The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Halogen Free | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of External Interrupts | Bus Compatibility | Security Features | Display & Interface Controllers | Communication Protocol | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No MCIMX6Y7DVM09AA | NXP USA Inc. | Datasheet | 6 |
| Min: 1 Mult: 1 | 53 Weeks | 289-LFBGA | YES | 0°C~95°C TJ | Tray | 2015 | i.MX6 | Obsolete | 3 (168 Hours) | 289 | BOTTOM | BALL | 0.8mm | compliant | S-PBGA-B289 | 1.5V | 1.375V | 900MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 900MHz | 16 | YES | 16 | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 4 | Multimedia; NEON™ MPE | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | 1.32mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC860TVR80D4 | NXP USA Inc. | Datasheet | 68 | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No Z84C0008PEG | Zilog | Datasheet | 480 | - | Min: 1 Mult: 1 | 13 Weeks | Through Hole | 40-DIP (0.620, 15.75mm) | 40 | ROMless | 24 | -40°C~100°C TA | Tube | 2002 | Z80 | e3 | yes | Active | 1 (Unlimited) | 40 | 3A001.A.2.C | MATTE TIN | DRAM REFRESH COUNTER | DUAL | 5V | 2.54mm | 8MHz | Z84C00 | 40 | 5V | 5V | 4.5V | 64kB | MICROPROCESSOR | 8 | 8 | 8b | Z8 | NO | YES | FIXED POINT | NO | 0 | 5.0V | 1 Core 8-Bit | No | 2 | 4.19mm | 62.74mm | 14.22mm | Unknown | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6DP4AVT8AB | NXP USA Inc. | Datasheet | 2387 |
| Min: 1 Mult: 1 | 26 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | Active | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.225V | 852MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1048ASE7Q1A | NXP USA Inc. | Datasheet | 1999 |
| Min: 1 Mult: 1 | 18 Weeks | 780-BFBGA, FCBGA | 0°C~105°C | QorIQ® Layerscape | Active | 3 (168 Hours) | 250 | 30 | 1.6GHz | ARM® Cortex®-A53 | 10GbE (2), 1GbE (8) | 4 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC850CZQ50BU | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.35mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8536BVJAVLA | NXP USA Inc. | Datasheet | 1775 |
| Min: 1 Mult: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | Active | 3 (168 Hours) | 783 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | MPC8536 | S-PBGA-B783 | 1.05V | 0.95V | 1.5GHz | MICROPROCESSOR | PowerPC e500 | 32 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8347EVVAJF | NXP USA Inc. | Datasheet | 20000 | - | Min: 1 Mult: 1 | 672-LBGA | YES | 0°C~105°C TA | Tray | 2009 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.22.53.3V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | Cryptography, Random Number Generator | 1.69mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8555PXALF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2004 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A992 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | MPC8555 | S-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM | 3.75mm | 29mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAP3530DCBCA | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | no | Obsolete | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 720MHz | OMAP3530 | 515 | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 600 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 12 | 26 | ARM | YES | YES | FLOATING POINT | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1mm | 14mm | No | ROHS3 Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6D4AVT10AC | NXP USA Inc. | Datasheet | 8068 |
| Min: 1 Mult: 1 | 624-FBGA, FCBGA | YES | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8260AZUMHBB | NXP USA Inc. | Datasheet | 67 | - | Min: 1 Mult: 1 | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1994 | MPC82xx | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 2.2V | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68302FC16C | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | PQFP | YES | 132 | Bulk | e0 | 3 (168 Hours) | 132 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | QUAD | GULL WING | 5V | 0.635mm | 16MHz | 132 | Not Qualified | 5.5V | 5V | COMMERCIAL | 4.5V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | Not Halogen Free | 24 | YES | NO | 16 | 4 | 1 | 68000 | ASYNC, BIT | 4.572mm | RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC860SRVR66D4 | NXP USA Inc. | Datasheet | 176 | - | Min: 1 Mult: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX6X4EVM10AC | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 15 Weeks | 529-LFBGA | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | Active | 3 (168 Hours) | 260 | 40 | 227MHz, 1GHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC850DECZQ50BU | NXP USA Inc. | Datasheet | 113 | - | Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8572EVJATLE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | 1023-BBGA, FCBGA | 0°C~105°C TA | Tray | 1998 | MPC85xx | Active | 3 (168 Hours) | MPC8572 | 1.2GHz | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AM3894CCYG135 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 1031-BFBGA, FCBGA | YES | 1031 | 64 | 0°C~95°C TJ | Tray | Sitara™ | e1 | yes | Active | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 0.65mm | NOT SPECIFIED | AM3894 | Not Qualified | 3.3V | 1.05V | 1V | SDIO, SPI, UART, USB | 32kB | 1.35GHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 7 | ARM | 1.33GHz | YES | YES | FLOATING POINT | YES | 1.8V 3.3V | 3 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | DDR2, DDR3 | USB 2.0 + PHY (2) | I2C, McASP, McBSP, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | HDMI, HDVPSS | SATA 3Gbps (1) | 3.31mm | 25mm | 25mm | 2.81mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MVF60NN151CMK50 | NXP USA Inc. | Datasheet | 34 | - | Min: 1 Mult: 1 | 15 Weeks | 364-LFBGA | YES | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF60NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 16 | YES | YES | NO | YES | 16 | 16 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAP3530ECBBALPD | Texas Instruments | Datasheet | 21 |
| Min: 1 Mult: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 515-VFBGA, FCBGA | YES | 515 | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.35V | 0.5mm | 600MHz | NOT SPECIFIED | OMAP3530 | 515 | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | ARM | YES | YES | FIXED POINT | YES | 1.8V 3.0V | 3 | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | 1 | LCD | 900μm | 12mm | 12mm | 610μm | ROHS3 Compliant | Lead Free |
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MCIMX6Y7DVM09AA
NXP USA Inc.
Package:Embedded - Microprocessors
13.524578
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MPC860TVR80D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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Z84C0008PEG
Zilog
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6DP4AVT8AB
NXP USA Inc.
Package:Embedded - Microprocessors
125.990726
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LS1048ASE7Q1A
NXP USA Inc.
Package:Embedded - Microprocessors
172.060076
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MPC850CZQ50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8536BVJAVLA
NXP USA Inc.
Package:Embedded - Microprocessors
122.677712
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MPC8347EVVAJF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8555PXALF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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OMAP3530DCBCA
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6D4AVT10AC
NXP USA Inc.
Package:Embedded - Microprocessors
87.493178
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MPC8260AZUMHBB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68302FC16C
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
Price: please inquire
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MPC860SRVR66D4
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6X4EVM10AC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC850DECZQ50BU
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8572EVJATLE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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AM3894CCYG135
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MVF60NN151CMK50
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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OMAP3530ECBBALPD
Texas Instruments
Package:Embedded - Microprocessors
84.364309