The category is 'Embedded - System On Chip (SoC)'
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- Architecture
- Connectivity
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- Peripherals
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- Number of I/Os
- RAM Size
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- Flash Size
- Package / Case
- Operating Temperature:
-40°C ~ 100°C (TJ)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Transceivers | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
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 | Mfr Part No XCVM1402-2HSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | + 110 C | AMD Xilinx | - 40 C | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 880 mV | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-L2SBG485I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | XC7Z030 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-1LLIVSVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU11EG-1FFVF1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1517 | 1517-FCBGA (40x40) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 9.1 Mbit | 21.1 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 500 MHz, 600 MHz, 1.2 GHz | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 464 I/O | 37320 LAB | 653100 LE | Active | Details | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | -40°C ~ 100°C (TJ) | XAZU11EG | 0.85 V | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 32 Transceiver | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2MLIVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | - 40 C | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Versal™ Prime | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2HSIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | - 40 C | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Versal™ AI Core | 880 mV | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | - 40 C | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-1SBVA484I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-484 | 484-FCBGA (19x19) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 4680 LAB | 81900 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-L1SFVC784I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-784 | 784-FCBGA (23x23) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 180 I/O | 4680 LAB | 81900 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | 4 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2SBVA484I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-484 | 484-FCBGA (19x19) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 4680 LAB | 81900 LE | Active | -40°C ~ 100°C (TJ) | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-L1UBVA530I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1UBVA530I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | Tray | Active | -40°C ~ 100°C (TJ) | - | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | 1156-FCBGA (35x35) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 6.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 396 I/O | 27960 LAB | 489300 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 8 Transceiver | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | 6 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | - 40 C | 692 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-FCSG158I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TFBGA-158 | 158-FCBGA | ARM Cortex M3 | 64 kB | 260 | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | - | 27696 LE | Tray | Active | Details | -40°C ~ 100°C (TJ) | Tray | - | 1.14 V to 1.26 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1FCSG158I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TFBGA-158 | 158-FCBGA | ARM Cortex M3 | 64 kB | 260 | - | - | 166 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | - | 27696 LE | Tray | Active | Details | -40°C ~ 100°C (TJ) | Tray | - | 1.14 V to 1.26 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2SFVA625I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-625 | 625-FCBGA (21x21) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 72 I/O | 4680 LAB | 81900 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-2FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | 1156-FCBGA (35x35) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 6.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 396 I/O | 27960 LAB | 489300 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 850 mV | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 8 Transceiver | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | 6 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-VFG400I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S050 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S050-VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 207 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm |
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XCVM1402-2HSIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z030-L2SBG485I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFC023R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1702-1LLIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU11EG-1FFVF1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-2MLIVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-2HSIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-2MLIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-1SBVA484I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1CG-L1SFVC784I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-2SBVA484I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-L1UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-1UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU42DR-1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-2MLIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-FCSG158I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-1FCSG158I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-2SFVA625I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU42DR-2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire