Embedded - PLDs (Programmable Logic Device) (2797)

-

-

Min: 1

Mult: 1

NO

100

33.3 MHz

CYPRESS SEMICONDUCTOR CORP

64

70 °C

CERAMIC, METAL-SEALED COFIRED

WPGA

WPGA,

SQUARE

GRID ARRAY, WINDOW

Obsolete

PGA

5.25 V

4.75 V

5 V

128 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS

8542.39.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

100

S-CPGA-P100

Not Qualified

COMMERCIAL

55 ns

19 DEDICATED INPUTS, 64 I/O

4.953 mm

UV PLD

MACROCELL

19

33.528 mm

33.528 mm

-

-

Min: 1

Mult: 1

NO

20

PHILIPS COMPONENTS

8

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

5.5 V

4.5 V

5 V

3A001.A.2.C

PROGRAMMABLE O/P POLARITY

8542.39.00.01

DUAL

THROUGH-HOLE

unknown

R-CDIP-T20

Not Qualified

MILITARY

30 ns

10 DEDICATED INPUTS, 8 I/O

OT PLD

COMBINATORIAL

10

-

-

Min: 1

Mult: 1

NO

20

37 MHz

ADVANCED MICRO DEVICES INC

4

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP, DIP20,.3

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

TIN LEAD

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

20

R-GDIP-T20

8

Not Qualified

MILITARY

17 ns

PAL-TYPE

12

8 DEDICATED INPUTS, 4 I/O

OT PLD

38535Q/M;38534H;883B

MIXED

8

64

-

-

Min: 1

Mult: 1

YES

100

77 MHz

NXP SEMICONDUCTORS

64

85 °C

-40 °C

PLASTIC/EPOXY

QFP

14 X 20 X 2.80 MM, PLASTIC, SOT-382-1, QFP-100

RECTANGULAR

FLATPACK

Obsolete

QFP

5.5 V

4.5 V

5 V

8542.39.00.01

QUAD

GULL WING

0.65 mm

unknown

100

R-PQFP-G100

Not Qualified

INDUSTRIAL

12.5 ns

2 DEDICATED INPUTS, 64 I/O

3.4 mm

EE PLD

MACROCELL

2

20 mm

14 mm

-

-

Min: 1

Mult: 1

YES

100

XILINX INC

3

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

Obsolete

No

5 V

e0

TIN LEAD

NO

8542.39.00.01

QUAD

GULL WING

225

0.635 mm

not_compliant

30

R-PQFP-G100

Not Qualified

INDUSTRIAL

12.5 ns

EE PLD

64

NO

NO

-

-

Min: 1

Mult: 1

YES

84

105 MHz

ADVANCED MICRO DEVICES INC

3

70 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Active

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

YES

QUAD

J BEND

225

1.27 mm

compliant

30

S-PQCC-J84

Not Qualified

COMMERCIAL

9.5 ns

PAL/PLA-TYPE

EE PLD

64

YES

YES

737
In Stock

-

Min: 1

Mult: 1

YES

28

69 MHz

XILINX INC

10

70 °C

PLASTIC/EPOXY

QCCJ

QCCJ,

SQUARE

CHIP CARRIER

Obsolete

LCC

3.63 V

2.97 V

3.3 V

PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

28

S-PQCC-J28

Not Qualified

COMMERCIAL

15 ns

11 DEDICATED INPUTS, 10 I/O

4.57 mm

EE PLD

MACROCELL

11

11.5062 mm

11.5062 mm

-

-

Min: 1

Mult: 1

YES

240

ALTERA CORP

181

85 °C

PLASTIC/EPOXY

HFQFP

HFQFP,

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Obsolete

QFP

No

1.8 V

e3

MATTE TIN

8542.39.00.01

QUAD

GULL WING

220

0.5 mm

compliant

240

S-PQFP-G240

Not Qualified

OTHER

4 DEDICATED INPUTS, 181 I/O

4.1 mm

LOADABLE PLD

MACROCELL

4

32 mm

32 mm

-

-

Min: 1

Mult: 1

YES

24

74 MHz

NXP SEMICONDUCTORS

10

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP,

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Transferred

5.5 V

4.5 V

5 V

8542.39.00.01

DUAL

GULL WING

0.65 mm

unknown

R-PDSO-G24

Not Qualified

INDUSTRIAL

11 ns

11 DEDICATED INPUTS, 10 I/O

1.1 mm

EE PLD

MACROCELL

11

7.8 mm

4.4 mm

662
In Stock

-

Min: 1

Mult: 1

YES

24

74 MHz

XILINX INC

10

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP,

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Obsolete

TSSOP

5.5 V

4.5 V

5 V

PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET

8542.39.00.01

DUAL

GULL WING

0.65 mm

unknown

24

R-PDSO-G24

Not Qualified

INDUSTRIAL

10 ns

11 DEDICATED INPUTS, 10 I/O

1.1 mm

EE PLD

MACROCELL

11

7.8 mm

4.4 mm

-

-

Min: 1

Mult: 1

YES

128

XILINX INC

3

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, QFP128,.63X.87,20

QFP128,.63X.87,20

RECTANGULAR

FLATPACK

Obsolete

No

5 V

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

R-PQFP-G128

Not Qualified

INDUSTRIAL

17.5 ns

EE PLD

128

YES

YES

-

-

Min: 1

Mult: 1

YES

100

71 MHz

NXP SEMICONDUCTORS

80

70 °C

PLASTIC/EPOXY

TFQFP

TFQFP,

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Transferred

5.25 V

4.75 V

5 V

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

S-PQFP-G100

Not Qualified

COMMERCIAL

12 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

105
In Stock

-

Min: 1

Mult: 1

YES

100

71 MHz

XILINX INC

3

80

70 °C

PLASTIC/EPOXY

TFQFP

14 X 14 MM, 1 MM HEIGHT, PLASTIC, TQFP-100

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

No

5.25 V

4.75 V

5 V

128 MACROCELLS

8542.39.00.01

TRAY

QUAD

GULL WING

240

0.5 mm

unknown

30

100

S-PQFP-G100

Not Qualified

COMMERCIAL

12 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

128

YES

2

YES

14 mm

14 mm

-

-

Min: 1

Mult: 1

YES

44

105 MHz

NXP SEMICONDUCTORS

32

70 °C

PLASTIC/EPOXY

TQFP

TQFP,

SQUARE

FLATPACK, THIN PROFILE

Transferred

5.25 V

4.75 V

5 V

8542.39.00.01

QUAD

GULL WING

0.8 mm

unknown

S-PQFP-G44

Not Qualified

COMMERCIAL

11 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

-

-

Min: 1

Mult: 1

YES

44

PHILIPS SEMICONDUCTORS

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC44,.7SQ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Transferred

No

3.3 V

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

Not Qualified

INDUSTRIAL

12 ns

EE PLD

32

NO

NO

-

-

Min: 1

Mult: 1

YES

44

58 MHz

XILINX INC

3

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

TQFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK, THIN PROFILE

Obsolete

QFP

No

3.6 V

2.97 V

3.3 V

e0

TIN LEAD

NO

8542.39.00.01

QUAD

GULL WING

240

0.8 mm

not_compliant

30

44

S-PQFP-G44

Not Qualified

INDUSTRIAL

15 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

64

NO

2

NO

10 mm

10 mm

-

-

Min: 1

Mult: 1

YES

100

77 MHz

XILINX INC

3

80

70 °C

PLASTIC/EPOXY

QFP

14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100

QFP100,.7X.9

RECTANGULAR

FLATPACK

Obsolete

QFP

No

3.63 V

2.97 V

3.3 V

e0

TIN LEAD

128 MACROCELLS

8542.39.00.01

TRAY

QUAD

GULL WING

225

0.65 mm

not_compliant

30

100

R-PQFP-G100

Not Qualified

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

128

YES

2

YES

20 mm

14 mm

-

-

Min: 1

Mult: 1

YES

56

90 MHz

XILINX INC

44

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

6 X 6 MM, 1.05 MM HEIGHT, LFBGA-56

BGA56,10X10,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

No

3.6 V

2.7 V

e0

TIN LEAD

YES

8542.39.00.01

BOTTOM

BALL

0.5 mm

compliant

56

S-PBGA-B56

Not Qualified

INDUSTRIAL

11.5 ns

2 DEDICATED INPUTS, 44 I/O

1.35 mm

EE PLD

MACROCELL

64

YES

2

YES

6 mm

6 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

100

PHILIPS SEMICONDUCTORS

70 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

Transferred

No

5 V

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

S-PQFP-G100

Not Qualified

COMMERCIAL

12 ns

EE PLD

64

YES

YES