Embedded - System On Chip (SoC) (60)

-

-

Min: 1

Mult: 1

Surface Mount

TO-263-6, D²Pak (5 Leads + Tab), TO-263BA

YES

DDPAK/TO-263-5

1517

Intel / Altera

-

21

INTEL CORP

2 x 32 kB

2 x 32 kB

Intel

10AS066N2F40E1HG

1.2 GHz

+ 100 C

National Semiconductor

0 C

Yes

SMD/SMT

588

82500 LAB

660000 LE

100 °C

Bulk

PLASTIC/EPOXY

BGA

BGA,

SQUARE

GRID ARRAY

967624

Active

Active

NOT SPECIFIED

5.66

Details

Yes

This product may require additional documentation to export from the United States.

0.93 V

0.87 V

0.9 V

Arria 10 SoC

-40°C ~ 125°C (TJ)

Tray

-

Active

IT ALSO OPERATES AT 0.95V NOMINAL VCC

SOC - Systems on a Chip

BOTTOM

BALL

NOT SPECIFIED

1 mm

compliant

S-PBGA-B1517

15 mA

7V

Fixed

950 mV

OTHER

1.5GHz

Positive

256KB

800mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

2.5V

1

MCU, FPGA

Over Current, Over Temperature, Short Circuit

10 mA

0.35V @ 800mA

3.5 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

-

FPGA - 660K Logic Elements

2 Core

--

SoC FPGA

40 mm

40 mm

-

-

Min: 1

Mult: 1

484-FBGA

YES

484

484-UBGA (19x19)

484

INTEL CORP

Intel Corporation

5CSEBA5U19A7N

MCU - 151, FPGA - 66

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA484,22X22,32

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Active

NOT SPECIFIED

2.03

Compliant

Yes

1.13 V

1.07 V

1.1 V

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

Active

125 °C

-40 °C

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.8 mm

compliant

5CSEBA5

S-PBGA-B484

66

Not Qualified

1.13 V

1.1,1.2/3.3,2.5 V

AUTOMOTIVE

556.3 kB

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

FIELD PROGRAMMABLE GATE ARRAY

85000

800 MHz

32075

7

FPGA - 85K Logic Elements

85000

--

19 mm

19 mm

-

-

Min: 1

Mult: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

XAZU4

AMD

252

Tray

Active

-40°C ~ 125°C (TJ)

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

-

-

Min: 1

Mult: 1

672-FBGA

YES

672-UBGA (23x23)

672

INTEL CORP

Intel Corporation

5CSEMA6U23A7N

MCU - 181, FPGA - 145

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA672,28X28,32

BGA672,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

Active

NOT SPECIFIED

5.55

Yes

1.13 V

1.07 V

1.1 V

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

Active

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.8 mm

compliant

5CSEMA6

S-PBGA-B672

145

Not Qualified

1.1,1.2/3.3,2.5 V

AUTOMOTIVE

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 110K Logic Elements

110000

--

23 mm

23 mm

-

-

Min: 1

Mult: 1

672-FBGA

YES

672-UBGA (23x23)

672

INTEL CORP

Intel Corporation

5CSXFC4C6U23A7N

MCU - 181, FPGA - 145

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA672,28X28,32

BGA672,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

Active

NOT SPECIFIED

5.58

Yes

1.13 V

1.07 V

1.1 V

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

Active

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.8 mm

compliant

S-PBGA-B672

145

Not Qualified

1.1,1.2/3.3,2.5 V

AUTOMOTIVE

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 40K Logic Elements

40000

--

23 mm

23 mm

-

-

Min: 1

Mult: 1

536-LFBGA

536-BGA (16x16)

Microchip Technology

MCU - 136, FPGA - 168

Tray

Active

-40°C ~ 125°C (TJ)

-

-

2.2MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128KB

-

-

Min: 1

Mult: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD Xilinx

180

Tray

Active

-40°C ~ 125°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 82K Logic Cells

-

-

-

Min: 1

Mult: 1

827-BFBGA, FCBGA

827-FCBGA (24x24)

