The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
- RAM Size
- RoHS Status
- Operating Temperature:
-40°C~125°C TJ
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Organization | Programmable Logic Type | Primary Attributes | Number of CLBs | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S005S-1VFG400T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 171 | Automotive grade | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | 400 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 505 CLBS | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 505 | 128KB | 1.51mm | 17mm | 17mm | RoHS Compliant | ||||||||||||
| Mfr Part No M2S010TS-1VFG400T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 195 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||
 | Mfr Part No M2S090TS-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 267 | -40°C~125°C TJ | Tray | 2016 | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 512KB | RoHS Compliant | ||||||||||||||||||||||||||
 | Mfr Part No M2S060TS-1FGG676T2 | Microsemi Corporation | Datasheet | 5 | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 676-BGA | 676-FBGA (27x27) | 387 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No XA7Z030-1FBG484Q | Xilinx Inc. | Datasheet | 776 | - | Min: 1 Mult: 1 | 484-BBGA, FCBGA | YES | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Obsolete | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1mm | not_compliant | 30 | S-PBGA-B484 | Not Qualified | 11.8V | 667MHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | N | 2.54mm | 23mm | 23mm | RoHS Compliant |
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M2S005S-1VFG400T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1VFG400T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FGG676T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XA7Z030-1FBG484Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire