The category is 'Embedded - System On Chip (SoC)'
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- Operating Temperature:
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Shape | Number of Terminals | Jacket (Insulation) Material | Contact Material - Mating | Contact Material - Post | Board Material | Approvals | Base Product Number | Cable Types | Class | Contact Finish Mating | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rating AC | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Type | Terminal Finish | Applications | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Pitch - Mating | JESD-30 Code | Number of Outputs | Qualification Status | Contact Finish - Post | Power Supplies | Temperature Grade | Plating | Attachment Method | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Response Time | Architecture | Number of Inputs | Fuse Type | Seated Height-Max | Programmable Logic Type | Breaking Capacity @ Rated Voltage | 1st Connector | 2nd Connector | Insertion Loss | Termination Post Length | Pitch - Post | Cable Diameter | Convert From (Adapter End) | Convert To (Adapter End) | Primary Attributes | Fiber Type | Number of Logic Cells | Number of Cores | Color - Connectors | Return Loss | Color - Cable | Bend Radius | Flash Size | Features | Height | Length | Width | Plating Thickness | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Length - Overall | Material Flammability Rating | Ratings |
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 | Mfr Part No M2S050-1VFG400 | Microchip | Datasheet | 2061 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | -- | M2S050 | Twin Zip | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S050-1VFG400 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 207 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | -- | Multimode, Duplex | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | LC Duplex | ST (2) | 0.20dB | 0.08 (2.0mm) | FPGA - 50K Logic Modules | 62.5/125 | 56340 | 1 Core | Beige | -- | Orange | -- | 256KB | Riser, Zipcord | 17 mm | 17 mm | 131.2 (40.0m) | OFNR | ||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3382DKFEBG | AVAGO | Datasheet | - | - | Min: 1 Mult: 1 | Holder | Rectangular, Blade | CSA, UR | -- | -- | Compliant | 1.3kV | -- | Bulk | -- | 2.913 L x 2.402 W x 3.032 H (74.00mm x 61.00mm x 77.00mm) | Active | -- | Electrical, Industrial | 350A | -- | Square | 100kA | Indicating | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-FCSG325I | Microchip | Datasheet | 2396 |
| Min: 1 Mult: 1 | Through Hole | 325-TFBGA, FCBGA | YES | 20 | 325-FCBGA (11x13.5) | -- | 325 | -- | Brass | FR4 Epoxy Glass | M2S090 | -- | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S090-FCSG325I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 180 | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.74 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | Correct-A-Chip® 352000 | e1 | Active | -- | Solder | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 1A | 0.050 (1.27mm) | R-PBGA-B325 | 180 | Not Qualified | Tin-Lead | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.125 (3.18mm) | 0.100 (2.54mm) | PLCC | DIP, 0.3 (7.62mm) Row Spacing | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | -- | 13.5 mm | 11 mm | -- | -- | -- | |||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FCSG325I | Microchip | Datasheet | 2267 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | Rectangle | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-FCSG325I | 166 MHz | Microchip Technology | 3 | 200 | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | Fabric Over Foam | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | -- | Adhesive | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 0.079 (2.00mm) | 18.000 (457.20mm) | 0.161 (4.10mm) | -- |
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M2S050-1VFG400
Microchip
Package:Embedded - System On Chip (SoC)
215.417972
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BCM3382DKFEBG
AVAGO
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
365.103440
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M2S060TS-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire