPU - Central Processing Units | i3 | 0 | 0 | 0 | 0 | CPU - Central Processing Units | Core i5 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68MH360RC33L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 241-BEPGA | 0°C~70°C TA | Tray | 1995 | M683xx | Obsolete | Not Applicable | MC68MH360 | 33MHz | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CM8064601481957S R1PA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | FCLGA-1150 | Intel | 4 MB | Haswell | 1 Configuration | 64 | 64(b) | 5A992.c | Embedded | 1 | Core™ i3-4350T Processor | 8542.31.00.01 | 0 | 0 | RISC | No Lead | Intel | 3.1 GHz | + 66.4 C | 3100 | DDR3L-1333,1600 | Surface Mount | SMD/SMT | No | 2 | 3 Display | 2 Channel | 37.5 | FCLGA | 37.5 | 931888 | 1150 | 1x16/2x8/1x8 + 2x4 | Revision 3.0 | i3-4350T | No | Details | LGA | FCLGA | 35 W | Core i3 | 0 | 3 oz | 0 | Tray | i3-4350T | Active | Embedded Processors & Controllers | 3100(MHz) | 1150 | PCIe/USB | 32 GB | Intel Core i3 | 64 Bit | CPU - Central Processing Units | i3 | 0 | 0 | 2 Core | Desktop Processors | 0 | 0 | CPU - Central Processing Units | Core i3 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AEN36LLAV23GME | AMD | Datasheet | - | - | Min: 1 Mult: 1 | BGA | 1.3GHz | PCIe | 64b | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 88AP320-C0-BGR2C806-TN21 | Marvell Semiconductor, Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 456 | e1 | 456 | TIN SILVER COPPER | 85°C | -40°C | BOTTOM | BALL | 3.3V | 0.5mm | 456 | INDUSTRIAL | 3.3V | 1.8V | 806 MHz | MICROPROCESSOR, RISC | 13MHz | YES | YES | FIXED POINT | YES | 1mm | 14mm | 14mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC850SRZT50BU | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | BGA | YES | 3 (168 Hours) | 256 | 95°C | 0°C | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 50MHz | NOT SPECIFIED | 256 | Not Qualified | 3.465V | 3.3V | MICROPROCESSOR, RISC | 32 | Not Halogen Free | 26 | YES | YES | 32 | FIXED POINT | YES | 1 | 2.35mm | 23mm | 23mm | RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TA80960KB-20 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 132 | 125°C | -40°C | Bulk | 132 | 3A991.A.2 | OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 20MHz | 132 | Not Qualified | 5V | AUTOMOTIVE | 5V | MICROPROCESSOR, RISC | 360mA | 32 | 20 μs | 32 | NO | NO | 32 | FLOATING POINT | NO | 0 | 4 | 4.57mm | 37.08mm | 37.08mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS101MASE7EHA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | 0°C~70°C TA | Tray | QorlQ LS1 | Obsolete | 3 (168 Hours) | 650MHz | ARM1136JF-S | GbE (2) | 1 Core 32-Bit | No | DDR2 | USB 2.0 + PHY (1) | I2C, PCIe, PCM/TDM, SPI, UART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S80C188EB25 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP | 80 | 70°C | Bulk | e0 | 80 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | NOT SPECIFIED | 5V | 0.8mm | 25MHz | NOT SPECIFIED | 80 | Not Qualified | 5V | COMMERCIAL | 5V | MICROPROCESSOR | 115mA | 16 | 25 μs | 20 | NO | YES | 8 | FIXED POINT | NO | 3.15mm | 20mm | 14mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NQ80331M250SL826 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FCBGA | 3 | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ES80C188EC20 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | QFP | 100 | Bulk | 85°C | -40°C | 20MHz | 5V | 5V | 5.5V | 4.5V | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P3041NSE1MMB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) | 0°C~105°C TA | Tray | 2006 | QorIQ P3 | Obsolete | 3 (168 Hours) | P3041 | 1.2GHz | PowerPC e500mc | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IDT79RV4650-200DP | Renesas Electronics America Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP Exposed Pad | 0°C~85°C TC | Tray | Obsolete | 3 (168 Hours) | IDT79RV4650 | 200MHz | MIPS-I | 3.3V | 1 Core 64-Bit | No | DRAM | System Control; CP0 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IDT79RV4700-150DP | Renesas Electronics America Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP Exposed Pad | 0°C~85°C TC | Tray | Obsolete | 3 (168 Hours) | IDT79RV4700 | 150MHz | MIPS-I | 3.3V | 1 Core 64-Bit | No | System Control; CP0 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KMPC8555EVTALF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2004 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8555 | 667MHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KMPC8555EVTAQF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2004 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8555 | 1.0GHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KMPC8555EPXAQF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2004 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8555 | 1.0GHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KMPC8321CVRADDC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 516-BBGA | 516-FPBGA (27x27) | -40°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8321 | 266MHz | PowerPC e300c2 | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No KMC7448VU1267ND | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-CBGA, FCCBGA | 360-FCCBGA (25x25) | 0°C~105°C TA | Tray | 2002 | MPC74xx | Obsolete | 1 (Unlimited) | MC7448 | 1.267GHz | PowerPC G4 | 1.5V 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | ROHS3 Compliant |
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TS80C188XL20
Intel
Package:Embedded - Microprocessors
Price: please inquire
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CL8067702998909S R34U
Intel
Package:Embedded - Microprocessors
Price: please inquire
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MC68MH360RC33L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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CM8064601481957S R1PA
Intel
Package:Embedded - Microprocessors
Price: please inquire
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AEN36LLAV23GME
AMD
Package:Embedded - Microprocessors
Price: please inquire
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88AP320-C0-BGR2C806-TN21
Marvell Semiconductor, Inc.
Package:Embedded - Microprocessors
Price: please inquire
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XPC850SRZT50BU
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
Price: please inquire
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TA80960KB-20
Intel
Package:Embedded - Microprocessors
Price: please inquire
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LS101MASE7EHA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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S80C188EB25
Intel
Package:Embedded - Microprocessors
Price: please inquire
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NQ80331M250SL826
Intel
Package:Embedded - Microprocessors
Price: please inquire
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ES80C188EC20
Intel
Package:Embedded - Microprocessors
Price: please inquire
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P3041NSE1MMB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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IDT79RV4650-200DP
Renesas Electronics America Inc.
Package:Embedded - Microprocessors
Price: please inquire
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IDT79RV4700-150DP
Renesas Electronics America Inc.
Package:Embedded - Microprocessors
Price: please inquire
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KMPC8555EVTALF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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KMPC8555EVTAQF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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KMPC8555EPXAQF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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KMPC8321CVRADDC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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KMC7448VU1267ND
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire