The category is 'Embedded - System On Chip (SoC)'
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- Operating Temperature:
-65°C ~ 175°C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Contact Sizes | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Power (Watts) | HTS Code | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Note | Speed | RAM Size | Shell Size, MIL | Core Processor | Peripherals | Program Memory Size | Connectivity | Cable Opening | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
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![]() | Mfr Part No AGFA008R16A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | - | Aluminum | - | - | - | MS27467E25B | Gold | Copper Alloy | Amphenol Aerospace Operations | 384 | Bulk | Metal | Active | - | -65°C ~ 175°C | Military, MIL-DTL-38999 Series I, LJT | Crimp | Plug, Male Pins | 19 | Olive Drab | Aviation, Military | Bayonet Lock | - | A | Shielded | Environment Resistant | Olive Drab Cadmium over Nickel | 25-19 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 764K Logic Elements | - | Coupling Nut | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060-1FCS325 | Microchip | Datasheet | 1968 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 325-TFBGA, FCBGA | - | Circular | Aluminum | 325-FCBGA (11x11) | - | D38999/26ZA | 22D | 64 kB | - | - | 166 MHz | Amphenol Aerospace Operations | 200 | 56520 LE | Bulk | Active | Non-Compliant | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | For Female Sockets | 6 | Threaded | Crimp | A | Shielded | Environment Resistant | Zinc Nickel | 9-35 | Black | Contacts Not Included | 166MHz | 64KB | A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | FPGA - 60K Logic Modules | 1 Core | 256KB | Coupling Nut, Self Locking | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2CG-2SFVC784I | AMD | Datasheet | 2324 |
| Min: 1 Mult: 1 | Panel Mount | 784-BFBGA, FCBGA | Flange | Circular | Aluminum | 784-FCBGA (23x23) | - | TVP00RW | 20 | Amphenol Aerospace Operations | 252 | Bulk | Active | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Receptacle Housing | For Male Pins | 41 | Threaded | Crimp | A | Shielded | Environment Resistant | Cadmium | 21-41 | Olive Drab | Contacts Not Included | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E3F27I2SG | ALTERA | Datasheet | 800 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 672 | ERC55 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E3F27I2SG | 1.2 GHz | Vishay Dale | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 965290 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | ERC | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±1% | Active | 2 | ±50ppm/°C | 127 kOhms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Moisture Resistant | SoC FPGA | - | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPF050-1VG400M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | -- | Circular | Aluminum Alloy | Plastic | 22D | -- | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series I, DJT | Active | -- | Plug Housing | For Female Sockets | 128 | Bayonet Lock | Crimp | N (Normal) | Shielded | Environment Resistant | Chromate over Cadmium | 25-35 | Olive Drab | Contacts Not Included | -- | -- | Coupling Nut | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA006R16A2E4X | Intel | Datasheet | 681 | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | - | Flange | Aluminum | - | Gold | Copper Alloy | Glenair | 384 | Retail Package | Metal | Active | -65°C ~ 175°C | 806 | Solder | Receptacle, Female Sockets | Olive Drab | Threaded | B | Olive Drab Cadmium | 24-20A | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150TS-1FC1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC55 | MICROSEMI CORP | Microsemi Corporation | M2S150TS-1FC1152M | Vishay Dale | 574 | 125 °C | -55 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -65°C ~ 175°C | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | e0 | 2 | 3A001.A.2.C | ±25ppm/°C | 3.65 kOhms | Tin/Lead (Sn/Pb) | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | S (0.001%) | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | Military, Moisture Resistant, Weldable | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPF050-1FG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | Circular | Aluminum | - | D38999/26WF | 20 | Amphenol Aerospace Operations | Bulk | Active | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | For Female Sockets | 32 | Threaded | Crimp | A | Shielded | Environment Resistant | Cadmium | 19-32 | Olive Drab | Contacts Not Included | F | - | Coupling Nut, Self Locking | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E4F29I3LG | ALTERA | Datasheet | 422 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | FBGA-780 | YES | Flange | Stainless Steel | 780 | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E4F29I3LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 360 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964847 | Active | Metal | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | F | BALL | NOT SPECIFIED | 1 mm | compliant | Passivated | 26-20A | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E2F27E2SG | ALTERA | Datasheet | 409 |
