The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Base Part Number
- Connectivity
- Core Processor
- ECCN Code
- HTS Code
- JESD-30 Code
- JESD-609 Code
- Length
- Number of I/Os
- Number of Inputs
- Number of Logic Cells
- ECCN Code:
3A991
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of I/Os | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
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 | Mfr Part No 5CSEBA5U23I7N | Intel | Datasheet | 1804 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 672 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA5U23I7N | ALTERA | Datasheet | 1918 | - | Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | 622 MHz | INTEL CORP | Intel Corporation | 5CSEBA5U23I7N | 3 | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 1.99 | Compliant | Yes | 8542390000 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | Lead Free |