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Embedded - System On Chip (SoC) (30)

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Operating Temperature
Series
Architecture
Connectivity
Core Processor
Flash Size
Number of I/Os
Package / Case
Peripherals
Primary Attributes
RAM Size
Speed

Operating Temperature:
-65°C ~ 175°C

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Mounting Type	Package / Case	Surface Mount	Mounting Feature	Number of Pins	Contact Shape	Shell Material	Supplier Device Package	Insert Material	Number of Terminals	Backshell Material, Plating	Base Product Number	Brand	Clock Frequency-Max	Contact Finish Mating	Contact Materials	Contact Sizes	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Lead Free Status / RoHS Status	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Mfr	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part # Aliases	Part Life Cycle Code	Primary Material	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Unit Weight	Voltage, Rating	Operating Temperature	Packaging	Series	Size / Dimension	Tolerance	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	Termination	Temperature Coefficient	Connector Type	Type	Resistance	Number of Positions	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Composition	Color	Applications	Power (Watts)	HTS Code	Fastening Type	Subcategory	Contact Type	Current Rating (Amps)	Technology	Terminal Position	Orientation	Terminal Form	Shielding	Peak Reflow Temperature (Cel)	Ingress Protection	Terminal Pitch	Reach Compliance Code	Shell Finish	Shell Size - Insert	JESD-30 Code	Number of Outputs	Qualification Status	Housing Color	Operating Supply Voltage	Failure Rate	Power Supplies	Temperature Grade	Note	Speed	RAM Size	Shell Size, MIL	Core Processor	Peripherals	Program Memory Size	Connectivity	Cable Opening	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Product Type	Includes	Speed Grade	Number of Transceivers	Primary Attributes	Number of Registers	Number of CLBs	Number of Logic Cells	Number of Cores	Number of Equivalent Gates	Flash Size	Features	Product Category	Height Seated (Max)	Length	Width	Contact Finish Thickness - Mating	Material Flammability Rating
Mfr Part No 10AS066K2F35E1SG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount, Through Hole	1152-BBGA, FCBGA	YES	Flange			Aluminum	1152-FBGA (35x35)		1152					Gold	Copper Alloy				INTEL CORP				Intel Corporation	10AS066K2F35E1SG			Glenair					396			100 °C		Retail Package	PLASTIC/EPOXY	BGA	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	BGA1152,34X34,40	SQUARE	GRID ARRAY		Obsolete	Metal	Active	NOT SPECIFIED	5.66		Yes		0.93 V	0.87 V	0.9 V				-65°C ~ 175°C	Tray	806			Discontinued at Digi-Key			Solder		Receptacle, Female Sockets								Silver			8542.39.00.01	Threaded	Field Programmable Gate Arrays			CMOS	BOTTOM	D	BALL		NOT SPECIFIED		1 mm	compliant	Electroless Nickel		S-PBGA-B1152	396	Not Qualified				0.9 V	OTHER		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	396		3.5 mm	FIELD PROGRAMMABLE GATE ARRAY					FPGA - 660K Logic Elements			660000			--				35 mm	35 mm
Mfr Part No 10AS066K2F35E1HG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount, Through Hole	1152-BBGA, FCBGA		Flange			Stainless Steel	1152-FBGA (35x35)					Intel / Altera		Gold	Copper Alloy		-	24	INTEL CORP	2 x 32 kB	2 x 32 kB		Intel	10AS066K2F35E1HG	1.2 GHz	+ 100 C	Glenair	0 C	Yes		SMD/SMT	396	82500 LAB	660000 LE			Retail Package							967066	Active	Metal	Active		5.66	Details	Yes	This product may require additional documentation to export from the United States.				Arria 10 SoC			-65°C ~ 175°C	Tray	806			Active			Solder		Plug, Male Pins								Silver				Threaded	SOC - Systems on a Chip					A						unknown	Passivated	25-5					950 mV					1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					SoC FPGA				FPGA - 660K Logic Elements				2 Core		--	Ground	SoC FPGA
