The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- ECCN Code
- JESD-609 Code
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Peak Reflow Temperature (Cel)
- Peripherals
- Primary Attributes
- ECCN Code:
3A991.D
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | RAM Size | Core Processor | Peripherals | Propagation Delay | Connectivity | Architecture | Data Bus Width | Number of Logic Elements/Cells | Core Architecture | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XC7Z045-2FFG900I | Xilinx Inc. | Datasheet | - |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No XC7Z030-2FFG676I | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 676 | 1V | 1.05V | 11.8V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 3.24mm | 27mm | No | ROHS3 Compliant | ||||||||||||
 | Mfr Part No XC7Z020-1CLG484I | Xilinx Inc. | Datasheet | 784 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 484 | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z100-2FFG900I | Xilinx Inc. | Datasheet | 99 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | 900 | 212 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z100 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Kintex™-7 FPGA, 444K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No XC7Z030-2FBG676I | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z030-1FBG676I | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z020-2CLG484I | Xilinx Inc. | Datasheet | 720 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 484 | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | No | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No XC7Z020-1CLG484C | Xilinx Inc. | Datasheet | 4880 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 2 | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z020 | S-PBGA-B484 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | Artix™-7 FPGA, 85K Logic Cells | 1.6mm | 19mm | No | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XC7Z030-1FFG676I | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | 676 | 1V | 1.05V | 11.8V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 3.24mm | 27mm | No | ROHS3 Compliant | ||||||||||||
| Mfr Part No XC7Z030-1FBG676C | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z035-2FFG676I | Xilinx Inc. | Datasheet | 986 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | 3.37mm | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No XC7Z045-2FFG676I | Xilinx Inc. | Datasheet | 396 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XC7Z035-2FFG900I | Xilinx Inc. | Datasheet | 776 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | S-PBGA-B900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | 3.35mm | 31mm | 31mm | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XC7Z045-3FFG900E | Xilinx Inc. | Datasheet | 716 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XC7Z045-2FFG676E | Xilinx Inc. | Datasheet | 419 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XC7Z045-2FFG900E | Xilinx Inc. | Datasheet | 608 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XC7Z045-1FBG676C | Xilinx Inc. | Datasheet | 685 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | ROMless | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | 190000 | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||
| Mfr Part No XC7Z030-2FFG676E | Xilinx Inc. | Datasheet | 1849 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.24mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z045-2FBG676I | Xilinx Inc. | Datasheet | 465 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XC7Z020-2CLG484E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | No | ROHS3 Compliant |
-
XC7Z045-2FFG900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
366.055168
-
XC7Z030-2FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
77.422789
-
XC7Z020-1CLG484I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z100-2FFG900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
257.885758
-
XC7Z030-2FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
280.629095
-
XC7Z030-1FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
390.053687
-
XC7Z020-2CLG484I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z020-1CLG484C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
26.157261
-
XC7Z030-1FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
84.731947
-
XC7Z030-1FBG676C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
314.812955
-
XC7Z035-2FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
142.347376
-
XC7Z045-2FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z035-2FFG900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
169.400595
-
XC7Z045-3FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
3,044.991161
-
XC7Z045-2FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,163.135825
-
XC7Z045-2FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,821.834998
-
XC7Z045-1FBG676C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
709.086688
-
XC7Z030-2FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
255.431221
-
XC7Z045-2FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,028.191487
-
XC7Z020-2CLG484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
24.409781