The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
- RAM Size
- RoHS Status
- Operating Temperature:
-40°C~125°C TJ
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Core Architecture | Primary Attributes | Number of Logic Cells | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XA7Z020-1CLG484Q | Xilinx Inc. | Datasheet | 316 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | 484 | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2009 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 3 (168 Hours) | 484 | 3A991.D | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 85K Logic Cells | N | 1.6mm | 19mm | ROHS3 Compliant | |||||||||||||
 | Mfr Part No XA7Z020-1CLG400Q | Xilinx Inc. | Datasheet | 1627 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | 400 | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 85K Logic Cells | N | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||
 | Mfr Part No 5CSEBA2U23A7N | Intel | Datasheet | 2361 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||
| Mfr Part No XA7Z010-1CLG400Q | Xilinx Inc. | Datasheet | 648 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | 400 | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 28K Logic Cells | N | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||
| Mfr Part No 5CSXFC6C6U23A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||
 | Mfr Part No 5CSEBA5U19A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.9mm | 19mm | 19mm | RoHS Compliant | |||||||||||||||
| Mfr Part No 5CSEBA6U19A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 484 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.9mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||
 | Mfr Part No XAZU3EG-1SFVC784Q | Xilinx Inc. | Datasheet | 1600 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B784 | 500MHz, 1.2GHz | 1.8MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | Mfr Part No XA7Z010-1CLG225Q | Xilinx Inc. | Datasheet | 1280 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 225-LFBGA, CSPBGA | 225 | 86 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 3 (168 Hours) | 225 | EAR99 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 28K Logic Cells | N | 1.5mm | 13mm | ROHS3 Compliant | |||||||||||||
 | Mfr Part No 5CSEBA4U19A7N | Intel | Datasheet | 2216 |
| Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 484 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.9mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||
| Mfr Part No XAZU2EG-1SFVC784Q | Xilinx Inc. | Datasheet | 702 |
| Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B784 | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23A7N | Intel | Datasheet | 960 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||
 | Mfr Part No 5CSEMA5F31A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | e1 | Active | 3 (168 Hours) | 896 | TIN SILVER COPPER | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | RoHS Compliant | ||||||||||||||
 | Mfr Part No XAZU3EG-1SFVA625Q | Xilinx Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B625 | 500MHz, 1.2GHz | 1.8MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 3.43mm | 21mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | Mfr Part No XA7Z030-1FBV484Q | Xilinx Inc. | Datasheet | 2366 |
| Min: 1 Mult: 1 | 10 Weeks | 484-BBGA, FCBGA | YES | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | Active | 4 (72 Hours) | 484 | EAR99 | 8542.39.00.01 | BOTTOM | BALL | S-PBGA-B484 | 667MHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U19A7N | Intel | Datasheet | 5 |
| Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~125°C TJ | Tray | 2017 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 484 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.9mm | 19mm | 19mm | RoHS Compliant | |||||||||||||||||
| Mfr Part No 5CSEMA6F31A7N | Intel | Datasheet | 2160 | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | e1 | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||||||||
| Mfr Part No 5CSEMA4U23A7N | Intel | Datasheet | 2060 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||
| Mfr Part No 5CSEBA6U23A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||
| Mfr Part No 5CSXFC2C6U23A7N | Intel | Datasheet | 1942 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant |
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XA7Z020-1CLG484Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
203.587794
-
XA7Z020-1CLG400Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XA7Z010-1CLG400Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
83.562307
-
5CSXFC6C6U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA5U19A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA6U19A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU3EG-1SFVC784Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XA7Z010-1CLG225Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
87.016916
-
5CSEBA4U19A7N
Intel
Package:Embedded - System On Chip (SoC)
123.856256
-
XAZU2EG-1SFVC784Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
645.430736
-
5CSEBA5U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA5F31A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU3EG-1SFVA625Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XA7Z030-1FBV484Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
406.948585
-
5CSEBA2U19A7N
Intel
Package:Embedded - System On Chip (SoC)
98.054135
-
5CSEMA6F31A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA4U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA6U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC2C6U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire