The category is 'Embedded - System On Chip (SoC)'
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Lead Free
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Number of Terminals | Core Material | Airflow | Approvals | Base Product Number | Brand | Clock Frequency-Max | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Lifecycle Status | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Typical Operating Supply Voltage | Voltage, Rating | Watchdog Timers | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Termination | ECCN Code | Connector Type | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Power Rating | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Output Voltage | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Termination Type | Memory Size | Operating Supply Current | Speed | RAM Size | Output Current | Core Processor | Number of Poles | Peripherals | Program Memory Size | Connectivity | Reset | Data Rate | Architecture | Number of Voltages Monitored | Reset Timeout | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Nominal Input Voltage | Product Type | Min Reset Threshold Voltage | Max Reset Threshold Voltage | Evaluation Kit | Threshold Voltage | Undervoltage Threshold | Overvoltage Threshold | Bearing Type | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Cells | Number of Transceivers | Primary Attributes | Number of Registers | Max Junction Temperature (Tj) | Number of Logic Cells | Rated Voltage | Number of Cores | Flash Size | Mode of Operation | Rated Current (Power) | Max Charge Current | Product Category | Contacts | IP Rating | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No XCVM1102-1MSESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 6 | Xilinx | 1 | Xilinx | + 100 C | 0 C | Compliant | No | 85 °C | -40 °C | SOC - Systems on a Chip | 695 mW | 800 mV | 5.5 V | 1 V | System-On-Modules - SOM | 2.243 V | 2.358 V | SoC FPGA | No | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5C6U23I7N | ALTERA | Datasheet | 290 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | 672-FBGA | YES | 28 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | PRODUCTION (Last Updated: 1 month ago) | 5CSXFC5C6U23I7N | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.57 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSXFC5 | S-PBGA-B672 | 145 | Not Qualified | 17.65 V | 28 V | 1.1,1.2/3.3,2.5 V | 2.7 mA | 800MHz | 64KB | 4 A | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 28 V | Yes | 4 | FPGA - 85K Logic Elements | 85000 | -- | 5 A | 23 mm | 23 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2102-3HSESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | 3 | Xilinx | 1 | Xilinx | PRODUCTION (Last Updated: 1 month ago) | + 100 C | 0 C | Compliant | No | Tape & Reel (TR) | Simple Reset/Power-On Reset | 125 °C | -40 °C | SOC - Systems on a Chip | 320 mW | 1 | 880 mV | 5.5 V | 1 V | 5 µA | 20 mA | Active Low | 1 | 100 ms | System-On-Modules - SOM | 4.547 V | 4.713 V | 4.63 V | 4.547 V | 4.713 V | 150 °C | SoC FPGA | 1.12 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5D6F31I7N | ALTERA | Datasheet | 787 | - | Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSXFC5D6F31I7N | MCU - 181, FPGA - 288 | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.06 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | Screwless Blocks | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 3.5mm | compliant | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 29 | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | 800 MHz | 32075 | 7 | 9 | FPGA - 85K Logic Elements | 85000 | 300V | -- | 2A | 31 mm | 31 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA6F31C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 5CSEMA6 | 1.13 V | 773.9 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 110000 | 800 MHz | 41509 | 6 | FPGA - 110K Logic Elements | -- | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31C8N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSEMA5F31C8N | 3 | MCU - 181, FPGA - 288 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.05 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 3.3 V | 1.8 V | 556.3 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | 85000 | 800 MHz | 32075 | 8 | FPGA - 85K Logic Elements | 128300 | 85000 | -- | 31 mm | 31 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U19I7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | 622 MHz | INTEL CORP | Intel Corporation | 5CSEBA5U19I7N | MCU - 151, FPGA - 66 | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | 40 | 5.55 | Non-Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | TIN SILVER COPPER | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 260 | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 19 mm | 19 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6D6F31C8N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | 8542390000 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | 85 °C | 0 °C | 600 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 800 MHz | 41509 | 8 | 9 | FPGA - 110K Logic Elements | -- | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FCSG325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050-1FCSG325I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 200 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCSG325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | DIN Rail,Surface | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | CSA, UL | M2S060 | MICROSEMI CORP | Syrelec, Brand of Crouzet Control | SHS1S24A | 1.26 V | Microchip Technology | 1.14 V | 3 | 200 | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 2.36 | No | Yes | 8542390000 | 1.26 V | 1.14 V | 1.2 V | 1 | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | 0.250 in Flat Blade | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 256KB | Interval | Solid State | IP66 | 11 mm | 11 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1PQG208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | Powdered Iron | A2F200 | Microchip Technology | Thru-Hole | 113 | Tray | Active | Compliant | 8542310000/8542310000/8542310000/8542310000/8542310000 | -55°C to +105°C | SmartFusion® | 0.1 | 85 °C | 0 °C | 100 MHz | 1.5 V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575 V | 1.425 V | Pb | 4.5 kB | 7 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100 MHz | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23I7N | ALTERA | Datasheet | 142 | - | Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | 622 MHz | INTEL CORP | Intel Corporation | 5CSEBA5U23I7N | 3 | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 1.99 | Compliant | Yes | 8542390000 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23I7N | ALTERA | Datasheet | 276 | - | Min: 1 Mult: 1 | 672-FBGA | 672 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 8542390000 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | PCB Terminal Blocks with Wire | 100 °C | -40 °C | 800 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 09 | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 800 MHz | 41509 | 7 | 6 | FPGA - 110K Logic Elements | 300V | -- | 13.5A | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSTFD6D5F31I7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSTFD6D5F31I7N | 3 | MCU - 181, FPGA - 288 | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.03 | Compliant | Yes | FPGA - Field Programmable Gate Array Cyclone V ST dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSTFD6 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 5 Gbps | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 110000 | 800 MHz | 41509 | 7 | 9 | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6D6F31I7N | ALTERA | Datasheet | 659 | - | Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | 100 °C | -40 °C | 800 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 800 MHz | 41509 | 7 | 9 | FPGA - 110K Logic Elements | -- | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5D6F31C8N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSXFC5D6F31C8N | MCU - 181, FPGA - 288 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.04 | Compliant | Yes | FPGA, Cyclone V SX, 85000 cell, UFBGA896 5CSXFC5D6F31C8N, FPGA Cyclone V SX 85000 Cells, 85000 Gates, 4450K, 32075 Blocks, 1.07 u2192 1.13 V 896-Pin FBGA | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 600 MHz | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.13 V | 1.07 V | 556.3 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 85000 | 800 MHz | 32075 | 8 | 9 | FPGA - 85K Logic Elements | 128300 | 85000 | -- | 31 mm | 31 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-1FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Plastic | 55.62 CFM | XCZU4 | AMD | 204 | Tray | Active | Compliant | 12 V | -40°C ~ 100°C (TJ) | Box | Zynq® UltraScale+™ MPSoC EG | Wire Leads | 10.2 W | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Ball | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 60 mm | 60 mm | 38 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA6U23C7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | 121064 | INTEL CORP | Intel Corporation | 5CSEBA6U23C7N | Molex | MCU - 181, FPGA - 145 | 85 °C | Bulk | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2.01 | Compliant | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | * | Active | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 110000 | 800 MHz | 41509 | 7 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 5CSEMA5 | 1.13 V | 556.3 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 85000 | 800 MHz | 32075 | 6 | FPGA - 85K Logic Elements | -- | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSTFD5D5F31I7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSTFD5D5F31I7N | 3 | MCU - 181, FPGA - 288 | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.02 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 800 MHz | 5CSTFD5 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 5 Gbps | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 800 MHz | 32075 | 7 | 9 | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | Lead Free |
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5CSXFC5C6U23I7N
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XCVE2102-3HSESFVA784
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5CSXFC5D6F31I7N
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5CSEMA6F31C6N
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