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Embedded - System On Chip (SoC) (16)

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Base Part Number:
XC7Z030

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Contact Plating	Package / Case	Surface Mount	Number of Pins	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	Pin Count	JESD-30 Code	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	RAM Size	Core Processor	Peripherals	Connectivity	Architecture	Data Bus Width	Core Architecture	Boundary Scan	Speed Grade	RAM (words)	Primary Attributes	Bus Compatibility	UV Erasable	Height Seated (Max)	Length	Radiation Hardening	RoHS Status
Mfr Part No XC7Z030-2FFG676I	Xilinx Inc.	Datasheet	5628 In Stock	1: $81.354473 10: $76.749503 100: $72.405191 500: $68.306784 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1	yes	Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z030	676		1V	1.05V	11.8V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB	N	3.24mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-2FBG484I	Xilinx Inc.	Datasheet	792 In Stock	1: $148.501086 10: $140.095364 100: $132.165438 500: $124.684375 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	250	1V	1mm	800MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-2FBG676I	Xilinx Inc.	Datasheet	396 In Stock	1: $289.069381 10: $279.564198 25: $277.620852 50: $275.691015 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-1FBG676I	Xilinx Inc.	Datasheet	396 In Stock	1: $401.785061 10: $388.573560 25: $385.872453 50: $383.190122 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-1FFG676I	Xilinx Inc.	Datasheet	396 In Stock	1: $87.280371 10: $82.339972 100: $77.679219 500: $73.282282 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1	yes	Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z030	676		1V	1.05V	11.8V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB	N	3.24mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-1FBG676C	Xilinx Inc.	Datasheet	396 In Stock	1: $324.281365 10: $313.618342 25: $311.438274 50: $309.273360 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-1FBG484I	Xilinx Inc.	Datasheet	792 In Stock	1: $162.330251 10: $153.141747 100: $144.473346 500: $136.295609 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	250	1V	1mm	667MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-2FBG484E	Xilinx Inc.	Datasheet	2131 In Stock	1: $330.354545 10: $311.655232 100: $294.014369 500: $277.372047 View all price	Min: 1 Mult: 1	10 Weeks		484-BBGA, FCBGA	YES	484	130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	250	1V	1mm	800MHz	30	XC7Z030				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-2FFG676E	Xilinx Inc.	Datasheet	2126 In Stock	1: $536.382713 10: $506.021427 100: $477.378705 500: $450.357269 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		3.24mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-2FBG676E	Xilinx Inc.	Datasheet	2208 In Stock	1: $381.778973 10: $360.168843 100: $339.781927 500: $320.548988 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-3FBG484E	Xilinx Inc.	Datasheet	792 In Stock	1: $171.016290 10: $165.392930 25: $164.243228 50: $163.101517 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484	130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	3 (168 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	250	1V	1mm	1GHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-1FFG676C	Xilinx Inc.	Datasheet	392 In Stock	1: $87.951491 10: $82.973105 100: $78.276514 500: $73.845768 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		3.24mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-3FBG676E	Xilinx Inc.	Datasheet	396 In Stock	1: $299.994049 10: $290.129641 25: $288.112851 50: $286.110080 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-1FBG484C	Xilinx Inc.	Datasheet	784 In Stock	1: $163.399821 10: $158.026906 25: $156.928407 50: $155.837545 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484	130	0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	250	1V	1mm	667MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-3FFG676E	Xilinx Inc.	Datasheet	600 In Stock	1: $571.017369 10: $538.695631 100: $508.203425 500: $479.437193 View all price	Min: 1 Mult: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB		3.24mm	27mm	No	ROHS3 Compliant
Mfr Part No XC7Z030-2FF676I	Xilinx Inc.	Datasheet	1886 In Stock	1: $333.174104 10: $314.315192 100: $296.523766 500: $279.739402 View all price	Min: 1 Mult: 1	11 Weeks		676-BBGA, FCBGA	YES		130	-40°C~100°C TJ	Tray	2009	Zynq®-7000			Active	4 (72 Hours)	676			8542.39.00.01	BOTTOM	BALL				800MHz		XC7Z030		S-PBGA-B676					CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES		256000	Kintex™-7 FPGA, 125K Logic Cells	CAN, ETHERNET, I2C, PCI, SPI, UART, USB					Non-RoHS Compliant

XC7Z030-2FFG676I

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

81.354473
XC7Z030-2FBG484I

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

148.501086
XC7Z030-2FBG676I

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

289.069381
XC7Z030-1FBG676I

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

401.785061
XC7Z030-1FFG676I

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

87.280371
XC7Z030-1FBG676C

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

324.281365
XC7Z030-1FBG484I

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

162.330251
XC7Z030-2FBG484E

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

330.354545
XC7Z030-2FFG676E

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

536.382713
XC7Z030-2FBG676E

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

381.778973
XC7Z030-3FBG484E

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

171.016290
XC7Z030-1FFG676C

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

87.951491
XC7Z030-3FBG676E

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

299.994049
XC7Z030-1FBG484C

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

163.399821
XC7Z030-3FFG676E

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

571.017369
XC7Z030-2FF676I

Xilinx Inc.

Package:Embedded - System On Chip (SoC)

333.174104

Embedded - System On Chip (SoC) (16)