Texas Instruments

226

Bulk

Active

-40°C ~ 125°C (TJ)

-

2GHz, 1GHz, 1.35GHz, 1GHz

1.5MB

ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

DMA, PWM, WDT

I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB

DSP, MCU, MPU

-

-

-

-

Min: 1

Mult: 1

484-BBGA, FCBGA

484-FCBGA (23x23)

XA7Z030

AMD

130

Tray

Active

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100, Zynq®-7000 XA

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

-

-

Min: 1

Mult: 1

484-FBGA

484-UBGA (19x19)

MCU - 151, FPGA - 66

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

Active

5CSEBA6

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 110K Logic Elements

--

-

-

Min: 1

Mult: 1

672-FBGA

672-UBGA (23x23)

MCU - 181, FPGA - 145

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

Active

5CSXFC6

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 110K Logic Elements

--

-

-

Min: 1

Mult: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

XAZU2

AMD

128

Tray

Active

-40°C ~ 125°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

-

-

Min: 1

Mult: 1

325-TFBGA

325-BGA (11x11)

Microchip Technology

MCU - 102, FPGA - 80

Tray

Active

-40°C ~ 125°C (TJ)

-

-

857.6KB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

128KB

-

-

Min: 1

Mult: 1

770-BFBGA, FCBGA

770-FCBGA (23x23)

32 kB

48 kB

12.5 MHz

+ 125 C

Texas Instruments

- 40 C

SMD/SMT

155

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Active

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100

1.71 V to 1.89 V

2GHz, 1GHz, 1GHz

2MB

ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

DMA, PWM, WDT

MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB

DSP, MCU, MPU

64 bit

-

3 Core

-

-

-

Min: 1

Mult: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

XAZU5

AMD

252

Tray

Active

-40°C ~ 125°C (TJ)

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

-

-

Min: 1

Mult: 1

Surface Mount

16-WQFN Exposed Pad

16-TQFN (5x5)

MAX5097

Analog Devices Inc./Maxim Integrated

366

Tape & Reel (TR)

Active

-40°C ~ 125°C (TJ)

-

Step-Down

1

40V

Adjustable (Fixed)

5V

533MHz, 1.333GHz

Positive

256KB

600mA

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.24V (3.3V)

Buck

MCU, FPGA

330kHz

No

11V

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

-

Min: 1

Mult: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

220

Tray

Active

-40°C ~ 125°C (TJ)

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

-

-

Min: 1

Mult: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

Microchip Technology

MCU - 136, FPGA - 312

Tray

Active

-40°C ~ 125°C (TJ)

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

128KB

-

-

Min: 1

Mult: 1

FCBGA-1517

1517-FCBGA (40x40)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

-

9.1 Mbit

21.1 Mbit

1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

500 MHz, 600 MHz, 1.2 GHz

+ 125 C

AMD Xilinx

- 40 C

SMD/SMT

464 I/O

37320 LAB

653100 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

Zynq UltraScale+

-40°C ~ 125°C (TJ)

XAZU11EG

0.85 V

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

32 Transceiver

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

7 Core

-

-

-

Min: 1

Mult: 1

624-LFBGA

624-MAPBGA (21x21)

Yes

MCIMX6

32

5A992c.

10Mbps/100Mbps/1000Mbps

Compliant

i.MX 6Solo

8542.31.00.01

4

3

CAN/Ethernet/I2C/I2S/SPI/UART/USB

Ball

800

125

Freescale Semiconductor

-40

Surface Mount

Bulk

1.16

21

21

624

Yes

Microprocessor

Active

Yes

BGA

MAP-BGA

5

0

2

-40°C ~ 125°C (TJ)

Tray

i.MX6S

NRND

Applications Processor

624

800MHz

128KB

ARM® Cortex®-A9

ROM

96KB

ARM

1.8V, 2.5V, 2.8V, 3.3V

1

1 Core, 32-Bit

Yes

LPDDR2, LVDDR3, DDR3

4

CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

-

4

2

4

ARM Cortex A9