| Min: 1 Mult: 1 | Panel Mount | FBGA-672 | YES | Flange | Aluminum Alloy | 672 | KJB0T | Intel / Altera | Gold | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E2F27E2SG | 1.2 GHz | ITT Cannon, LLC | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964965 | Active | Metal | Active | NOT SPECIFIED | 5.43 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | - | -65°C ~ 175°C | Tray | KJB | Active | Crimp | Receptacle, Female Sockets | 22 | Olive Drab | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | - | CMOS | BOTTOM | C | BALL | - | NOT SPECIFIED | Environment Resistant | 1 mm | compliant | Olive Drab Cadmium | 13-35 | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | - | SoC FPGA | 27 mm | 27 mm | 50.0µin (1.27µm) | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022C3U19I2LG | ALTERA | Datasheet | 677 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | UBGA-484 | YES | Flange | Aluminum | 484 | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022C3U19I2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 192 | 27500 LAB | 220000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964732 | Active | Metal | Active | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Tray | 806 | Active | Solder | Receptacle, Female Sockets | Olive Drab | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | A | BALL | NOT SPECIFIED | 0.8 mm | compliant | Olive Drab Cadmium | S-PBGA-B484 | 192 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | SoC FPGA | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H2F34I2LG | ALTERA | Datasheet | 595 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | Stainless Steel | 1152-FCBGA (35x35) | 1152 | Intel / Altera | Gold | Copper Alloy | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H2F34I2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965021 | Active | Metal | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | E | BALL | NOT SPECIFIED | 1 mm | compliant | Passivated | 18-1 | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016C4U19I3SG | ALTERA | Datasheet | 715 |
| Min: 1 Mult: 1 | Axial | YES | 484 | Axial | 484 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C4U19I3SG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964681 | Active | NOT SPECIFIED | 1.96 | Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±50ppm/°C | 22.6 kOhms | 100 °C | -40 °C | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 192 | Not Qualified | 1.8 V | P (0.1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 3 | 6 Transceiver | FPGA - 160K Logic Elements | 246040 | 160000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-FG484I | Microchip | Datasheet | 1664 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount, Through Hole | 484-BGA | Flange | Aluminum | 484-FPBGA (23x23) | - | - | TVP00DT | Gold | Copper Alloy | Amphenol Aerospace Operations | 267 | Bulk | Metal | Active | Non-Compliant | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ HD | Solder | Receptacle, Male Pins | 55 | - | Military | Threaded | - | A | Shielded | Environment Resistant | Durmalon™ | 15-55 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | FPGA - 25K Logic Modules | 256KB | Alignment Disc | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016C3U19E2SG | ALTERA | Datasheet | 749 |
| Min: 1 Mult: 1 | Axial | Axial | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 964674 | Non-Compliant | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Tape & Reel (TR) | Military, MIL-PRF-55182/07, RNC50 | 0.070 Dia x 0.150 L (1.78mm x 3.81mm) | ±1% | Active | 2 | ±25ppm/°C | 6.81 kOhms | Metal Film | 0.1W, 1/10W | SOC - Systems on a Chip | S (0.001%) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 160K Logic Elements | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU43DR-2FSVG1517E | AMD | Datasheet | 417 |
| Min: 1 Mult: 1 | Panel Mount | 1517-BBGA, FCBGA | Flange | Circular | Aluminum | 1517-FCBGA (40x40) | - | TVP00RW | 22D | Amphenol Aerospace Operations | 561 | Bulk | Active | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Receptacle Housing | For Female Sockets | 66 | Threaded | Crimp | C | Shielded | Environment Resistant | Cadmium | 19-35 | Olive Drab | Contacts Not Included | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K2F35E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | Aluminum | 1152-FBGA (35x35) | 1152 | Gold | Copper Alloy | INTEL CORP | Intel Corporation | 10AS066K2F35E1SG | Glenair | 396 | 100 °C | Retail Package | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | Metal | Active | NOT SPECIFIED | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | -65°C ~ 175°C | Tray | 806 | Discontinued at Digi-Key | Solder | Receptacle, Female Sockets | Silver | 8542.39.00.01 | Threaded | Field Programmable Gate Arrays | CMOS | BOTTOM | D | BALL | NOT SPECIFIED | 1 mm | compliant | Electroless Nickel | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K2F35E1HG | ALTERA | Datasheet | 646 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | Flange | Stainless Steel | 1152-FBGA (35x35) | Intel / Altera | Gold | Copper Alloy | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K2F35E1HG | 1.2 GHz | + 100 C | Glenair | 0 C | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | Retail Package | 967066 | Active | Metal | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Plug, Male Pins | Silver | Threaded | SOC - Systems on a Chip | A | unknown | Passivated | 25-5 | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | Ground | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057H3F34I2LG | ALTERA | Datasheet | 441 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | Aluminum | 1152-FCBGA (35x35) | 1152 | Intel / Altera | Gold | Copper Alloy | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057H3F34I2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 492 | 71250 LAB | 570000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964914 | Active | Metal | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Receptacle, Female Sockets | Olive Drab | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | E | BALL | NOT SPECIFIED | 1 mm | compliant | Olive Drab Cadmium | 40-5 | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | Ground | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H4F34E3LG | ALTERA | Datasheet | 621 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | FBGA-1152 | YES | Flange | Aluminum | 1152 | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H4F34E3LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964935 | Active | Metal | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | B | BALL | NOT SPECIFIED | 1 mm | compliant | Electroless Nickel | 20-4 | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Ground | SoC FPGA | 35 mm | 35 mm |
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