The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
- RAM Size
- RoHS Status
- Operating Temperature:
-40°C~125°C TJ
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No 5CSEMA6U23A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEMA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||
 | Mfr Part No XAZU2EG-1SFVA625Q | Xilinx Inc. | Datasheet | 56800 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B625 | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 3.43mm | 21mm | 21mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No 5CSXFC4C6U23A7N | Intel | Datasheet | 1842 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||
| Mfr Part No 5CSXFC5C6U23A7N | Intel | Datasheet | 1737 |
| Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||
| Mfr Part No 5CSEMA2U23A7N | Intel | Datasheet | 2074 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||
| Mfr Part No 5CSEMA5U23A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||
| Mfr Part No 5CSEBA4U23A7N | Intel | Datasheet | 16 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2017 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||
 | Mfr Part No 5CSXFC6D6F31A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 896 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | RoHS Compliant | ||||||
 | Mfr Part No XAZU3EG-1SBVA484Q | Xilinx Inc. | Datasheet | 744 | - | Min: 1 Mult: 1 | 6 Weeks | 484-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 484 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 500MHz, 1.2GHz | 1.8MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 2.61mm | 19mm | 19mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No XAZU2EG-1SBVA484Q | Xilinx Inc. | Datasheet | 1 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 484 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 2.61mm | 19mm | 19mm | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No M2S005S-1VFG256T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | 161 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | 138 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||
 | Mfr Part No M2S010TS-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 233 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S005S-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 209 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | 138 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||
 | Mfr Part No M2S025TS-1VFG400T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 207 | -40°C~125°C TJ | Tray | 2016 | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 267 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S060TS-1VFG400T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 207 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 267 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||
 | Mfr Part No M2S090TS-1FGG676T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 676-BGA | 425 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 512KB | RoHS Compliant |
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5CSEMA6U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU2EG-1SFVA625Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC4C6U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC5C6U23A7N
Intel
Package:Embedded - System On Chip (SoC)
255.988934
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5CSEMA2U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA5U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA4U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC6D6F31A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU3EG-1SBVA484Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU2EG-1SBVA484Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-1VFG256T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1VFG256T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1VFG256T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1VFG400T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1VFG400T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-1FGG676T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire