The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Halogen Free | DAC Channels | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MPC8245TZU300D | NXP USA Inc. | Datasheet | 2242 |
| Min: 1 Mult: 1 | 12 Weeks | 352-LBGA | YES | -40°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 1.9V | 23.3V | 1.7V | 300MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT91SAM9260B-CU-100 | Microchip Technology | Datasheet | 21 |
| Min: 1 Mult: 1 | 10 Weeks | 217-LFBGA | 217 | 217-LFBGA (15x15) | ROM | 96 | -40°C~85°C TA | Tray | 1997 | AT91SAM | Active | 3 (168 Hours) | 85°C | -40°C | 180MHz | AT91SAM9260 | 3.3V | EBI/EMI, Ethernet, I2C, MMC, SPI, UART, USART, USB | 32kB | Internal | 180MHz | ARM926EJ-S | POR, WDT | 32b | ARM | 1.8V 2.5V 3.3V | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XAM3359ZCZ | Texas Instruments | Datasheet | 7 |
| Min: 1 Mult: 1 | Surface Mount | 324-LFBGA | 324 | 1.713814g | Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | Discontinued | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 600MHz | NOT SPECIFIED | AM3359 | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC755CPX350LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68302EH16CR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 132-BQFP Bumpered | 0°C~70°C TA | Tape & Reel (TR) | 1995 | M683xx | Not For New Designs | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | UNSPECIFIED | UNSPECIFIED | 5V | MC68302 | 5.5V | 4.5V | 16MHz | MICROPROCESSOR CIRCUIT | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX6D4AVT08AE | NXP USA Inc. | Datasheet | 1766 |
| Min: 1 Mult: 1 | 12 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tray | 2002 | i.MX6D | Active | 3 (168 Hours) | 260 | 40 | 852MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8555EPXAQF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.3V | 1mm | 30 | MPC8555 | S-PBGA-B783 | 1.35V | 1.25V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68340PV16E | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | LQFP | YES | 16 | Bulk | e0 | 4 (72 Hours) | 144 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | QUAD | GULL WING | 220 | 5V | 0.5mm | 16MHz | 30 | 144 | Not Qualified | 5.25V | 5V | COMMERCIAL | 4.75V | MICROCONTROLLER | 32 | NO | YES | NO | Not Halogen Free | NO | 32 | 16 | 1 | 20mm | 20mm | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8271VRMIBA | NXP USA Inc. | Datasheet | 50 |
| Min: 1 Mult: 1 | 12 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 2002 | MPC82xx | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8271 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No P1015NXN5DFB | NXP USA Inc. | Datasheet | 34 |
| Min: 1 Mult: 1 | 12 Weeks | 561-FBGA | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | Active | 3 (168 Hours) | P1015 | 667MHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No B4860NXN7QUMD | NXP USA Inc. | Datasheet | 2363 |
| Min: 1 Mult: 1 | 16 Weeks | 1020-BBGA, FCBGA | YES | -40°C~105°C TA | Box | 2002 | QorIQ Qonverge B | e1 | yes | Active | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.05V | 1mm | S-PBGA-B1020 | 1.08V | 1.02V | 1.8GHz | PowerPC e6500 | 133.333MHz | 16 | YES | 64 | 1.0V 1.2V 1.35V 1.5V 1.8V 2.5V | 1/2.5Gbps (4), 1/2.5/10Gbps (2) | 4 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 (1) | I2C, MMC/SD, RapidIO, SPI, UART | Signal Processing; SC3900FP FVP - 6 Core | USB; PCI; I2C | AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC | 2.93mm | 33mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC875CZT133 | NXP USA Inc. | Datasheet | 61 |
| Min: 1 Mult: 1 | 12 Weeks | 256-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.54mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68060RC50 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 206-BPGA | 206-PGA (47.25x47.25) | 0°C~70°C TA | Tray | 1995 | M680x0 | Obsolete | 1 (Unlimited) | MC68060 | 50MHz | 68060 | 5.0V | 1 Core 32-Bit | No | SCI, SPI | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1026ASN8MQA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | Active | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | S-PBGA-B780 | 0.93V | 0.87V | 1.2GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 2 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1043AXE7PQB | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 18 Weeks | 621-FBGA, FCBGA | YES | 4 | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | Active | 3 (168 Hours) | 621 | ALSO OPERATES AT 1V SUPPLY NOM | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | S-PBGA-B621 | 0.93V | 0.87V | 1.2GHz | ARM® Cortex®-A53 | 1400MHz | 16 | YES | 32 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | ETHERNET, I2C, PCI, SATA, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.07mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCIMX31CJMN4CR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 15 Weeks | 473-LFBGA | -40°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX31 | Active | 3 (168 Hours) | MCIMX31 | 400MHz | ARM1136JF-S | 1.8V 2.0V 2.5V 2.7V 3.0V | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D27A-CUR | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 20 Weeks | 289-LFBGA | 289 | External Program Memory | 128 | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SAMA5D2 | yes | Obsolete | 3 (168 Hours) | 500MHz | ATSAMA5D27 | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | ARM | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8347ZQADDB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 266MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68EN360CVR25L | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 357-BBGA | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e1 | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 40 | MC68EN360 | S-PBGA-B357 | 25MHz | RISC MICROCONTROLLER | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D24B-CUR | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 256-TFBGA | External Program Memory | 105 | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SAMA5D2 | yes | Obsolete | 3 (168 Hours) | 500MHz | ATSAMA5D24 | EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | ARM | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant |
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MPC8245TZU300D
NXP USA Inc.
Package:Embedded - Microprocessors
127.427248
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AT91SAM9260B-CU-100
Microchip Technology
Package:Embedded - Microprocessors
14.461006
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XAM3359ZCZ
Texas Instruments
Package:Embedded - Microprocessors
33.593840
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MPC755CPX350LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68302EH16CR2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX6D4AVT08AE
NXP USA Inc.
Package:Embedded - Microprocessors
115.672184
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MPC8555EPXAQF
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68340PV16E
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
Price: please inquire
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MPC8271VRMIBA
NXP USA Inc.
Package:Embedded - Microprocessors
73.522556
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P1015NXN5DFB
NXP USA Inc.
Package:Embedded - Microprocessors
92.032904
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B4860NXN7QUMD
NXP USA Inc.
Package:Embedded - Microprocessors
576.035673
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MPC875CZT133
NXP USA Inc.
Package:Embedded - Microprocessors
53.550152
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MC68060RC50
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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LS1026ASN8MQA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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LS1043AXE7PQB
NXP USA Inc.
Package:Embedded - Microprocessors
81.359298
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MCIMX31CJMN4CR2
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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ATSAMA5D27A-CUR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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MPC8347ZQADDB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MC68EN360CVR25L
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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ATSAMA5D24B-CUR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire