The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Base Part Number
- Connectivity
- Core Architecture
- Core Processor
- Flash Size
- Frequency
- Interface
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Base Part Number:
A2F060M3E
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Number of Equivalent Gates | Flash Size | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No A2F060M3E-TQG144I | Microsemi Corporation | Datasheet | 667 | - | Min: 1 Mult: 1 | 12 Weeks | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2011 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A2F060M3E-FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FGG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2 Weeks | Surface Mount | 256-LBGA | 256 | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | 80MHz | 30 | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 3mA | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 660 | ARM | 60000 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 1.7mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQ144 | Microsemi Corporation | Datasheet | 668 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQG144I | Microsemi Corporation | Datasheet | 670 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2009 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.5V | 100MHz | 20 | A2F060M3E | 66 | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 8 | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 60000 | 128KB | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 3mA | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 660 | ARM | 60000 | 100MHz | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256 | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 8542.39.00.01 | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQG144 | Microsemi Corporation | Datasheet | 666 | - | Min: 1 Mult: 1 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 128KB | 1.4mm | 20mm | 20mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.5V | 1mm | 100MHz | 30 | A2F060M3E | 66 | Not Qualified | 1.575V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 1536 CLBS, 60000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 60000 | 128KB | 1.7mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 125°C | -55°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 125°C | -55°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQ144 | Microsemi Corporation | Datasheet | 665 | - | Min: 1 Mult: 1 | 2 Weeks | 144-LQFP | YES | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 225 | 1.5V | 0.5mm | 80MHz | 20 | A2F060M3E | S-PQFP-G144 | 33 | Not Qualified | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 33 | 1536 CLBS, 60000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 60000 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQG144 | Microsemi Corporation | Datasheet | 664 | - | Min: 1 Mult: 1 | 12 Weeks | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2000 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2009 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 128KB | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQ144I | Microsemi Corporation | Datasheet | 669 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2 Weeks | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQ144I | Microsemi Corporation | Datasheet | 668 | - | Min: 1 Mult: 1 | 12 Weeks | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 8542.39.00.01 | unknown | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant |
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A2F060M3E-TQG144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FGG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1TQG144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1TQG144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FGG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-TQG144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1TQ144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-TQ144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire