The category is 'Embedded - System On Chip (SoC)'
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- Architecture
- Base Part Number
- Connectivity
- Core Architecture
- Core Processor
- Frequency
- Interface
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
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- Packaging
- Base Part Number:
XC7Z045
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Data Bus Width | Number of Logic Elements/Cells | Core Architecture | Max Frequency | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XC7Z045-2FFG900I | Xilinx Inc. | Datasheet | - |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No XC7Z045-2FFG676I | Xilinx Inc. | Datasheet | 396 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-3FFG900E | Xilinx Inc. | Datasheet | 720 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-2FFG676E | Xilinx Inc. | Datasheet | 594 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-2FFG900E | Xilinx Inc. | Datasheet | 412 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-1FBG676C | Xilinx Inc. | Datasheet | 404 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | ROMless | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | 190000 | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XC7Z045-2FBG676I | Xilinx Inc. | Datasheet | 522 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-1FFG900I | Xilinx Inc. | Datasheet | 663 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-1FFG676I | Xilinx Inc. | Datasheet | 778 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | 676 | S-PBGA-B676 | 1V | 1.05V | 11.8V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 3.37mm | 27mm | No | ROHS3 Compliant | ||||||||||||
| Mfr Part No XC7Z045-1FFG900C | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | 900 | ROMless | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | 190000 | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XC7Z045-1FBG676I | Xilinx Inc. | Datasheet | 594 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-3FFG676E | Xilinx Inc. | Datasheet | 477 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-1FFG676C | Xilinx Inc. | Datasheet | 509 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-2FBG676E | Xilinx Inc. | Datasheet | 517 |
| Min: 1 Mult: 1 | 10 Weeks | 676-BBGA, FCBGA | 676-FCBGA (27x27) | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 100°C | 0°C | 800MHz | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | 733MHz | -2 | Kintex™-7 FPGA, 350K Logic Cells | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-3FBG676E | Xilinx Inc. | Datasheet | 485 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-2FBG676CES | Xilinx Inc. | Datasheet | 990 | - | Min: 1 Mult: 1 | 7 Weeks | 676-BBGA, FCBGA | 676-FCBGA (27x27) | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 85°C | 0°C | 800MHz | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | Kintex™-7 FPGA, 350K Logic Cells | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FFG900CES | Xilinx Inc. | Datasheet | 68 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 85°C | 0°C | 800MHz | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | Kintex™-7 FPGA, 350K Logic Cells | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FFG900CES | Xilinx Inc. | Datasheet | 84 | - | Min: 1 Mult: 1 | 7 Weeks | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 85°C | 0°C | 667MHz | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | Kintex™-7 FPGA, 350K Logic Cells | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FBG676CES | Xilinx Inc. | Datasheet | 989 | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | YES | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 676 | BOTTOM | BALL | 1V | 1mm | 667MHz | XC7Z045 | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | RoHS Compliant |
-
XC7Z045-2FFG900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
360.823877
-
XC7Z045-2FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-3FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
3,021.437314
-
XC7Z045-2FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,158.224113
-
XC7Z045-2FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,812.329872
-
XC7Z045-1FBG676C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
709.201899
-
XC7Z045-2FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,024.737702
-
XC7Z045-1FFG900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,474.589443
-
XC7Z045-1FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,911.433090
-
XC7Z045-1FFG900C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
239.298806
-
XC7Z045-1FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
850.199450
-
XC7Z045-3FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,388.444925
-
XC7Z045-1FFG676C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,786.986655
-
XC7Z045-2FBG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,956.938955
-
XC7Z045-3FBG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,173.009651
-
XC7Z045-2FBG676CES
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-2FFG900CES
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-1FFG900CES
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-1FBG676CES
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire