The category is 'Embedded - System On Chip (SoC)'
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- Architecture
- Connectivity
- Core Processor
- Flash Size
- Number of I/Os
- Operating Temperature
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- Peripherals
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- RAM Size
- Series
- Lead Free:
Lead Free
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Airflow | Base Product Number | Memory Types | Mfr | Number of I/Os | Package | Product Status | RoHS | Voltage, Rating | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Power Rating | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Propagation Delay | Connectivity | Data Rate | Architecture | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Bearing Type | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Max Junction Temperature (Tj) | Number of Logic Cells | Flash Size | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No XCZU4EG-1FBVB900I | AMD | Datasheet | 420 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Plastic | 55.62 CFM | XCZU4 | AMD | 204 | Tray | Active | Compliant | 12 V | -40°C ~ 100°C (TJ) | Box | Zynq® UltraScale+™ MPSoC EG | Wire Leads | 10.2 W | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Ball | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 60 mm | 60 mm | 38 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A2F200M3F-FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2 Weeks | 484-BGA | YES | 484 | MCU - 41, FPGA - 94 | 0°C~85°C TJ | Tray | 2011 | SmartFusion® | e1 | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | 80MHz | 40 | A2F200 | 94 | Not Qualified | 1.5V | 1.51.82.53.3V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 7mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 2500 | ARM | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S150-FCG1152 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S150 | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S010-VFG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | 256-LFBGA | 256 | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | 138 | Not Qualified | 1.2V | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S010-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 195 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 195 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 195 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 484-BGA | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 94 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | Active | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F200 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 7mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | 100MHz | 30 | A2F500M3G | 66 | Not Qualified | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 500000 | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 1.7mm | 17mm | 17mm | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484I | Microsemi Corporation | Datasheet | 244 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 484-BGA | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | Active | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F500M3G | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 5500 | ARM | 500000 | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S050T-1FGG896 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 16 Weeks | 484-BGA | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | 0°C~85°C TJ | Tray | 2000 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F500M3G | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 5500 | ARM | 500000 | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | No | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 16 Weeks | 484-BGA | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F500M3G | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 2mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 500000 | 100MHz | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | Non-RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | 256-LBGA | YES | FLASH | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 340MHz | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.2V | 3.45V | 1.14V | 256kB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 3.316 ns | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | 12084 | FPGA - 10K Logic Modules | 85°C | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG256I | Microsemi Corporation | Datasheet | 960 | - | Min: 1 Mult: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 161 | -40°C~100°C TJ | Tray | 2013 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | Matte Tin (Sn) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 161 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F500M3G | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 5500 | ARM | 500000 | 120MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 484-BGA | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 94 | 0°C~85°C TJ | Tray | 2013 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F200 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 7mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 120MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Copper, Silver, Tin | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | 2013 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F200 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 3mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 120MHz | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 256KB | No | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S060T-FCSG325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | 325-CSPBGA (11x11) | 200 | -40°C~100°C TJ | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-FGG484 | Microsemi Corporation | Datasheet | 264 | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 50kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 12084 | ARM | 1007 | FPGA - 10K Logic Modules | 256KB | 23mm | 23mm | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S005-TQG144I | Microsemi Corporation | Datasheet | 1502 | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 144 | 84 | -40°C~100°C TJ | Tray | 2000 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 144 | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | 84 | Not Qualified | 1.2V | 1.26V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 209 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | Lead Free |
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XCZU4EG-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
1,893.112457
-
A2F200M3F-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCG1152
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1FGG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FGG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FCSG325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-TQG144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire