The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- ECCN Code
- Architecture
- Connectivity
- Core Processor
- HTS Code
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peak Reflow Temperature (Cel)
- Peripherals
- ECCN Code:
EAR99
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of I/Os | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Interface | Memory Size | Analog IC - Other Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Primary Attributes | Number of Logic Cells | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No 5CSEBA2U23I7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA2U23I7N | 3 | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2 | Yes | Yes | FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9 | 8542390000 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | S-PBGA-B672 | 145 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | |||||||||||
| Mfr Part No 71M6531F-IMR/F3 | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | SILERGY CORP | 71M6531F-IMR/F3 | , | Contact Manufacturer | NOT SPECIFIED | 5.4 | Yes | EAR99 | 8542.39.00.01 | NOT SPECIFIED | compliant | POWER SUPPLY MANAGEMENT CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XA7Z030-1FBG484I | Xilinx Inc. | Datasheet | 774 | - | Min: 1 Mult: 1 | 484-BBGA, FCBGA | YES | 130 | Automotive grade | -40°C~100°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Obsolete | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1mm | not_compliant | 30 | S-PBGA-B484 | Not Qualified | 11.8V | 667MHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | N | 2.54mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA7Z030-1FBG484Q | Xilinx Inc. | Datasheet | 776 | - | Min: 1 Mult: 1 | 484-BBGA, FCBGA | YES | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Obsolete | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1mm | not_compliant | 30 | S-PBGA-B484 | Not Qualified | 11.8V | 667MHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | N | 2.54mm | 23mm | 23mm | RoHS Compliant |
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5CSEBA2U23I7N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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71M6531F-IMR/F3
Maxim Integrated
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XA7Z030-1FBG484I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XA7Z030-1FBG484Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire