The category is 'Embedded - System On Chip (SoC)'
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- Operating Temperature:
-40 to 85 °C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | CoilResistance | Contact Materials | Core | Data RAM Size | Data RAM Type | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | Frequency Aging | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Data Rate | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Maximum Power Rating | Mfr | Minimum Dropout Voltage | Minimum Operating Supply Voltage | Minimum Operating Temperature | Mode of Oscillation | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Words | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Power Class | Product Status | Reflow Temperature-Max (s) | Relay Construction | Risk Rank | RoHS | Rohs Code | Standard Frequency | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Switching Regulator | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Output Voltage | Operating Supply Voltage | Power Supplies | Number of Channels | Memory Size | Load Capacitance | Number of Ports | Speed | RAM Size | Output Current | Core Processor | Frequency Tolerance | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Utilized IC / Part | Programmable Logic Type | Address Bus Width | Product Type | Density | Protocol | Operate Time | Series Resistance | Frequency Range | Screening Level | Power - Output | Speed Grade | RF Family/Standard | Antenna Type | Sensitivity | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Number of Registers | Current - Transmitting | Number of Logic Cells | Modulation | Output Level | Contact Arrangement | Flash Size | Input Voltage | Product Category | Product Length | ADC Resolution | Height | Length | Width |
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![]() | Mfr Part No XQVP1202-2MSIVSQA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | Fundamental | Surface Mount | 25 MHz | SMD | -40 to 85 °C | Crystal | SOC - Systems on a Chip | 2 | 800 mV | System-On-Modules - SOM | 40 Ohm | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM2502-2MSIVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | 3.6 V | + 110 C | 3 V | - 40 C | Surface Mount | 16 Bit | 256 kWords | TSOP-II | Asynchronous | 3.3000 V | Industrial grade | -40 to 85 °C | SOC - Systems on a Chip | 44 | 800 mV | 1 | 18 Bit | System-On-Modules - SOM | 4 Mbit | Industrial | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVH1782-2MLELSVA4737 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | Fundamental | Surface Mount | 24.576 MHz | SMD | -40 to 85 °C | Crystal | SOC - Systems on a Chip | 4 | 800 mV | System-On-Modules - SOM | 40 Ohm | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-2HSINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | Surface Mount | 424 | Tray | Active | SMT | Yes | -40 to 85 °C | Versal™ Prime | SOC - Systems on a Chip | 13 | 1 | 1.2 to 5.5 V | 880 mV | 600MHz, 1.4GHz | 256KB | 26 A | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 143 W | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | 12 V | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2MSEVSVA2197 | AMD | Datasheet | 592 | - | Min: 1 Mult: 1 | 178 Ohm | Palladium Ruthenium/Gold | 60/62.5 W/VA | AMD | 0.5 Vdc | Surface Mount | Tray | Active | Non-Latching | -40 to 85 °C | * | Signal Relay | 1 ms | SPST-NO | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQVP1202-1MSMVSRC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 125 C | - 55 C | -40 to 85 °C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE2202-1LSESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | Through Hole | Eighth-Brick | Yes | -40 to 85 °C | SOC - Systems on a Chip | 8 | 1 | 28 V | 700 mV | 9 A | 250 W | System-On-Modules - SOM | 36 to 75 V | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE2002-1LSISBVA625 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | ±3 ppm/Year | Xilinx | + 110 C | - 40 C | Fundamental | Surface Mount | 26 MHz | -40 to 85 °C | Crystal | SOC - Systems on a Chip | 30 ppm | 4 | 700 mV | 18 pF | ±15 ppm | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EM05EFA-512-SGAS | Quectel | Datasheet | 800 | - | Min: 1 Mult: 1 | Card Edge | Module | EM05 | 100 | USB 2.0 | Quectel | Socket Mount | Tray | Active | Details | Wireless communication module | 0.222931 oz | -40 to 85 °C | Reel | - | IoT/M2M-Optimized LTE Cat 4 M.2 Module | 3.135V ~ 4.4V | - | 3.6, 3 V | - | 150 Mbps | - | BeiDou, Galileo, GLONASS, GPS, GNSS, HSPA+, LTE, WCDMA | 700, 800, 900, 1800, 2100, 2600 MHz | Extended | - | Cellular, Navigation | Antenna Not Included | -109.5 dBm | USB | 20mA | 20mA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS2083BM-232 | Microchip Technology | Datasheet | 544 | - | Min: 1 Mult: 1 | Surface Mount | BGA-82 | IS2083 | 8051 | 96 kB | SRAM | 3000 | I2C, UART, USB | 2 Mbps | + 85 C | Microchip Technology | - 40 C | Surface Mount | SMD/SMT | 19 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Class I/Class II | Active | VFBGA | 4.2 V | 3.2 V | Industrial grade | -40 to 85 °C | Reel | - | Bluetooth | 3.2V ~ 4.2V | 2.4GHz | 82 | 3.3 V | 2 | 16MB Flash, 512kB RAM, 832kB ROM | Flash | 2 MB | 9.5 dBm | 3Mbps | 8 bit | IS2083BM | Bluetooth v5.0 | Industrial | - | Bluetooth | Antenna Not Included | - 90 dBm | 2 Channel | GPIO, I²C, I²S, PWM, UART, USB | - | - | 8DPSK, DQPSK, GFSK | 10 bit, 16 bit | 0.9 mm | 5.5 mm | 5.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EM05CEFA-512-SGA | Quectel | Datasheet | - | - | Min: 1 Mult: 1 | 250 | USB | Yes | Socket Mount | Details | Wireless communication module | 0.222931 oz | Industrial grade | -40 to 85 °C | Tray | LTE Cat 4 M.2 Module | 2.5 V | 150 Mbps | Industrial | -102.7/-110/-109 dBm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE2102-1MSESBVA484 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | Fundamental | Surface Mount | 24 MHz | SMD | -40 to 85 °C | Crystal | SOC - Systems on a Chip | 2 | 800 mV | System-On-Modules - SOM | 40 Ohm | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM2202-2LLEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | ±3 ppm/Year | Xilinx | + 110 C | 0 C | Fundamental | Surface Mount | 32 MHz | -40 to 85 °C | Crystal | SOC - Systems on a Chip | 20 ppm | 4 | 700 mV | ±10 ppm | System-On-Modules - SOM | 200 Ohm | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVH1522-2MLEVSVA3697 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | -40 to 85 °C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQZU67DR-1FSQE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | Surface Mount | 100 MHz | SMD | -40 to 85 °C | SOC - Systems on a Chip | 50 ppm | 4 | HCMOS/TTL | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-TQ144I | Microchip | Datasheet | 2151 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S010-TQ144I | Microchip Technology | 3 | Surface Mount | 84 | 38.4 MHz | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | No | SMD | 1.26 V | 1.14 V | 1.2 V | -40 to 85 °C | SmartFusion®2 | e0 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | 4 | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 10 pF | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | Clipped Sinewave | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z035-1FFG900C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z035 | 275,000 | 130 | 1.05 V | AMD | 0.95 V | Surface Mount | 8 Bit | 130 | 32 kWords | Tray | Active | SOIC N | Asynchronous | 5.0000 V | Industrial grade | -40 to 85 °C | Zynq®-7000 | 28 | 1 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 15 Bit | 256 Kb | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM2902-3HSEVFVF1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | -40 to 85 °C | SOC - Systems on a Chip | 880 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1702-2LSEVSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | 6.5 V | + 110 C | 4.5 V | 0 C | SOIC | 5 V | -40 to 85 °C | SOC - Systems on a Chip | 8 | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQVC1902-1MSIVSQD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | ±3 ppm/Year | Xilinx | + 110 C | - 40 C | Fundamental | Surface Mount | 37.4 MHz | -40 to 85 °C | Crystal | SOC - Systems on a Chip | 20 ppm | 4 | 800 mV | 8 pF | ±15 ppm | System-On-Modules - SOM | 200 Ohm | SoC FPGA |
XQVP1202-2MSIVSQA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM2502-2MSIVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVH1782-2MLELSVA4737
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-2HSINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2MSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQVP1202-1MSMVSRC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE2202-1LSESFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE2002-1LSISBVA625
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
EM05EFA-512-SGAS
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
IS2083BM-232
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
EM05CEFA-512-SGA
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE2102-1MSESBVA484
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM2202-2LLEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVH1522-2MLEVSVA3697
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQZU67DR-1FSQE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z035-1FFG900C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM2902-3HSEVFVF1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1702-2LSEVSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQVC1902-1MSIVSQD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
