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Embedded - System On Chip (SoC) (30)

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Operating Temperature
Series
Architecture
Connectivity
Core Processor
Flash Size
Number of I/Os
Package / Case
Peripherals
Primary Attributes
RAM Size
Speed

Operating Temperature:
-65°C ~ 175°C

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Mounting Type	Package / Case	Surface Mount	Mounting Feature	Contact Shape	Shell Material	Supplier Device Package	Insert Material	Number of Terminals	Backshell Material, Plating	Base Product Number	Brand	Clock Frequency-Max	Contact Finish Mating	Contact Materials	Contact Sizes	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Lead Free Status / RoHS Status	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Mfr	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part # Aliases	Part Life Cycle Code	Primary Material	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Voltage, Rating	Operating Temperature	Packaging	Series	Size / Dimension	Tolerance	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	Termination	Temperature Coefficient	Connector Type	Type	Resistance	Number of Positions	Terminal Finish	Composition	Color	Applications	Power (Watts)	HTS Code	Fastening Type	Subcategory	Contact Type	Current Rating (Amps)	Technology	Terminal Position	Orientation	Terminal Form	Shielding	Peak Reflow Temperature (Cel)	Ingress Protection	Terminal Pitch	Reach Compliance Code	Shell Finish	Shell Size - Insert	JESD-30 Code	Number of Outputs	Qualification Status	Housing Color	Operating Supply Voltage	Failure Rate	Power Supplies	Temperature Grade	Note	Speed	RAM Size	Shell Size, MIL	Core Processor	Peripherals	Program Memory Size	Connectivity	Cable Opening	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Product Type	Includes	Speed Grade	Number of Transceivers	Primary Attributes	Number of CLBs	Number of Logic Cells	Number of Cores	Number of Equivalent Gates	Flash Size	Features	Product Category	Height Seated (Max)	Length	Width	Contact Finish Thickness - Mating	Material Flammability Rating
Mfr Part No 10AS027E1F29E1HG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount, Through Hole	780-BBGA, FCBGA		Flange		Stainless Steel	780-FBGA (29x29)					Intel / Altera		Gold	Copper Alloy		-	36		2 x 32 kB	2 x 32 kB		Intel		1.2 GHz	+ 100 C	Glenair	0 C	Yes		SMD/SMT	360	33750 LAB	270000 LE			Retail Package							965040		Metal	Active			Details						Arria 10 SoC		-65°C ~ 175°C	Tray	806			Active			Solder		Plug, Male Pins						Silver				Threaded	SOC - Systems on a Chip					B							Passivated	22-28					950 mV					1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					SoC FPGA			12 Transceiver	FPGA - 270K Logic Elements			2 Core		--	Ground	SoC FPGA
Mfr Part No XCZU19EG-1FFVD1760I	AMD	Datasheet	-	-	Min: 1 Mult: 1	Free Hanging (In-Line)	1760-BBGA, FCBGA		-	Circular	Aluminum Alloy	1760-FCBGA (42.5x42.5)	Plastic			KJB6T					22D											ITT Cannon, LLC					308					Bulk										Active											-65°C ~ 175°C		KJB								Plug Housing	For Male Pins		6							Threaded		Crimp				C		Shielded		Environment Resistant			Cadmium over Electroless Nickel	9-35				Olive Drab					Contacts Not Included	500MHz, 600MHz, 1.2GHz	256KB	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						-			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					-	Coupling Nut						-
Mfr Part No A2F500M3G-1PQG208I	Microchip	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount	208-BFQFP	YES	Flange	Circular	Composite	208-PQFP (28x28)	Plastic	208		A2F500		100 MHz			20			MICROSEMI CORP			--	Microsemi Corporation	A2F500M3G-1PQG208I			Microchip Technology			3		MCU - 22, FPGA - 66					Tray	PLASTIC/EPOXY	FQFP	FQFP, QFP208,1.2SQ,20	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH		Active		Active	30	5.59		Yes		1.575 V	1.425 V	1.5 V			-65°C ~ 175°C	Bulk	MIL-DTL-38999 Series III, ACT			Active	--				Receptacle Housing	For Female Sockets		10	Pure Matte Tin (Sn)					8542.39.00.01	Threaded	Field Programmable Gate Arrays	Crimp		CMOS	QUAD	B	GULL WING	Shielded	245	Environment Resistant	0.5 mm	compliant	Chromate over Cadmium	13-98	S-PQFP-G208	66	Not Qualified	Olive Drab			1.5,1.8,2.5,3.3 V		Contacts Not Included	100MHz	64KB	C	ARM® Cortex®-M3	DMA, POR, WDT		Ethernet, I²C, SPI, UART/USART		MCU, FPGA	66	11520 CLBS, 500000 GATES	4.1 mm	FIELD PROGRAMMABLE GATE ARRAY		--	1		ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	11520	11520		500000	512KB	--			28 mm	28 mm		--
Mfr Part No XCZU49DR-1FFVF1760I	Xilinx	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount	1760-BBGA, FCBGA		Bulkhead - Front Side Nut		Aluminum	1760-FCBGA (42.5x42.5)	Thermoplastic		-	TV07RQDZ			Gold	Copper Alloy												Amphenol Aerospace Operations					622					Bulk									Metal	Active										-	-65°C ~ 175°C		MIL-DTL-38999 Series III, Tri-Start™ TV						Crimp		Receptacle, Male Pins			39 (38 + 1 Quadrax)			Black	Aviation, Marine, Military			Threaded			-			N (Normal)		Unshielded		Environment Resistant			Black Zinc Nickel	17-2										500MHz, 1.2GHz	256KB	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-	MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-	-					50.0µin (1.27µm)	-
Mfr Part No 10AS066H2F34I1HG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1		Axial					Axial				RN55	Intel / Altera					-	24		2 x 32 kB	2 x 32 kB		Intel		1.2 GHz	+ 100 C	Vishay Dale	- 40 C	Yes		SMD/SMT	492	82500 LAB	660000 LE			Bulk							965020			Active			Details		This product may require additional documentation to export from the United States.				Arria 10 SoC		-65°C ~ 175°C	Tray	Military, MIL-R-10509/7, RN55	0.090 Dia x 0.240 L (2.29mm x 6.10mm)	±1%	Active		2		±50ppm/°C			69.8 Ohms			Metal Film			0.125W, 1/8W			SOC - Systems on a Chip																		950 mV	-				1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					SoC FPGA				FPGA - 660K Logic Elements			2 Core		--	Flame Retardant Coating, Military, Moisture Resistant, Safety	SoC FPGA	-
Mfr Part No 10AS048K3F35I2SG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1		Axial	YES				Axial		1152		RNC60	Intel / Altera					-	1	INTEL CORP	2 x 32 kB	2 x 32 kB		Intel	10AS048K3F35I2SG	1.2 GHz		Vishay Dale		Yes		SMD/SMT	396	60000 LAB	480000 LE	100 °C	-40 °C	Tape & Reel (TR)	PLASTIC/EPOXY	BGA	BGA, BGA1152,34X34,40	BGA1152,34X34,40	SQUARE	GRID ARRAY	965306	Active		Active	NOT SPECIFIED	5.47	Details	Yes	This product may require additional documentation to export from the United States.	0.93 V	0.87 V	0.9 V	Arria 10 SoC		-65°C ~ 175°C	Tray	Military, MIL-PRF-55182/03, RNC60	0.097 Dia x 0.280 L (2.46mm x 7.11mm)	±0.1%	Active		2		±50ppm/°C			124 Ohms			Metal Film			0.25W, 1/4W	8542.39.00.01		SOC - Systems on a Chip			CMOS	BOTTOM		BALL		NOT SPECIFIED		1 mm	compliant			S-PBGA-B1152	396	Not Qualified			M (1%)	0.9 V	INDUSTRIAL		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	396		3.5 mm	FIELD PROGRAMMABLE GATE ARRAY	SoC FPGA				FPGA - 480K Logic Elements		480000	2 Core		--	Military, Moisture Resistant, Weldable	SoC FPGA	-	35 mm	35 mm
Mfr Part No 10AS022E3F29E2SG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Free Hanging (In-Line)	FBGA-780	YES	-		Composite		Thermoplastic	780	-	D38999/26JH	Intel / Altera		Gold	Copper Alloy		-	1	INTEL CORP	2 x 32 kB	2 x 32 kB		Intel	10AS022E3F29E2SG	1.2 GHz		TE Connectivity Deutsch Connectors		Yes		SMD/SMT	288	27500 LAB	220000 LE	100 °C		Bulk	PLASTIC/EPOXY	BGA	BGA, BGA780,28X28,40	BGA780,28X28,40	SQUARE	GRID ARRAY	973473	Active	Composite	Discontinued at Digi-Key	NOT SPECIFIED	5.46	Non-Compliant	Yes	This product may require additional documentation to export from the United States.	0.93 V	0.87 V	0.9 V	Arria 10 SoC	-	-65°C ~ 175°C	Tray	Military, MIL-DTL-38999 Series III, ACT			Active			Crimp		Plug, Female Sockets			55			Olive Drab	Aerospace, Military		8542.39.00.01	Threaded	SOC - Systems on a Chip		7.5A	CMOS	BOTTOM	B	BALL	Shielded	NOT SPECIFIED	Environment Resistant	1 mm	compliant	Olive Drab Cadmium	23-55	S-PBGA-B780	288	Not Qualified				0.9 V	OTHER		1.5GHz	256KB	H	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-	MCU, FPGA	288		3.35 mm	FIELD PROGRAMMABLE GATE ARRAY	SoC FPGA				FPGA - 220K Logic Elements		220000	2 Core		--	-	SoC FPGA		29 mm	29 mm	50.0µin (1.27µm)	-
Mfr Part No 10AS066H2F34E1SG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1		Axial	YES				Axial		1152		ERC50								INTEL CORP				Intel Corporation	10AS066H2F34E1SG			Vishay Dale					492			100 °C		Tape & Reel (TR)	PLASTIC/EPOXY	BGA	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	BGA1152,34X34,40	SQUARE	GRID ARRAY		Obsolete		Active	NOT SPECIFIED	5.15		Yes		0.93 V	0.87 V	0.9 V			-65°C ~ 175°C	Tray	ERC	0.070 Dia x 0.150 L (1.78mm x 3.81mm)	±1%	Discontinued at Digi-Key		2		±50ppm/°C			19.1 Ohms			Metal Film			0.1W, 1/10W	8542.39.00.01		Field Programmable Gate Arrays			CMOS	BOTTOM		BALL		NOT SPECIFIED		1 mm	compliant			S-PBGA-B1152	492	Not Qualified			-	0.9 V	OTHER		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	492		3.65 mm	FIELD PROGRAMMABLE GATE ARRAY					FPGA - 660K Logic Elements		660000			--	Moisture Resistant		-	35 mm	35 mm
Mfr Part No 10AS032H2F35I1SG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1		Axial	YES				Axial		1152		RNC55								INTEL CORP				Intel Corporation	10AS032H2F35I1SG			Vishay Dale					384			100 °C	-40 °C	Tape & Reel (TR)	PLASTIC/EPOXY	BGA	35 X 35 MM, ROHS COMPLIANT, FBGA-1152		SQUARE	GRID ARRAY		Obsolete		Active		5.66	Non-Compliant	Yes		0.93 V	0.87 V	0.9 V			-65°C ~ 175°C	Tray	Military, MIL-PRF-55182/01, RNC55	0.094 Dia x 0.250 L (2.39mm x 6.35mm)	±1%	Discontinued at Digi-Key		2		±50ppm/°C			10 Ohms			Metal Film			0.125W, 1/8W	8542.39.00.01						BOTTOM		BALL				1 mm	compliant			S-PBGA-B1152					R (0.01%)		INDUSTRIAL		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			3.5 mm	FIELD PROGRAMMABLE GATE ARRAY					FPGA - 320K Logic Elements					--	Military, Moisture Resistant, Weldable		-	35 mm	35 mm
Mfr Part No 10AS057K3F35E2SG	ALTERA	Datasheet	-	-	Min: 1 Mult: 1	Panel Mount	1152-BBGA, FCBGA	YES	Bulkhead - Front Side Nut		Composite	1152-FCBGA (35x35)	Thermoplastic	1152	-	ACT94			Gold	Copper Alloy				INTEL CORP				Intel Corporation	10AS057K3F35E2SG			TE Connectivity Deutsch Connectors					396			100 °C		Bulk	PLASTIC/EPOXY	BGA	BGA, BGA1152,34X34,40	BGA1152,34X34,40	SQUARE	GRID ARRAY		Active	Composite	Discontinued at Digi-Key	NOT SPECIFIED	5.45		Yes		0.93 V	0.87 V	0.9 V		-	-65°C ~ 175°C	Tray	MIL-DTL-38999 Series III, ACT			Active			Crimp		Receptacle, Female Sockets			32			Olive Drab	Aerospace, Military		8542.39.00.01	Threaded	Field Programmable Gate Arrays		7.5A	CMOS	BOTTOM	A	BALL	Shielded	NOT SPECIFIED	Environment Resistant	1 mm	compliant	Olive Drab Cadmium	19-32	S-PBGA-B1152	396	Not Qualified				0.9 V	OTHER		1.5GHz	256KB	F	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-	MCU, FPGA	396		3.5 mm	FIELD PROGRAMMABLE GATE ARRAY					FPGA - 570K Logic Elements		570000			--	-			35 mm	35 mm	-	-

10AS027E1F29E1HG

ALTERA

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCZU19EG-1FFVD1760I

AMD

Package:Embedded - System On Chip (SoC)

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A2F500M3G-1PQG208I

Microchip

Package:Embedded - System On Chip (SoC)

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XCZU49DR-1FFVF1760I

Xilinx

Package:Embedded - System On Chip (SoC)

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10AS066H2F34I1HG

ALTERA

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10AS048K3F35I2SG

ALTERA

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10AS022E3F29E2SG

ALTERA

Package:Embedded - System On Chip (SoC)

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10AS066H2F34E1SG

ALTERA

Package:Embedded - System On Chip (SoC)

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10AS032H2F35I1SG

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Package:Embedded - System On Chip (SoC)

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10AS057K3F35E2SG

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Package:Embedded - System On Chip (SoC)

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Embedded - System On Chip (SoC) (30)