Mfr Part No 10AS057H3F34I2LG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount, Through Hole	1152-BBGA, FCBGA	YES	Flange			Aluminum	1152-FCBGA (35x35)		1152			Intel / Altera		Gold	Copper Alloy		-	24	INTEL CORP	2 x 32 kB	2 x 32 kB		Intel	10AS057H3F34I2LG	1.2 GHz		Glenair		Yes		SMD/SMT	492	71250 LAB	570000 LE	100 °C	-40 °C	Retail Package	PLASTIC/EPOXY	BGA	BGA, BGA1152,34X34,40	BGA1152,34X34,40	SQUARE	GRID ARRAY	964914	Active	Metal	Active	NOT SPECIFIED	5.45	Details	Yes	This product may require additional documentation to export from the United States.	0.93 V	0.87 V	0.9 V	Arria 10 SoC			-65°C ~ 175°C	Tray	806			Active			Solder		Receptacle, Female Sockets								Olive Drab			8542.39.00.01	Threaded	SOC - Systems on a Chip			CMOS	BOTTOM	E	BALL		NOT SPECIFIED		1 mm	compliant	Olive Drab Cadmium	40-5	S-PBGA-B1152	492	Not Qualified				0.9 V	INDUSTRIAL		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	492		3.65 mm	FIELD PROGRAMMABLE GATE ARRAY	SoC FPGA				FPGA - 570K Logic Elements			570000	2 Core		--	Ground	SoC FPGA		35 mm	35 mm
Mfr Part No 10AS032H4F34E3LG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount, Through Hole	FBGA-1152	YES	Flange			Aluminum			1152			Intel / Altera		Gold	Copper Alloy		-	1	INTEL CORP	2 x 32 kB	2 x 32 kB		Intel	10AS032H4F34E3LG	1.2 GHz		Glenair		Yes		SMD/SMT	384	40000 LAB	320000 LE	100 °C		Retail Package	PLASTIC/EPOXY	BGA	BGA, BGA1152,34X34,40	BGA1152,34X34,40	SQUARE	GRID ARRAY	964935	Active	Metal	Active	NOT SPECIFIED	5.45	Details	Yes	This product may require additional documentation to export from the United States.	0.93 V	0.87 V	0.9 V	Arria 10 SoC			-65°C ~ 175°C	Tray	806			Active			Solder		Plug, Male Pins								Silver			8542.39.00.01	Threaded	SOC - Systems on a Chip			CMOS	BOTTOM	B	BALL		NOT SPECIFIED		1 mm	compliant	Electroless Nickel	20-4	S-PBGA-B1152	384	Not Qualified				0.9 V	OTHER		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	384		3.65 mm	FIELD PROGRAMMABLE GATE ARRAY	SoC FPGA				FPGA - 320K Logic Elements			320000	2 Core		--	Ground	SoC FPGA		35 mm	35 mm
Mfr Part No 10AS027E1F29E1HG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount, Through Hole	780-BBGA, FCBGA		Flange			Stainless Steel	780-FBGA (29x29)					Intel / Altera		Gold	Copper Alloy		-	36		2 x 32 kB	2 x 32 kB		Intel		1.2 GHz	+ 100 C	Glenair	0 C	Yes		SMD/SMT	360	33750 LAB	270000 LE			Retail Package							965040		Metal	Active			Details						Arria 10 SoC			-65°C ~ 175°C	Tray	806			Active			Solder		Plug, Male Pins								Silver				Threaded	SOC - Systems on a Chip					B							Passivated	22-28					950 mV					1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					SoC FPGA			12 Transceiver	FPGA - 270K Logic Elements				2 Core		--	Ground	SoC FPGA
Mfr Part No A2F500M3G-1PQG208I	Microchip	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount	208-BFQFP	YES	Flange		Circular	Composite	208-PQFP (28x28)	Plastic	208		A2F500		100 MHz			20			MICROSEMI CORP			--	Microsemi Corporation	A2F500M3G-1PQG208I			Microchip Technology			3		MCU - 22, FPGA - 66					Tray	PLASTIC/EPOXY	FQFP	FQFP, QFP208,1.2SQ,20	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH		Active		Active	30	5.59		Yes		1.575 V	1.425 V	1.5 V				-65°C ~ 175°C	Bulk	MIL-DTL-38999 Series III, ACT			Active	--				Receptacle Housing	For Female Sockets		10	Pure Matte Tin (Sn)							8542.39.00.01	Threaded	Field Programmable Gate Arrays	Crimp		CMOS	QUAD	B	GULL WING	Shielded	245	Environment Resistant	0.5 mm	compliant	Chromate over Cadmium	13-98	S-PQFP-G208	66	Not Qualified	Olive Drab			1.5,1.8,2.5,3.3 V		Contacts Not Included	100MHz	64KB	C	ARM® Cortex®-M3	DMA, POR, WDT		Ethernet, I²C, SPI, UART/USART		MCU, FPGA	66	11520 CLBS, 500000 GATES	4.1 mm	FIELD PROGRAMMABLE GATE ARRAY		--	1		ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops		11520	11520		500000	512KB	--			28 mm	28 mm		--
Mfr Part No XCZU19EG-1FFVD1760I	AMD	Datasheet	-	-	Min: 1 Mult: 1	Free Hanging (In-Line)	1760-BBGA, FCBGA		-		Circular	Aluminum Alloy	1760-FCBGA (42.5x42.5)	Plastic			KJB6T					22D											ITT Cannon, LLC					308					Bulk										Active												-65°C ~ 175°C		KJB								Plug Housing	For Male Pins		6									Threaded		Crimp				C		Shielded		Environment Resistant			Cadmium over Electroless Nickel	9-35				Olive Drab					Contacts Not Included	500MHz, 600MHz, 1.2GHz	256KB	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						-			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells						-	Coupling Nut						-
Mfr Part No 10AS066H2F34I1HG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1		Axial						Axial				RN55	Intel / Altera					-	24		2 x 32 kB	2 x 32 kB		Intel		1.2 GHz	+ 100 C	Vishay Dale	- 40 C	Yes		SMD/SMT	492	82500 LAB	660000 LE			Bulk							965020			Active			Details		This product may require additional documentation to export from the United States.				Arria 10 SoC			-65°C ~ 175°C	Tray	Military, MIL-R-10509/7, RN55	0.090 Dia x 0.240 L (2.29mm x 6.10mm)	±1%	Active		2		±50ppm/°C			69.8 Ohms					Metal Film			0.125W, 1/8W			SOC - Systems on a Chip																		950 mV	-				1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					SoC FPGA				FPGA - 660K Logic Elements				2 Core		--	Flame Retardant Coating, Military, Moisture Resistant, Safety	SoC FPGA	-
Mfr Part No 10AS016C4U19I3SG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1		Axial	YES		484			Axial		484			Intel / Altera					-	1	INTEL CORP	2 x 32 kB	2 x 32 kB		Intel	10AS016C4U19I3SG	1.2 GHz	+ 100 C		- 40 C	Yes		SMD/SMT	192	20000 LAB	160000 LE	100 °C	-40 °C		PLASTIC/EPOXY	FBGA	FBGA, BGA484,22X22,32	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	964681	Active			NOT SPECIFIED	1.96	Compliant	Yes		0.93 V	0.87 V	0.9 V	Arria 10 SoC	0.423288 oz		-65°C ~ 175°C	Bulk	Military, MIL-PRF-55182/01, RNC55	0.094 Dia x 0.250 L (2.39mm x 6.35mm)	±0.1%	Active		2		±50ppm/°C			22.6 kOhms			100 °C	-40 °C	Metal Film			0.125W, 1/8W	8542.39.00.01		SOC - Systems on a Chip			CMOS	BOTTOM		BALL		NOT SPECIFIED		0.8 mm	compliant			S-PBGA-B484	192	Not Qualified		1.8 V	P (0.1%)	0.9 V	INDUSTRIAL		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	192		3.25 mm	FIELD PROGRAMMABLE GATE ARRAY	SoC FPGA		3	6 Transceiver	FPGA - 160K Logic Elements	246040		160000	2 Core		--	Military, Moisture Resistant, Weldable	SoC FPGA	--	19 mm	19 mm
Mfr Part No XCZU49DR-1FFVF1760I	Xilinx	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount	1760-BBGA, FCBGA		Bulkhead - Front Side Nut			Aluminum	1760-FCBGA (42.5x42.5)	Thermoplastic		-	TV07RQDZ			Gold	Copper Alloy												Amphenol Aerospace Operations					622					Bulk									Metal	Active											-	-65°C ~ 175°C		MIL-DTL-38999 Series III, Tri-Start™ TV						Crimp		Receptacle, Male Pins			39 (38 + 1 Quadrax)					Black	Aviation, Marine, Military			Threaded			-			N (Normal)		Unshielded		Environment Resistant			Black Zinc Nickel	17-2										500MHz, 1.2GHz	256KB	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-	MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells						-	-					50.0µin (1.27µm)	-

10AS066K2F35E1SG

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10AS066K2F35E1HG

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10AS057H3F34I2LG

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10AS032H4F34E3LG

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Package:Embedded - System On Chip (SoC)

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10AS027E1F29E1HG

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Package:Embedded - System On Chip (SoC)

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A2F500M3G-1PQG208I

Microchip

Package:Embedded - System On Chip (SoC)

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XCZU19EG-1FFVD1760I

AMD

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10AS066H2F34I1HG

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Package:Embedded - System On Chip (SoC)

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10AS016C4U19I3SG

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XCZU49DR-1FFVF1760I

Xilinx

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Embedded - System On Chip (SoC) (30)